Disclosed is a resin composition containing phosphonate and polyphenylene oxide (PPO) oligomers/polymers useful for coating prepregs used to make copper clad laminates used in printed circuit boards. The compositions contain crosslinking agents used to ensure a dense crosslink network as demonstrated by high glass transition temperatures (Tg's).

The present disclosure provides a polymer matrix composite, and a laminate, a prepreg and a printed circuit board using the same. The polymer matrix composite includes a polymeric resin and a non-woven reinforcing material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003. The printed circuit board uses the laminate including the polymer matrix as a core layer which is sandwiched between at least two outer layers.

A printed wiring board having a sheet material including a cloth-like material woven of reinforced fiber. An angle between a warp thread and a weft thread of the reinforced fiber of the sheet material is 90 degrees. In the sheet material, threads configuring the cloth-like material are cut so that one side of a circumferential edge portion of the sheet material is tilted leftward or rightward at an angle no smaller than 5 degrees and no larger than 30 degrees and a length of a cut portion obtained by cutting out the cloth-like-material configuration threads aligned on a cutting blade with the cutting blade is longer by 0.3 mm to 6.3 mm than a total length of a clearance between an upper blade and a lower blade configuring the cutting blade for cutting the cloth-like material and a thickness of the cloth-like-material configuration threads aligned on the cutting blade.

A phosphor substrate having a plurality of light emitting elements mounted on one surface, and includes an insulating substrate, a first electrode group which is disposed on one surface of the insulating substrate and includes a plurality of electrodes bonded to the plurality of light emitting elements, and a phosphor layer which is disposed on one surface of the insulating substrate and includes a phosphor in which a light emission peak wavelength, in a case where light emitted by the light emitting element is used as excitation light, is in a visible light region, and the insulating substrate contains a bismaleimide resin and glass cloth.

A homogeneous composite substrate includes a woven cloth and at least one fiber membrane. The woven cloth includes a plurality of first fibers. The fiber membrane is disposed on at least one surface of the woven cloth, and the fiber membrane includes a plurality of second fibers, in which a material of the first fibers and a material of the second fibers are the same, a fiber diameter of each first fiber is larger than or equal to 20 ?m and smaller than or equal to 130 ?m, and a fiber diameter of each second fiber is larger than or equal to 3 ?m and smaller than or equal to 10 ?m.

A low dielectric substrate for high-speed millimeter-wave communication includes a quartz glass cloth with a dielectric loss tangent of 0.0001 to 0.0015 and a dielectric constant of 3.0 to 3.8 at 10 GHz, and an organic resin with a dielectric loss tangent within 80% to 150% of the dielectric loss tangent of the quartz glass cloth at 10 GHz and a dielectric constant within 50% to 110% of the dielectric constant of the quartz glass cloth at 10 GHz. This provides a low dielectric substrate for high-speed millimeter-wave communication where the low dielectric substrate makes it possible to send signals that are stable and have excellent quality with no difference in propagation time between wirings even if the substrate has an uneven resin distribution and the quartz glass cloth above and below the wirings, and the difference in dielectric loss tangent between members has been reduced to lower transmission loss.

Induction cooking hob comprising at least one first board element (18) and at least one second board element (16), wherein the first board element (18) and at least one second board element (16) each comprise at least one or more electrical and/or electronical component(s), wherein the first board element (18) is electrically coupled to the second board element (16) and wherein the first board element (18) is directly mechanically coupled to the second board element (16.

A circuit board includes at least one prepreg including a fiber layer, the fiber layer being woven with a plurality of first fibers arranged in a first direction and a plurality of second fibers arranged in a second direction that is substantially perpendicular to the first direction, and a circuit layer on at least one of opposite surfaces of the at least one prepreg. The at least one prepreg has a length in the first direction greater than a length in the second direction, each of the plurality of first fibers is formed of or includes a filling yarn, and each of the plurality of second fibers is formed of or includes a warp yarn.

A system comprises an article comprising one or more fabric layers, a plurality of electronic devices, each being incorporated into or onto one of the one or more fabric layers, and one or more communication links between two or more of the plurality of electronic devices. Each of the plurality of electronic devices can comprise a flexible substrate coupled to the fabric layer, one or more metallization layers deposited on the flexible substrate, and one or more electronic components electrically coupled to the one or more metallization layers.

A method for removing a metal from a single-thread fabric for making a pattern, characterized in that said single-thread fabric is a square-mesh metallized and etching laser made fabric.