An integrated circuit pin is provided. The integrated circuit pin includes a glass substrate, a buffer layer above the glass substrate, a gate insulating layer above the buffer layer, a first metal layer above the gate insulating layer, a second metal layer above the first metal layer, a first insulating layer above the second metal layer, a second insulating layer above the first insulating layer, a bottom indium tin oxide (BITO) above the second insulating layer, and a top indium tin oxide covering the BITO. The BITO further extends downwardly along the inner wall of a through-hole penetrating through the first and second insulating layers such that the BITO is connected to the second metal layer. An in-cell touch panel is also provided. According to the disclosure, the thickness of the conductive layer can be increased. The anti-external interference and the drop reliability of ITP products can be enhanced.

A substrate with a transparent electrode which includes an amorphous transparent electrode layer on a transparent film substrate. When a bias voltage of 0.1 V is applied to the amorphous transparent electrode layer, the layer has continuous regions where a current value at a voltage-applied surface is 50 nA or more. Each of the continuous regions has an area of 100 nm.sup.2 or more and the number of the continuous regions is 50/m.sup.2 or more. In one embodiment, the layer has a tin oxide content of 6.5% or more and 8% or less by mass. With respect to the substrate with a transparent electrode according to the present invention, the transparent electrode layer may be crystallized in a short period of time.

An electrowetting display device includes a first support plate and a plurality of pixel walls on the first support plate. The plurality of pixel walls are associated with an electrowetting pixel. A pixel electrode is on the first support plate for applying a voltage within the electrowetting pixel. The device includes a second support plate over the first support plate, an organic layer on the second support plate, and an electrode layer on the organic layer. The electrode layer is patterned to include an opening. A pixel spacer is coupled to the second support plate. The pixel spacer includes a first portion in direct contact with the organic layer through the opening in the electrode layer. The pixel spacer is in contact with at least one pixel wall in the plurality of pixel walls.

Trace transfer techniques can be used to couple touch electrodes to touch sensing circuitry with a reduced border region around a touch sensor panel. Touch electrodes on a first side of the substrate can be routed to a bond pad region on the second side of the substrate via a trace transfer technique to enable single-sided bonding of a double-sided touch sensor panel. Trace transfer techniques can also be used to couple conductive traces on a first side of the substrate to a flex circuit oriented perpendicular to or otherwise not parallel to the first side of the substrate. Orienting the flex circuit in this way can allow the flex circuit to connect to touch circuitry with reduced bending as compared with the amount of bending of the flex circuit when oriented substantially parallel to the substrate.

The present application relates to a conductive transparent film. The conductive transparent film comprises an undercoating layer, an anti-crack buffer layer, and a conductive layer. The conductive transparent film may have not only excellent mechanical strength, but also have a fast response speed when applied to a touch panel.

An electrical conductor includes a substrate; and a first conductive layer disposed on the substrate and including a plurality of metal oxide nanosheets, wherein adjacent metal oxide nanosheets of the plurality of metal oxide nanosheets contact to provide an electrically conductive path between the contacting metal oxide nanosheets, wherein the plurality of metal oxide nanosheets include an oxide of Re, V, Os, Ru, Ta, Ir, Nb, W, Ga, Mo, In, Cr, Rh, Mn, Co, Fe, or a combination thereof, and wherein the metal oxide nanosheets of the plurality of metal oxide nanosheets have an average lateral dimension of greater than or equal to about 1.1 micrometers. Also an electronic device including the electrical conductor, and a method of preparing the electrical conductor.

The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.

Discussed is a method of manufacturing a solar cell including preparing a single crystalline silicon substrate having a first conductive type impurity; forming a non-single crystalline silicon emitter layer having a second conductive type impurity opposite to the first conductive type impurity on a first surface of the single crystalline silicon substrate; forming a first transparent conductive oxide layer on the first surface of the single crystalline silicon substrate; forming a first electrode electrically connected to the first transparent conductive oxide layer; and forming a second electrode electrically connected to the single crystalline silicon substrate, wherein the forming of the first electrode includes; forming a first seed layer on the first transparent conductive oxide layer, and forming a first plating layer over the first seed layer by plating a first conductive material.

A touch-control photosensitive structure for preventing red light leakage includes a metal substrate, an insulating layer, a photosensitive layer, a third metal layer and a transparent conductive layer. The insulating layer is disposed on the metal substrate. The photosensitive layer is disposed on the insulating layer. The photosensitive layer at least comprises red photosensitive blocks, green photosensitive blocks and blue photosensitive blocks, arranged alternately. A junction region is disposed at the junction of the photosensitive blocks in different colors. The third metal layer is disposed on the junction region. The third metal layer has a lower surface which a light absorption layer is disposed on. The light absorption layer absorbs a reflecting light otherwise reflecting off the metal substrate and the third metal layer and propagating therebetween. The transparent conductive layer is disposed on the third metal layer. The third metal layer reduces impedance of the transparent conductive layer efficiently and thereby renders public voltage stable. The light absorption layer absorbs the reflecting light and thereby prevents light leakage.

An integrated circuit pin is provided. The integrated circuit pin includes a glass substrate, a buffer layer above the glass substrate, a gate insulating layer above the buffer layer, a first metal layer above the gate insulating layer, a second metal layer above the first metal layer, a first insulating layer above the second metal layer, a second insulating layer above the first insulating layer, a bottom indium tin oxide (BITO) above the second insulating layer, and a top indium tin oxide covering the BITO. The BITO further extends downwardly along the inner wall of a through-hole penetrating through the first and second insulating layers such that the BITO is connected to the second metal layer. An in-cell touch panel is also provided. According to the disclosure, the thickness of the conductive layer can be increased. The anti-external interference and the drop reliability of ITP products can be enhanced.