Patent classifications
H05K2201/0323
Physiological monitoring garments
Described herein are apparatuses (e.g., garments, including but not limited to shirts, pants, and the like) for detecting and monitoring physiological parameters, such as respiration, cardiac parameters, and the like. Also described herein are methods of forming garments having one or more stretchable conductive ink patterns and methods of making garments having one or more highly stretchable conductive ink pattern formed of a composite of an insulative adhesive, a conductive ink, and an intermediate gradient zone between the adhesive and conductive ink. The conductive ink typically includes between about 40-60% conductive particles, between about 30-50% binder; between about 3-7% solvent; and between about 3-7% thickener. The stretchable conductive ink patterns may be stretched more than twice their length without breaking or rupturing.
FLEXIBLE CIRCUITS ON SOFT SUBSTRATES
An article includes a solid circuit die on a first major surface of a substrate, wherein the solid circuit die includes an arrangement of contact pads, and wherein at least a portion of the contact pads in the arrangement of contact pads are at least partially exposed on the first major surface of the substrate to provide an arrangement of exposed contact pads; a guide layer including an arrangement of microchannels, wherein the guide layer contacts the first major surface of the substrate such that at least some microchannels in the arrangement of microchannels overlie the at least some exposed contact pads in the arrangement of exposed contact pads; and a conductive particle-containing liquid in at least some of the microchannels. Other articles and methods of manufacturing the articles are described.
Alloy bonded graphene sheets for enhanced thermal spreaders
A heat spreader for printed wiring boards and a method of manufacture are disclosed. The heat spreader is made from a plurality of graphene sheets that are thermo-mechanically bonded using an alloy bonding process that forms a metal alloy layer using a low temperature and pressure that does not damage the graphene sheets. The resulting heat spreader has a higher thermal conductivity than graphene sheets alone.
Warpage Control With Intermediate Material
A mounting device for mounting electronic components, wherein the mounting device comprises an electrically conductive structure having a first value of thermal expansion in at least one pre-defined spatial direction, an electrically insulating structure having a second value of thermal expansion in the at least one pre-defined spatial direction being different from the first value and being arranged on the electrically conductive structure, and a thermal expansion adjustment structure having a third value of thermal expansion in the at least one pre-defined spatial direction, wherein the third value is selected and the thermal expansion adjustment structure is located so that thermally induced warpage of the mounting device resulting from a difference between the first value and the second value is at least partially compensated by the thermal expansion adjustment structure.
MODIFIED CARBON BLACK AND PRODUCTION METHOD THEREFOR, RESIN COMPOSITION, AND COPPER CLAD LAMINATE
The present invention relates to modified carbon black and a production method therefor, a resin composition and copper clad laminate. The modified carbon black comprises carbon black and a modified group; the surface of the carbon black has an acyl chloride group; the modified group is formed by a modified macromolecule and the acyl chloride group undergoing a grafting reaction; and the modified macromolecule is an alcohol macromolecule.
Monitoring circuitry
In an example, monitoring circuitry includes a first and second coupling, at least one of which is to capacitively couple the monitoring circuitry to a monitored circuit on a product packaging. The monitored circuit has a resistance which is indicative of a status of a product stored in the product packaging, and the monitored circuit is to be connected in series between the first coupling and the second coupling. The monitoring apparatus may determine the resistance of the monitored circuit via the first and second couplings.
SYSTEM AND METHOD OF FORMING ELECTRICAL INTERCONNECTS
A method of forming a high-conductivity electrical interconnect on a substrate may include forming a graphene film with a plurality of graphene members, depositing a metal over the graphene film, and providing a metallic overlay that connects the plurality of graphene members together through the depositing operation to form a covered graphene film.
Graphene mounted on aerogel
An apparatus having reduced phononic coupling between a graphene monolayer and a substrate is provided. The apparatus includes an aerogel substrate and a monolayer of graphene coupled to the aerogel substrate.
Electrically conductive materials formed by electrophoresis
A method of forming an electrically conductive composite is disclosed that includes the steps of providing a first dielectric material and a second conductive material that is substantially dispersed within the first dielectric material; and applying an electric field through at least a portion of the combined first dielectric material and second conductive material such that the second conductive material undergoes electrophoresis and forms at least one electrically conductive path through the electrically conductive composite along the direction of the applied electric field.
ANISOTROPIC CONDUCTIVE FILM (ACF), BONDING STRUCTURE, AND DISPLAY PANEL, AND THEIR FABRICATION METHODS
An anisotropic conductive film (ACF), a bonding structure, and a display panel, and their fabrication methods are provided. The ACF includes a resin gel and a plurality of conductive particles dispersed in the resin gel. The plurality of conductive particles is aligned and connected, in response to an electric field, to form a conduction path in the resin gel. The bonding structure includes the anisotropic conductive film (ACF) sandwiched between first and second substrates. The display panel includes the bonding structure.