Patent classifications
H05K2201/0314
LIQUID METAL CIRCUITS AND METHODS OF MAKING THE SAME
Manufacturing technology to fabricate liquid metal-based soft and flexible electronics (sensors, antennas, etc.) in a high-throughput fashion, with fabrication rates that may approach that of the traditional integrated circuit components and circuits, are described. The technique allows creation of liquid-metal-only circuits, as well as seamless integration of solid IC chips into the circuits, in which liquid metal traces are used as flexible interconnects and/or as other circuit elements. The process may be applied at the wafer scale and may be integrated into the traditional microelectronics fabrication processes. Many sensors, antennas, and other circuit elements may be directly created using liquid metal, and when combined with the IC chips, a broad range of electronic functionality may be provided in a flexible, soft circuit that can be conformable, wearable.
SYSTEMS AND METHODS FOR POWERING AN INTEGRATED CIRCUIT HAVING MULTIPLE INTERCONNECTED DIE
The power on wafer assembly can include: a compliant connector, an integrated circuit, a printed circuit board (PCB), a power component, and a set of compliant connectors. The power on wafer assembly can optionally include: a compression element, a cooling system, a set of mechanical clamping components, and a power source. However, the power on wafer assembly can additionally or alternately include any other suitable components.
Fabric coated with functional silicone rubber
A fabric coated with functional silicone rubber, the fabric being configured such that a coating layer may not be easily separated from the fabric and may be used to form a power line or a signal line. The fabric includes: a woven fabric made by weaving and including uniform pores therein; and a coating layer formed by coating a surface of the woven fabric with liquid silicone rubber in which electrically conductive particles larger than the pores of the woven fabric are dispersed and mixed, wherein the liquid silicone rubber permeates into the pores of the woven fabric by the weight thereof and is cured such that the silicone rubber is anchored to the woven fabric, and an electrically conductive layer having electrical conductivity is formed as the electrically conductive particles are caught on the surface of the woven fabric and increase in density at the surface of the woven fabric.
Functional contactor and portable electronic device comprising same
Provided are a functional contactor and a portable electronic device comprising same. A functional contactor, according to an embodiment of the present invention, comprises: an elastic conductor which electrically comes in contact with a conductor of an electronic device; a functional element which is connected to the elastic conductor and has a first electrode and a second electrode on at least one part of the lower side and the upper side, respectively; a first testing electrode which is connected to the first electrode and is provided on the upper side of the functional element and a fixed distance away from the second electrode; and a second testing electrode which is connected to the second electrode and is provided on the upper side of the functional element.
FLEXIBLE FLAT CABLE AND METHOD OF PRODUCING THE SAME
Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.
Bond-free interconnect between a microcircuit housing and a printed circuit assembly
A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.
Polymer composite with liquid phase metal inclusions
Disclosed herein is a composite comprising an elastomer with an embedded network of liquid metal inclusions. The composite retains similar flexibility to that of an elastomer but exhibits electrical and thermal properties that differ from the properties of a homogeneous elastomer. The composite has applications for wearable devices and other soft matter electronics, among others.
FUNCTIONAL CONTACTOR AND PORTABLE ELECTRONIC DEVICE COMPRISING SAME
Provided are a functional contactor and a portable electronic device comprising same. A functional contactor, according to an embodiment of the present invention, comprises: an elastic conductor which electrically comes in contact with a conductor of an electronic device; a functional element which is connected to the elastic conductor and has a first electrode and a second electrode on at least one part of the lower side and the upper side, respectively; a first testing electrode which is connected to the first electrode and is provided on the upper side of the functional element and a fixed distance away from the second electrode; and a second testing electrode which is connected to the second electrode and is provided on the upper side of the functional element.
BOND-FREE INTERCONNECT BETWEEN A MICROCIRCUIT HOUSING AND A PRINTED CIRCUIT ASSEMBLY
A method of assembling a fully detachable microcircuit starts with obtaining a fabricated microcircuit housing with an upper surface, a lower surface, a first recess in the upper surface, a second recess in the lower surface, and a pin on the lower surface. A thermal layer is applied to the lower surface. A conductive elastomer signal pin connector and a ground pin connector are attached to a thin film circuit, and the thin film circuit with is inserted into the second recess with the conductive elastomer signal pin connector and the ground pin connector attached. A bonding target is applied to the upper surface. The bonding target and the microcircuit are connected with a bond wire. The microcircuit housing is screwed to a printed circuit assembly without bonding the microcircuit housing to the printed circuit assembly.
LIVING BODY-ATTACHABLE ELECTRODE
A living body-attachable electrode includes a substrate that has a first main surface and a second main surface and is made of a material having stretchability, a first electrode pair that is formed on/in the first main surface and includes two opposite electrodes, a second electrode pair that is formed on/in the first main surface and includes two opposite electrodes sandwiching the first electrode pair, and a plurality of gel electrodes that are formed on the second main surface and are in a one-to-one correspondence with the electrodes in the first and second electrode pairs. Each of the electrodes in the first and second electrode pairs and corresponding one of the gel electrodes are electrically connected to each other via a plurality of via conductors penetrating through the substrate.