Examples are disclosed herein that relate to electronically functional textile articles. One example provides a knitted textile article comprising a first conductive thread and a second conductive thread knit into the article in such a manner as to form a conductive junction separated by a gap. The knitted textile article further comprises a knitted surface texture feature formed at a location that defines an opening over the gap, and an electronic component connecting the gap to form a circuit with the first conductive thread and the second conductive thread.

Disclosed are embodiments of fire resistant display components, systems and associated methods. The system comprises a plurality of light emitting display modules, each display module being constructed to have improved fire resistance as measured by one or more fire performance characteristics including heat release, smoke density, smoke toxicity, flame spread or drip.

A spar (2) is formed by stacking a signal-line layer (52), which includes a resin layer (521) having a plurality of signal lines (522) embedded therein, on a carbon-fiber prepreg (51).

Even when a stiffener is omitted, the semiconductor device which can prevent the generation of twist and distortion of a wiring substrate is obtained. As for a semiconductor device which has a wiring substrate, a semiconductor chip by which the flip chip bond was made to the wiring substrate, and a heat spreader adhered to the back surface of the semiconductor chip, and which omitted the stiffener for reinforcing a wiring substrate and maintaining the surface smoothness of a heat spreader, a wiring substrate has a plurality of insulating substrates in which a through hole whose diameter differs, respectively was formed, and each insulating substrate contains a glass cloth.

This disclosure relates to a curable composition that includes at least one poly(arylene ether) copolymer, at least one phosphorus-containing flame retardant, and at least one radical initiator. This disclosure also relates to using the composition to form a film, a laminate, a prepreg, and/or a circuit board.

The present invention relates to a laminate including two or more layers of a composite layer including a fiber substrate and a cured product of a thermosetting resin composition, the two or more layers of the composite layer including one or more layer of a composite layer (X) and one or more layer of a composite layer (Y), the composite layer (X) being a layer including a first fiber substrate constituted by first glass fibers, the composite layer (Y) being a layer including a second fiber substrate constituted by second glass fibers, and the second glass fibers having a higher tensile elastic modulus at 25? C. than the first glass fibers, a printed wiring board including the laminate, a semiconductor package, and a method for producing a laminate.

A first embodiment of a substrate for a high-frequency printed wiring board according to the present disclosure is directed to a substrate for a high-frequency printed wiring board, the substrate including: a dielectric layer including a fluororesin and an inorganic filler; and a copper foil layered on at least one surface of the dielectric layer, wherein a surface of the copper foil at the dielectric layer side has a maximum height roughness (Rz) of less than or equal to 2 ?m, and a ratio of the number of inorganic atoms of the inorganic filler to the number of fluorine atoms of the fluororesin in a superficial region of the dielectric layer at the copper foil side is less than or equal to 0.08.

A system includes: a printed circuit board having a plurality of conductive traces; a processing device coupled to the printed circuit board and in electrical communication with the plurality of conductive traces; a first memory module and a second memory module in electrical communication with the plurality of conductive traces and sharing channels of the conductive traces, wherein the first memory module is physically more proximate to the processing device than is the second memory module; and an electronic band gap (EBG) structure physically disposed in an area between the first memory module and the second memory module.

A halogen-free resin composition and a prepreg and a laminate prepared therefrom. The halogen-free resin composition comprises the following ingredients in parts by weight: 50-100 parts of an epoxy resin, 20-70 parts of benzoxazine, 5-40 parts of polyphenyl ether, 5-30 parts of styrene-maleic anhydride, 5-40 parts of a halogen-free flame retardant, 0.2-5 parts of a curing accelerator, and 20-100 parts of a filler. The prepreg and the laminate, which are manufactured from the halogen-free resin composition, have the comprehensive properties of low dielectric constant, low dielectric loss, excellent heat resistance, adhesive property and wet resistance and the like, and are suitable for being applied to halogen-free high-frequency multilayer circuit boards.

A substrate includes an insulation layer including a glass cloth impregnated with a resin, and a through hole having a hole included in the insulation layer and plating formed in an inner surface of the hole, where a location, intersecting with the glass cloth, of an outer circumferential portion of the through hole has a recessed portion recessed toward an outside of the hole.