A device module (100) and method for connection to a textile fabric (50) with electrically conductive threads (51, 52) to provide a fabric layer assembly (150). The device module (100) comprises a flexible foil (10) and a thermoplastic layer (20) to enable a mechanical connection (M) between the flexible foil (10) and the textile fabric (50). The device module (100) has an outer circumference (C) comprising inward notches (N1,N2) configured as anchor points for respective conductive threads (51, 52) for holding and guiding the conductive threads (51,52) over and in contact with the respective conductive areas (11, 12) for providing the respective electrical connections (E1,E2) while the mechanical connection (M) by the thermoplastic layer (20) is established.

The present invention addresses the problem of reducing a delay time difference between signals transmitted by means of a differential signal wires in a wiring board having glass cloth. A wiring board comprises: an insulating layer which includes fibers having a planar shape with translational symmetry with respect to two linearly independent, predetermined translational vectors, and a layer-like insulating material encapsulating the fibers; and through-holes formed at the starting and end points of a vector which is the sum of substantially integral multiples of the two translational vectors and which has the starting point on the planar shape.

A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 m, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

Once variation of a method for producing a smart yarn includes: advancing a set of wires into an assembly field; at each sensor site in a series of sensor sites along the set of wires, depositing solder paste onto the set of wires at the sensor site, placing a sensor into the solder paste on the set of wires at the sensor site, and heating the set of wires within the assembly field to reflow the solder paste; wrapping fibers around the set of wires and sensors arranged along the set of wires to form a continuous length of the smart yarn; separating a first segment of the smart yarn from the continuous length of the smart yarn; and weaving the first segment of the smart yarn into a garment.

Provided is a resin composition, a prepreg for a printed circuit and a metal-coated laminate. The resin composition includes: a silicone aryne resin, a polyphenylene ether resin with unsaturated bonds, and a butadiene polymer. The resin composition is used such that the prepared metal-coated laminate can have at least one of the following characteristics: a low dielectric loss factor, high heat resistance, and a low coefficient of thermal expansion.

An electronic printed circuit board structure for mitigating conductive anodic filament growth. The structure includes at least two conductive layers and a dielectric layer sandwiched between the conductive layers. At least one hole extends through the dielectric layer, and a layer of nonconductive material covers the at least one hole, wherein the nonconductive material is glass-free. A conductive plate layer is disposed over the nonconductive material layer to form a via connection in the structure.

A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 ?m, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

Provided are a surface-treated glass cloth capable of enhancing insulation reliability when used to prepare a prepreg, a prepreg and a printed wiring board using the surface-treated glass cloth. The surface-treated glass cloth includes a surface treatment layer on a surface, a glass constituting the glass cloth has a composition containing 52.0 to 60.0 mass % of SiO.sub.2, 15.0 to 26.0 mass % of B.sub.2O.sub.3, 9.0 to 18.0 mass % of Al.sub.2O.sub.3, 1.0 to 8.0 mass % of MgO, 1.0 to 10.0 mass % of CaO, 0 to 6.0 mass % of SrO, 0 to 6.0 mass % of TiO.sub.2, and 0.1 to 3.0 mass % in total of F.sub.2 and Cl.sub.2, based on the total amount of the glass, the glass cloth has a surface coverage of 75.0 to 100.0% and a thickness of 8 to 95 ?m, and the surface treatment layer contains a silane coupling agent having a methacrylic group and contains no surfactant.

A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 10.sup.6 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/? C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

Provided is a glass fabric formed by weaving warp and weft glass yarns comprising a plurality of glass filaments, wherein the surface of the glass fabric is subjected to surface treatment with a surface treatment agent, and the difference between the dielectric loss tangent and the bulk dielectric loss tangent of the glass fabric as measured by using a split cylinder resonator is greater than 0 and not more than 1.0?10.sup.?3 at 10 GHz.