A first and second substrate, and electrically conductive first and second connection parts are provided in a method for establishing an electrically conductive connection between two substrates. The first connection part is mounted on the first substrate by a first releasable connection and the second connection part is respectively mounted on the second substrate by a releasable connection. An electrically conductive connection assembly containing the first connection part and the second connection part is established by either a cohesive connection between a connection portion of the first connection part and a connection portion of the second connection part or an electrically conductive crossmember provided and a cohesive connection of a first length portion of the crossmember to the connection portion of the first connection part and a second cohesive connection of a second length portion of the crossmember to the connection portion of the second connection part being established.

Described herein are connector components for selectively connecting to a PCB or other type of secondary device. Such a connector component comprises a body, electrically conductive contact pins, and latching pins. The body includes opposing sides at which are located pinch tabs. The electrically conductive contact pins and the latching pins each includes a portion thereof also extending from the bottom of the body. The pinch tabs are configured to normally bias the latching pins in a first position where the latching pins are angled relative to a central axis of the connector component when the pinch tabs are not being pinched inwards towards one another. Additionally, the pinch tabs are configured to bias the latching pins in a second position where the latching pins are substantially parallel to the central axis of the connector component when the pinch tabs are being pinched inward towards one another.

A connector assembly includes multiple terminals. Each terminal includes a conductive portion. The terminals include first and second high speed signal terminals and a low speed signal terminal. The conductive portions of the first and second high speed signal terminals and the low speed signal terminal are correspondingly defined as first, second and third conductive portions. An adapter board is located above a circuit board to be conductively connected to a cable directly or indirectly. The adapter board includes first and second signal circuit layers located at different heights. The first signal circuit layer includes a first high speed signal circuit conductively connecting the first conductive portion and a conductive wire of the cable. The second signal circuit layer includes a second high speed signal circuit conductively connecting the second conductive portion and another conductive wire of the cable. The third conductive portion is conductively connected to the circuit board.

An electronic device according to various embodiments of the present invention may comprise a housing; an inner plate which is built into the housing, at least a portion of which is made of a synthetic resin material, and which comprises a first surface, a second surface facing the opposite direction to the first surface, a first through-hole formed in a cone-shaped cross-section the diameter of which gradually decreases the closer to the second surface from the first surface, and a second through-hole formed in a cone-shaped cross-section, which is disposed adjacent to the first through-hole and the diameter of which gradually decreases the closer to the first surface from the second surface; a first conductive line which is formed on the first surface and is formed to overlap with the first through-hole at least partially when viewed from the first surface, a second conductive line which is formed on the second surface and is formed to overlap with the second through-hole at least partially when viewed from the second surface, a first conductive layer which is deposited conformally on an inner wall of the first through-hole and electrically connected to at least one of the first conductive line and the second conductive line, a second conductive layer which is deposited conformally on an inner wall of the second through-hole and electrically connected to at least one of the first conductive line and the first conductive line, and a wireless communication module which is electrically connected to at least one of the first conductive line and the second conductive line, wherein the first conductive line, the second conductive line, the first conductive layer, and the second conductive layer may comprise the same composition of materials. Such an electronic device may vary according to the embodiment.

A stretchable laminate to be fixed to a fabric includes a stretchable circuit board including a stretchable insulating layer having an elongation rate of 10% or more, a fabric base material, and an adhesive layer that bonds the stretchable circuit board and the fabric base material together.

Described herein are connector components for selectively connecting to a PCB or other type of secondary device. Such a connector component comprises a body, electrically conductive contact pins, and latching pins. The body includes opposing sides at which are located pinch tabs. The electrically conductive contact pins and the latching pins each includes a portion thereof also extending from the bottom of the body. The pinch tabs are configured to normally bias the latching pins in a first position where the latching pins are angled relative to a central axis of the connector component when the pinch tabs are not being pinched inwards towards one another. Additionally, the pinch tabs are configured to bias the latching pins in a second position where the latching pins are substantially parallel to the central axis of the connector component when the pinch tabs are being pinched inward towards one another.

Semiconductor devices having an array of flexible connectors configured to mitigate thermomechanical stresses, and associated systems and methods, are disclosed herein. In one embodiment, a semiconductor assembly includes a substrate coupled to an array of flexible connectors. Each flexible connector can be transformed between a resting configuration and a loaded configuration. Each flexible connector can include a conductive wire electrically coupled to the substrate and a support material at least partially surrounding the conductive wire. The conductive wire can have a first shape when the flexible connector is in the resting configuration and a second, different shape when the flexible connector is in the loaded configuration.

An arrangement is illustrated and described. The arrangement includes a component carrier including ia) a stack with at least one electrically conductive layer structure and/or at least one electrically insulating layer structure, and ib) at least one elastic element attached to the stack and configured to reversibly connect the component carrier with a further component carrier by elastically deforming the at least one elastic element and essentially not deforming the stack and the further component carrier; ii) the further component carrier connected with the component carrier by the at least one elastic element, wherein the further component carrier includes: iia) a further recess configured such that the component carrier is at least partially placeable into the further recess; iii) the component carrier is a smaller unit than the further component carrier, and iv) the component carrier is at least partially placed into the further recess.

A connector for electrically connecting to conductive structures formed on a semiconductor device includes a core including an isolation layer and signal vias and ground vias formed in the isolation layer; a first ground plane formed on a surface of the core and electrically connected to the ground vias; a first set of contact elements formed on a first surface of the core and electrically connected to the signal vias to form signal pins; a second set of contact elements formed on the first surface and electrically connected to a subset of the ground vias to form ground pins. The remaining ground vias without contact elements form buried ground vias. The first and second sets of contact elements are arranged on the first surface of the core to surround each signal pin by at least one adjacent ground pin and one or more adjacent buried ground vias.

A printed structure comprises a device comprising device electrical contacts disposed on a common side of the device and a substrate non-native to the device comprising substrate electrical contacts disposed on a surface of the substrate. At least one of the substrate electrical contacts has a rounded shape. The device electrical contacts are in physical and electrical contact with corresponding substrate electrical contacts. The substrate electrical contacts can comprise a polymer core coated with a patterned contact electrical conductor on a surface of the polymer core. A method of making polymer cores comprising patterning a polymer on the substrate and reflowing the patterned polymer to form one or more rounded shapes of the polymer and coating and then patterning the one or more rounded shapes with a conductive material.