A flexible transparent copper circuit, a preparation method therefor, and a application thereof. The preparation method specifically comprises the following steps: (1) uniformly coating a gel containing copper powder on one side of a glass sheet, and drying same to form a copper film layer; and (2) placing the one side of the glass sheet coated with the copper film layer opposite to a polymer material, scanning the other side using a laser beam such that the copper film layer is transferred to a suropposite to of the polymer material, and performing post-processing to obtain a flexible transparent copper circuit. The copper circuit obtained by the preparation method has good potential in flexible photovoltaic applications. Moreover, since laser processing has fast speed and inherent flexibility, the transferred metal circuit can be freely designed, thus improving the processing efficiency and facilitating mass production.

Disclosed herein is a composite comprising an elastomer with an embedded network of liquid metal inclusions. The composite retains similar flexibility to that of an elastomer but exhibits electrical and thermal properties that differ from the properties of a homogeneous elastomer. The composite has applications for wearable devices and other soft matter electronics, among others.

A multilayer ceramic capacitor and a board having the same are provided. The multilayer ceramic capacitor includes a ceramic body including internal electrodes having lead-out portions formed on ends thereof, and external electrodes disposed on portions of end surfaces of the ceramic body to be connected to the lead-out portions, and terminal electrodes coupled to both end portions of the ceramic body and including horizontal portions disposed below the ceramic body and vertical portions spaced apart from the end surfaces of the ceramic body, connected to the external electrodes, and having groove portions, and conductive adhesion layers disposed on the vertical portions of the terminal electrodes to contact the external electrodes through the groove portions.

The present invention provides a connection structure of conductors in which, when connecting a pair of conductors facing each other using an anisotropic conductive film containing conductive particles dispersed therein, a short circuit between the adjacent conductors due to a movement of conductive particles is be prevented, and a display apparatus having the connection structure of conductors. When executing thermo-compression bonding processing while interposing the anisotropic conductive film, even if conductive particles dispersed in the anisotropic conductive film are concentrated and continued in a gap between adjacent first terminals, in the vicinity of an edge of an interlayer insulation film, since a distance between the first terminals adjacent to each other is increased due to notches formed therein, the first terminals adjacent to each other are not short-circuited.

An apparatus comprising a deformable substrate, an electrical interconnect suitable for interconnecting one or more electronic components located on the deformable substrate to one another or to one or more electronic components located on another substrate, and a support beam configured to couple the electrical interconnect to the deformable substrate, wherein the electrical interconnect comprises one or more curved sections and adjoining straight sections, and wherein the electrical interconnect is attached to the support beam via the adjoining straight sections such that the one or more curved sections are suspended over the deformable substrate to enable the electrical interconnect to accommodate strain when the deformable substrate undergoes operational deformation.

The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.

Proposed is a conductive particle used for a testing socket electrically connecting a lead of a device to be tested and a pad of a test board by being arranged between the device to be tested and the test board, wherein the conductive particle has a predetermined depth d and has a length l that is greater than a width w, the conductive particle having a body part in a pillar shape, a first convex part having an upper surface, formed in a top of the body part, and a second convex part having a lower surface, formed in a bottom of the body part.

Systems and methods describe herein provide a solution to the technical problem of creating a wearable electronic devices. In particular, these systems and methods enable electrical and mechanical attachment of stretchable or flexible electronics to fabric. A stretchable or flexible electronic platform is bonded to fabric using a double-sided fabric adhesive, and conductive adhesive is used to join pads on the electronic platform to corresponding electrical leads on the fabric. An additional waterproofing material may be used over and beneath the electronic platform to provide a water-resistant or waterproof device This stretchable or flexible electronic platform integration process allows the platform to bend and move with the fabric while protecting the conductive connections. By using flexible and stretchable conductive leads and adhesives, the platform is more flexible and stretchable than traditional rigid electronics enclosures.

The development of stretchable, mechanically and electrically robust interconnects by printing an elastic, silver-based composite ink onto stretchable fabric. Such interconnects can have conductivity of 3000-4000 S/cm and are durable under cyclic stretching. In serpentine shape, the fabric-based conductor is enhanced in electrical durability. Resistance increases only ˜5 times when cyclically stretched over a thousand times from zero to 30% strain at a rate of 4% strain per second due to the ink permeating the textile structure. The textile fibers are wetted with composite ink to form a conductive, stretchable cladding of the silver particles. The e-textile can realize a fully printed, double-sided electronic system of sensor-textile-interconnect integration. The double-sided e-textile can be used for a surface electromyography (sEMG) system to monitor muscles activities, an electroencephalography (EEG) system to record brain waves, and the like.

Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.