In an embodiment the dielectric layer comprises a fluoropolymer, a plurality of boron nitride particles, a plurality of titanium dioxide particles, a plurality of silica particles; and a reinforcing layer. The dielectric layer can comprise at least one of 20 to 45 volume percent of the fluoropolymer, 15 to 35 volume percent of the plurality of boron nitride particles, 1 to 32 volume percent of the plurality of titanium dioxide particles, 10 to 35 volume percent of the plurality of silica particles, and 5 to 15 volume percent of the reinforcing layer; wherein the volume percent values are based on a total volume of the dielectric layer.

The present disclosure provides a polymer matrix composite, and a laminate, a prepreg and a printed circuit board using the same. The polymer matrix composite includes a polymeric resin and a non-woven reinforcing material having a dielectric constant of from about 1.5 to about 4.8 and a dissipation factor at 10 GHz below 0.003. The printed circuit board uses the laminate including the polymer matrix as a core layer which is sandwiched between at least two outer layers.

A modified polyphenylene ether according to one aspect of the invention has an intrinsic viscosity, as measured in 25 C. methylene chloride, of from 0.03 to 0.12 dL/g, has on molecular ends thereof an average of 1.5 to 3 groups represented by formula (1) below per molecule, and includes not more than 5 mass % of a high-molecular-weight component having a molecular weight of 13,000 or more. ##STR00001##
In formula (1), R.sup.1 is a hydrogen atom or an alkyl group of 1 to 10 carbons, and R.sup.2 is an alkylene group of 1 to 10 carbons.

An ink layer of an electrically conductive ink is formed on a sheet-like base and then the base is bent-deformed before the ink layer is cured, followed by curing the ink layer, thereby forming wiring. The ink layer is pliable during the bending deformation of the base, preventing breakage of the ink layer associated with the bending deformation of the base, and preventing damage to the wiring even when the wiring is finely formed.

A polyphenylene ether resin composition contains a modified polyphenylene ether copolymer and a high-molecular-weight compound. The modified polyphenylene ether copolymer is obtained by modifying a polyphenylene ether copolymer at a phenolic hydroxy group of a molecular chain end with a substituent having a carbon-carbon unsaturated double bond. The high-molecular-weight compound has a glass transition temperature (Tg) measured by differential scanning calorimetry of 20 C. or lower and has a number-average molecular weight Mn ranging from 1000 to 10000, inclusive. In a cured state of the polyphenylene ether resin composition, the modified polyphenylene ether copolymer is phase separated from the high-molecular-weight compound.

Dielectric materials including non-woven inorganic fabrics impregnated with a low-density resin are disclosed. The dielectric materials may have a thickness in a range of about 5 to about 125 microns for use in printed circuit boards.

Provided is a wearable device and a method of manufacturing the same. The wearable device includes: a wearable flexible printed circuit board having a circuit pattern formed on a base substrate having flexibility, air-permeability, and waterproofness; and a functional module mounted on the wearable flexible printed circuit board.

Provided are: a resin-containing sheet in which not only the mechanical strength of a cellulose nanofiber nonwoven fabric but also the flexural resistance of a substrate are improved; and a structure and a wiring board which include the same. The resin-containing sheet includes: a specific cellulose nanofiber nonwoven fabric (11); a fixing agent (2) which fixes together fibers (1) in the cellulose nanofiber nonwoven fabric (11); and a resin (3) which is in contact with the cellulose nanofiber nonwoven fabric (11) and the fixing agent (2), wherein the storage modulus of the fixing agent (2) is higher than that of the resin (3). The structure is obtained by tightly adhering the resin-containing sheet to a substrate. The wiring board includes this structure.

A film material includes a substrate and a film layer arranged on one main surface of the substrate. The film layer contains a fibrous first resin and a thermosetting second resin in an uncured or semi-cured state, and a linear expansion coefficient CF of the first resin is smaller than a linear expansion coefficient CR of the second resin in cured state.

A method and an arrangement are disclosed for producing an electrically conductive pattern on a surface. Electrically conductive solid particles are transferred onto an area of predetermined form on a surface of a substrate. The electrically conductive solid particles are heated to a temperature that is higher than a characteristic melting point of the electrically conductive solid particles, thus creating a melt. The melt is pressed against the substrate in a nip, wherein a surface temperature of a portion of the nip that comes against the melt is lower than said characteristic melting point.