The present disclosure relates to an integrally formed product including a metal and a fiber of biological origin disposed in dispersed state in the metal. A proportion by mass of the fiber of biological origin contained in the integrally formed product is within a range of 0.02 mass % or more and 10 mass % or less.

The present disclosure provides a polymer matrix composite, and a laminate, a prepreg and a printed circuit board using the same. The polymer matrix composite includes a polymeric resin and a non-woven inorganic material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003. The printed circuit board uses the laminate including the polymer matrix as a core layer which is sandwiched between at least two outer layers.

A fluoride-based resin prepreg and a circuit substrate using the same are provided. The fluoride-based resin prepreg includes 100 PHR of a fluoride-based resin and 20 to 110 PHR of an inorganic filler. Based on a total weight of the fluoride-based resin, the fluoride-based resin includes 10 to 80 wt % of polytetrafluoroethylene (PTFE), 10 to 50 wt % of fluorinated ethylene propylene (FEP), and 0.1 to 40 wt % of perfluoroalkoxy alkane (PFA). The circuit substrate includes a fluoride-based resin substrate and a circuit layer that is formed on the fluoride-based resin substrate.

A prepreg is provided. The prepreg is prepared by impregnating a liquid crystal polymer non-woven fabric with a thermal-curable resin composition or by coating a thermal-curable resin composition onto a liquid crystal polymer non-woven fabric and drying the impregnated or coated liquid crystal polymer non-woven fabric, wherein the thermal-curable resin composition includes: (A) an unsaturated monomer; and (B) a cyclic olefin copolymer including the following repeating units: (B-1) a repeating unit of formula (I), ##STR00001## (B-2) a repeating unit of formula (II), ##STR00002##
and (B-3) a repeating unit of formula (III), ##STR00003## R.sup.1 to R.sup.22, m, n, o, and p in formulas (I) to (III) are as defined in the specification, wherein based on the total moles of the repeating units (B-1) to (B-3), the content of the repeating unit (B-2) is 19 mol % to 36 mol %, and wherein the weight ratio of the cyclic olefin copolymer (B) to the unsaturated monomer (A) is 0.5 to 7.

A metal-clad laminate is provided. The metal-clad laminate includes: a dielectric layer, which has a first reinforcing material and a dielectric material formed on the surface of the first reinforcing material, wherein the dielectric material includes 60 wt % to 80 wt % of a first fluoropolymer and 20 wt % to 40 wt % of a first filler; an adhesive layer, which is disposed on at least one side of the dielectric layer and includes an adhesive material, wherein the adhesive material has 60 wt % to 70 wt % of a second fluoropolymer and 30 wt % to 40 wt % of a second filler; and a metal foil, which is disposed on the other side of the adhesive layer that is opposite to the dielectric layer, wherein the melting point of the second fluoropolymer is lower than the melting point of the first fluoropolymer.

A thermosetting resin composition and a prepreg and a metal foil-covered laminate made using same, the thermosetting resin composition comprising component (A): a solvent-soluble polyfunctional vinyl aromatic copolymer, the copolymer being a poly-functional vinyl aromatic copolymer having a stoctoal unit derived from monomers comprising divinyl aromatic compound (a) and ethyl vinyl aromatic compound (b); and component (B): a vinyl-containing organic silicone resin. The prepreg and metal foil-covered laminate made from the thermosetting resin composition have good toughness, and maintain a high glass transition temperature, a low water absorption, dielectric properties and humidity resistance, being suitable for the field of high-frequency and high-speed printed circuit boards and the processing of multilayer printed circuit boards.

The present invention relates to a patterned fiber substrate comprising: a fiber substrate; and a pattern consisting of a functional material and formed on the fiber substrate, wherein at least a part of the functional material that constitutes the pattern is present in inside of the fiber substrate, the fiber substrate has a contact angle of 100 to 170° with pure water on its surface, and the pattern has a narrowest line width of 1 to 3000 μm.

An aramid paper suitable for use in electronic applications which has a density of 0.20-0.65 g/cm3 and a grammage of 30-280 g/m2, which paper comprises 10-40 wt. % of aramid shortcut with a linear density of 2.6 dtex or lower and a length of 0.5-25 mm and 10-90 wt. % of aramid fibrid, wherein the aramid shortcut comprises at least 70 wt. % para-aramid shortcut and the aramid fibrid including at least 70 wt. % para-aramid fibrid. It has been found that the use of a paper with the above properties in electronic applications ensures a low CTE in combination with good homogeneity and a good dimensional stability resulting from good resin adhesion and penetration. Use of the aramid paper in a composite sheet including at least one layer of aramid paper and a resin, or in a substrate board for electronic applications.

A polyphenylene ether resin composition includes a modified polyphenylene ether copolymer, a high-molecular-weight compound, and a crosslinking agent for the modified polyphenylene ether copolymer. The modified polyphenylene ether copolymer includes a substituent having a carbon-carbon unsaturated double bond at a molecular chain end of the modified polyphenylene ether copolymer. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20° C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. The crosslinking agent includes at least two carbon-carbon unsaturated double bonds per molecule, and includes at least one of dicyclopentadiene acrylate and dicyclopentadiene methacrylate. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.

A wiring board includes a first wiring layer formed on one surface of a core layer, a first insulating layer formed on the one surface of the core layer so as to cover the first wiring layer, a via wiring embedded in the first insulating layer, a second wiring layer formed on a first surface of the first insulating layer, and a second insulating layer thinner than the first insulating layer formed on the first surface of the first insulating layer so as to cover the second wiring layer. The first wiring layer comprises a pad and a plane layer provided around the pad. One end surface of the via wiring is exposed from the first surface of the first insulating layer and directly bonded to the second wiring layer. The other end surface of the via wiring is directly bonded to the pad in the first insulating layer.