An apparatus is provided with a component configured with an interface comprising a resilient material. In a first state, the component is mechanically and/or electrically attached to a substrate. Exposure of the interface to the temperature that meets or exceeds the transition temperature of interface causes the resilient material to undergo a state change. The state change of the interface alters the position of the component, including separation of the component from the substrate. The separation disrupts the attachment thereby mitigating damage to the substrate and/or component.

Systems and processes that integrate thermoplastic and shape memory alloy materials to form an adaptive composite structure capable of changing its shape. For example, the adaptive composite structure may be designed to serve as a multifunctional adaptive wing flight control surface. Other applications for such adaptive composite structures include in variable area fan nozzles, winglets, fairings, elevators, rudders, or other aircraft components having an aerodynamic surface whose shape is preferably controllable. The material systems can be integrated by means of overbraiding (interwoven) with tows of both thermoplastic and shape memory alloy materials or separate layers of each material can be consolidated (e.g., using induction heating) to make a flight control surface that does not require separate actuation.

Discussed is a flexible printed circuit board for overcurrent protection including a deformation layer formed between a first adhesive layer and a first polyimide layer or on the first polyimide layer. The deformation layer can include a shape memory material configured to be deformed in a certain predetermined direction at a predetermined temperature or higher.

Embodiments relate to an apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

Systems and processes that integrate thermoplastic and shape memory alloy materials to form an adaptive composite structure capable of changing its shape. For example, the adaptive composite structure may be designed to serve as a multifunctional adaptive wing flight control surface. Other applications for such adaptive composite structures include in variable area fan nozzles, winglets, fairings, elevators, rudders, or other aircraft components having an aerodynamic surface whose shape is preferably controllable. The material systems can be integrated by means of overbraiding (interwoven) with tows of both thermoplastic and shape memory alloy materials or separate layers of each material can be consolidated (e.g., using induction heating) to make a flight control surface that does not require separate actuation.

Embodiments relate to a method and apparatus for rework of a BGA package. Memory shape material is placed adjacent to a plurality of solder joints of the package. Stimulation is applied to the material, with the stimulation causing the material to change from a non-stimulated shape to a stimulated shape. This stimulation causes an expansion of the material. As the material expands, it exerts a tensile force on the BGA package and an adjacently positioned carrier, causing a separation of the two components, while mitigating collateral heat of adjacently positioned components.

An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

An integrated circuit that includes a substrate having a shape memory material (SMM), the SMM is in a first deformed state and has a first crystallography structure and a first configuration, the SMM is able to be deformed from a first configuration to a second configuration, the SMM changes to a second crystallography structure and deforms back to the first configuration upon receiving energy, the SMM returns to the first crystallography structure upon receiving a different amount of energy; and an electronic component attached to substrate. In other forms, the SMM is in a first deformed state and has a first polymeric conformation and a first configuration, the SMM changes from a first polymeric conformation to a second polymeric conformation and be deformed from a first configuration to a second configuration, the SMM changes returns to the first polymeric conformation and deforms back to the first configuration upon receiving energy.

A battery system includes a first electrical interface and safety switch connected to the first electrical interface and including a shape memory alloy element configured to deform from an unactuated configuration to an actuated configuration in response to reaching an activation temperature. A second electrical interface is connected to the safety switch, and the connection between the first electrical interface, the safety switch, and the second electrical interface enables electrical current to flow through a LIB cell. When the shape memory alloy element is the unactuated configuration, the safety switch directly engages the first electrical interface and the second electrical interface and enables electrical current to flow through the LIB cell. When in the actuated configuration, the safety switch disconnects from at least one of the first electrical interface and the second electrical interface and disables electrical current from flowing through the LIB cell.

A battery system includes a first electrical interface and safety switch connected to the first electrical interface and including a shape memory alloy element configured to deform from an unactuated configuration to an actuated configuration in response to reaching an activation temperature. A second electrical interface is connected to the safety switch, and the connection between the first electrical interface, the safety switch, and the second electrical interface enables electrical current to flow through a LIB cell. When the shape memory alloy element is the unactuated configuration, the safety switch directly engages the first electrical interface and the second electrical interface and enables electrical current to flow through the LIB cell. When in the actuated configuration, the safety switch disconnects from at least one of the first electrical interface and the second electrical interface and disables electrical current from flowing through the LIB cell.