A fluororesin composition containing a melt moldable fluororesin and a silica, wherein the fluororesin has 25 or more carbonyl group-containing functional groups per 10.sup.6 main-chain carbon atoms; the silica is a spherical silica; and the fluororesin composition has a linear expansion coefficient of 100 ppm/° C. or lower. Also disclosed is a fluororesin sheet including the fluororesin composition, a laminate including a copper foil layer and a layer including the fluororesin composition and a substrate for circuits including a copper foil layer and a layer including the fluororesin composition.

The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO.sub.2≤60, 25≤B.sub.2O.sub.3≤45, 0<Al.sub.2O.sub.3≤18, 0<R.sub.2O≤5, and 0≤RO≤12, and satisfies at least one of: i) SiO.sub.2+B.sub.2O.sub.3≥80 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9; and ii) SiO.sub.2+B.sub.2O.sub.3≥78, SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9, and 0<RO<10. Another glass composition provided includes SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, R.sub.2O, and 3<RO<8 at the same contents as the above, and satisfies SiO.sub.2+B.sub.2O.sub.3≥75 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3<97, where R.sub.2O═Li.sub.2O+Na.sub.2O+K.sub.2O and RO═MgO+CaO+SrO.

A printed circuit board includes a first substrate portion including a first insulating layer and a first wiring layer; and a second substrate portion disposed on the first substrate portion and including a second insulating layer, a pad disposed on the second insulating layer, and a first via penetrating through the second insulating layer and connecting the first wiring layer and the pad to each other. The first via has a boundary with each of the first wiring layer and the pad, and includes a first metal layer and a second metal layer disposed on different levels.

An electronic-grade glass fiber composition includes the following components with corresponding amounts by weight percentages 51.0-57.5% SiO.sub.2, 11.0-17.0% Al.sub.2O.sub.3, >4.5% and ≤6.4% B.sub.2O.sub.3, 19.5-24.8% CaO, 0.1-1.9% MgO, 0.05-1.2% R.sub.2O=Na.sub.2O+K.sub.2O+Li.sub.2O, 0.05-0.8% Fe.sub.2O.sub.3, 0.01-1.0% TiO.sub.2, and 0.01-1.0% F.sub.2. A weight percentage ratio C1=SiO.sub.2/B.sub.2O.sub.3 is 8.1-12.7, a weight percentage ratio C2=B.sub.2O.sub.3/(R.sub.2O+MgO) is 1.7-6.3, and a total weight percentage of the above components is greater than or equal to 99%.

The casing of an electronic control device includes a casing-side contact surface in contact with the end of a printed-circuit board. A cover includes a cover-side contact surface holding the end of the printed-circuit board together with the casing-side contact surface by being in contact with the end of the printed-circuit board. In the printed-circuit board, a held portion held between the casing-side contact surface and the cover-side contact surface is provided with a through-hole via.

One variation of a method for producing a smart yarn includes: aligning a set of sensing elements offset along a lateral axis in a magazine, wherein each sensing element in the set of sensing elements includes a sensor, a first conductive lead extending from a first side of the sensor along a longitudinal axis perpendicular to the lateral axis, and a second conductive lead extending from a second side of the sensor opposite the first side and along the longitudinal axis; wrapping a set of fibers into a yarn within a wrapping field; feeding a leading end of a first sensing element, in the set of sensing elements, from the magazine into the wrapping field; releasing the first sensing element from the magazine into the wrapping field; encasing the first sensing element between the set of fibers within the yarn; and repeating this process for the set of sensing elements.

The present disclosure provides a novel glass composition that has a low permittivity and is suitable for mass production. A glass composition provided satisfies, in wt %, for example, 40≤SiO.sub.2≤60, 25≤B.sub.2O.sub.3≤45, 0<Al.sub.2O.sub.3≤18, 0<R.sub.2O≤5, and 0≤RO≤12, and satisfies at least one of: i) SiO.sub.2+B.sub.2O.sub.3≥80 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9; and ii) SiO.sub.2+B.sub.2O.sub.3≥78, SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3≤99.9, and 0<RO<10. Another glass composition provided includes SiO.sub.2, B.sub.2O.sub.3, Al.sub.2O.sub.3, R.sub.2O, and 3<RO<8 at the same contents as the above, and satisfies SiO.sub.2+B.sub.2O.sub.3≥75 and SiO.sub.2+B.sub.2O.sub.3+Al.sub.2O.sub.3<97, where R.sub.2O=Li.sub.2O+Na.sub.2O+K.sub.2O and RO=MgO+CaO+SrO.

Various embodiments of the present disclosure are directed to electrically conductive connection between a first electrically conductive element and a second electrically conductive element on a textile carrier material. In one example embodiment, the electrically conductive connection includes an electrically conductive thermal transfer adhesive arranged on the carrier material and creates an electrically conductive connection between the first conductive element and the second conductive element. The electrically conductive connection is positioned in electrically conductive contact with the first conductive element and the second conductive element.

A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.

Provided are an insulating material for a circuit substrate, which has excellent dielectric characteristics in a high frequency area, has low coefficients of linear thermal expansion all in a MD direction, a TD direction, and a ZD direction, is easily manufactured and has excellent productivity, and a method for manufacturing the same and a metal foil-clad laminate. An insulating material for a circuit substrate, comprising a laminate having a thermoplastic liquid crystal polymer film and a woven fabric of an inorganic fiber, wherein the thermoplastic liquid crystal polymer film contains an inorganic filler, and the laminate is a dry laminate in which the thermoplastic liquid crystal polymer film and the woven fabric are thermocompression bonded.