The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

A wiring substrate includes: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protrudes from the side along the principal face.

A wiring circuit board includes a support metal layer having thermal conductivity of 5 W/m.Math.K or more, an insulating layer disposed on at least one side in a thickness direction of the support metal layer, a wiring layer disposed on a front surface of the insulating layer, a protective metal film disposed on the entire surface of the support metal layer between the support metal layer and the insulating layer, and a protective thin film disposed on an exposed surface exposed from the protective metal film in the support metal layer.

A circuit board is provided, including: a core board, defining a plurality of slots, the plurality of slots including a plurality of first sub-slots and a plurality of second sub-slots disposed beneath the first sub-slots. Each of the second sub-slots is located beneath a corresponding first sub-slot of the first sub-slots; and a plurality of chip assemblies, arranged in the slots and including a plurality of first chips located in the first sub-slots and a plurality of second chips located in the second sub-slots. Each of the first chips is connected in series with one of the second chips at a corresponding position to form a plurality of chipsets; the chipsets are connected in parallel with each other; an end of the chipsets is connected to a first power signal layer, and the other end of the plurality of chipsets is connected to a ground layer.

The invention, which relates to the technical field of inductance embedding, specifically discloses an embedded circuit board. The embedded circuit board includes: at least layer of sub-body, where preset positions of the sub-bodies are provided with through slots; and an inductance element embedded within the slots and configured to be spaced apart from sidewalls of the slots. In the above manner, it is possible to make the embedded circuit board of the present application structurally compact, highly integrated, widely applicable, and safe and reliable.

The present disclosure provides a circuit board and a method for manufacturing the circuit board. The circuit board may include: a base board, an embedded component, and an attached component. The base board may define a groove, the embedded component can be disposed in the groove. The attached component can be attached to at least one surface of the base board and connected to the embedded component.

An electronic device includes a circuit board, a driving member, and a working member. The circuit board has a board body, conductive lines, and conductive pads. The board body has a working surface. The driving member includes a substrate, a thin film circuit, a thin film element, and connection pads. The thin film circuit corresponds to thin film element and is electrically connected to the connection pads, and the connection pads are connected to partial conductive pads. The substrate has a first top surface. The working member has at least one electrode electrically connected to one of the conductive pads. The working member has a second top surface. A first height is defined between the first top surface and the working surface, and a second height is defined between the second top surface and the working surface. The second height is greater than or equal to the first height.

Included are an insulating plate 41 including a plurality of insulating synthetic resin layers, wiring circuits 44a, 44b, and 44c provided in the insulating plate 41, a thin-film resistor 46 formed to be buried in the insulating plate 41 and electrically connected to the wiring circuits 44a, 44b, and 44c, a heat dissipating portion 47 provided over one surface of the insulating plate to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers and having higher heat conductivity than that of the insulating plate 41, a pedestal portion 48 formed to be buried in the insulating plate 41 and provided to be opposed to the thin-film resistor 46 via a part of the plurality of insulating synthetic resin layers on an opposite side of the heat dissipating portion 47 and having higher heat conductivity than that of the insulating plate 41, and a heat dissipation and pedestal connecting portion 49 connecting the heat dissipating portion 47 to the pedestal portion 48 and having higher heat conductivity than that of the insulating plate 41.

A wiring substrate includes: an insulating substrate comprising a principal face; a wiring line located on the principal face; and a protruding portion on a side of the wiring line, the protruding portion being smaller in thickness than the wiring line and protrudes from the side along the principal face.

An extremely thin copper foil is provided that enables formation of highly fine different wiring patterns with a line/space (L/S) of 10 μm or less/10 μm or less on two sides of the copper foil and is thus usable as an inexpensive and readily processable substitution for silicon and glass interposers. The extremely thin copper foil includes, in sequence, a first extremely thin copper layer, an etching stopper layer, and the second extremely thin copper layer. Two sides of the extremely thin copper foil each have an arithmetic average roughness Ra of 20 nm or less.