An example of an apparatus may comprise a first set of compression contact pads formed on a first side of a circuit board, a second set of compression contact pads formed on a second side of the circuit board opposite to the first side of the circuit board, where the first set of compression contact pads are respectively electrically connected to the second set of compression pads. An example of the circuit board may include a memory board. An example stackable memory module may include memory devices mounted to both sides of the memory board. Other examples are disclosed and claimed.

In a method for manufacturing a circuit board according to an additive manufacturing shaping method, a circuit board manufacturing method and a circuit board manufacturing device that can reduce the influence of thermal stress on a circuit board by reducing the number of heating steps are provided. A circuit board manufacturing method according to the present disclosure includes a board shaping step of laminating and shaping a circuit board having a wiring on a peeling member adhered to a base member, an attachment step of attaching a metal paste contacting the wiring to the circuit board, an electronic component arrangement step of arranging an electronic component on the circuit board to arrange the electronic component and the wiring via the metal paste, and a heating press step of arranging a press member above the circuit board, and causing the peeling member to be easily released from the base member and curing the metal paste by collectively heating the peeling member and the metal paste while pressing the circuit board with the base member and the press member to correct warpage of the circuit board.

A circuit board according to an embodiment includes an insulating portion; and a pattern portion disposed on the insulating portion, wherein the insulating portion includes: a first insulating region, and a second insulating region disposed outside the first insulating region and spaced apart from the first insulating region with a separation region therebetween; wherein the pattern portion includes: a first pattern portion for signal transmission; and a second pattern portion including a dummy pattern separated from the first pattern portion, wherein the first pattern portion includes: a first terminal portion disposed on the first insulating region; a second terminal portion disposed on the second insulating region; and a connection portion disposed on the separation region and connecting between the first terminal portion and the second terminal portion, wherein the second pattern portion includes: a second-first pattern portion disposed on the first insulating region; and a second-second pattern portion disposed on the second insulating region and separated from the second-first pattern portion.

A module assembly is attached on a headlining of a vehicle and includes a base where an upper portion thereof is open, a first printed circuit board (PCB) and a second PCB sequentially stacked on a plurality of supporting pillars extending in a vertical direction to an inner bottom surface of the base and electrically connected to each other by a flexible cable, and a cover assembled with the base to cover the first and second PCBs stacked on the base.

A chip module includes a circuit board (2), a slot (21) disposed on a surface of one side of the circuit board (2), a lidless packaged chip (5), a heat radiator (4), and a substrate fixing assembly (6). The lidless packaged chip (5) includes a substrate (51) and a die (52) packaged on the substrate (51). The slot (21) is electrically connected to the circuit board (2), the lidless packaged chip (5) has a connecting part on one side of the substrate (51) facing away from the die (52), and the connecting part is inserted into the slot (21). The heat radiator (4) is press-fitted on one side of the die (52) facing away from the circuit board (2). The substrate fixing assembly (6) is press-fitted at a periphery of one side of the substrate (51) facing away from the circuit board (2) and avoids the die (52).

A joystick device is provided. The joystick device includes a housing, a joystick assembly, a reset assembly, a translation assembly, and a circuit board. A magnetic component is located on the translation assembly, and a magnetic induction element is located on the circuit board. The joystick assembly pushes the translation assembly to translate, and the magnetic induction element generate an output that changes with the movement of the translation assembly. A handle using the joystick device also provided.

A circuit board having multiple degrees of freedom, comprises a flat board and a conductive and flexible unit disposed on the flat board. The conductive and flexible unit comprises: an inner support plate, an outer support plate, and at least one flexible connector; a hollow portion is provided on the outer support plate; the inner support plate and the flexible connector are disposed in the hollow portion; the inner and the outer support plates are connected by the flexible connector; the flexible connector comprises an outer connecting portion, an inner connecting portion corresponding to the outer connecting portion, and an extension located between the outer connecting portion and the inner connecting portion. The circuit board has a simple and compact structure; the production efficiency is high; costs are low; a multi-axis flexible anti-shaking effect can be achieved without folding a flexible structure; the resilience performance is good.

An electrical apparatus includes first and second welded members that are welded together. The first welded member has a first metal part and a first resin part covering part of the first metal part. The second welded member has a second metal part and a second resin part covering part of the second metal part. The first metal part has a first standing terminal portion exposed from the first resin part and standing in a standing direction. The second metal part has a second standing terminal portion exposed from the second resin part and standing in the standing direction. The first and second standing terminal portions are welded to each other so that a weld is formed therebetween. The first and second resin parts partially overlap each other in the standing direction. The weld is within a projection region of the first and second resin parts in the standing direction.

A semiconductor device is detachably mountable on a measurement target that includes sensors provided on a predetermined surface thereof. The semiconductor device includes a wiring board having a first surface, and a second surface opposite to the first surface, a semiconductor integrated circuit mounted on the first surface of the wiring board, measuring spring terminals mounted on the second surface of the wiring board, and projections provided on the second surface of the wiring board. Each of the measuring spring terminals makes contact with a terminal connecting to a corresponding one of the sensors to electrically connect the terminal and the corresponding one of the sensors, and each of the projections makes contact with the measurement target, in a state where the semiconductor device is mounted on the measurement target so that the predetermined surface of the measurement target opposes the second surface of the wiring board.

A memory module mounting apparatus for coupling a memory module to a processor of an information handling system includes a z-axis compression connector and a compression connector mount. The z-axis compression connector has first compression contacts on a first surface of the compression connector and second compression contacts on a second surface of the compression connector. The first compression contacts couple the compression connector to the processor. The compression connector mount has contact pads on a first surface of the compression connector mount. The first contact pads couple the compression connector mount to the first compression contacts, and have contact elements configured to couple the contact pads to the memory module.