In a method for making a flexible material, a sheet of graphene oxide-composite paper is subjected to an environment having a relative humidity above a predetermined threshold for a predetermined amount of time. At least one expansion cut is cut in the sheet of graphene oxide-composite paper. A flexible conductive material includes a sheet of graphene oxide-composite paper defining at least one cut passing therethrough and formed it a kirigami structure. A region of the sheet of graphene oxide-composite paper includes reduced graphene oxide.

An electronic device is provided. The device comprises a singulated carrier portion, a substrate molded onto the singulated carrier portion, and conductive traces disposed on the substrate. The substrate comprises a polymer composition that includes an aromatic polymer and an electrically conductive filler, wherein the polymer composition exhibits a surface resistivity of from about 1×10.sup.12 ohms to about 1×10.sup.18 ohms as determined in accordance with ASTM D257-14.

A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

A stretchable electronic device includes a substrate, a plurality of electronic elements, and a conductive wiring. The electronic elements and the conductive wiring are disposed on the substrate, and the conductive wiring is electrically connected to the electronic elements. The conductive wiring is formed by stacking an elastic conductive layer and a non-elastic conductive layer. A fracture strain of the elastic conductive layer is greater than a fracture strain of the non-elastic conductive layer, and the non-elastic conductive layer includes a plurality of first fragments which are separated from one another.

Disclosed are a wound treatment patch using static electricity, and a method for fabricating the wound treatment patch using static electricity. The patch includes a substrate made of a sticky polymer; a first electrode disposed in a first partial region of one face of the substrate and exposed to an outside; and a second electrode disposed in a second partial region other than the first partial region, and spaced apart from the first electrode, and encapsulated within the substrate, wherein each of the first electrode and the second electrode is made of hydrogel having electrical conductivity or a soft polymer having electrical conductivity.

A socket assembly includes an electrical interconnect having an insulator having apertures. The electrical interconnect includes primary contacts and secondary contacts received in corresponding apertures. The primary contacts include a primary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting first and second electronic packages. The secondary contacts include a secondary conductive polymer column having upper contact tips and lower contact tips for electrically interconnecting the first and second electronic packages. The contact tips of the secondary conductive polymer columns have a different shape from the shape of the contact tips of the primary conductive polymer columns.

According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.

One aspect of the invention provides an interconnect between a stretchable electronic element and a circuit on a rigid or flexible printed circuit board (PCB Circuit), the stretchable electronic element is operable to be mechanically coupled to a substrate which deforms, and the stretchable electronic element will deform with the substrate and may or may not change an electrical characteristic as a result, the stretchable electronic element comprising one or more electrical pathways; the PCB Circuit configured to communicate electronically with the stretchable electronic element and comprising at least one circuit board extending from the stretchable electronic element to an electrical circuit on the PCB Circuit; wherein the interconnect comprises an electrical coupling between the electrical pathways of the stretchable electronic element and the PCB Circuit; and wherein the interconnect simultaneously prevents the connection between the stretchable electronic element from failing when the stretchable substrate is stretched in normal operation, minimizes the bulk of support material required to support the interconnect, and minimizes any reduction in the stretch capabilities of the stretchable substrate.

A flexible substrate and an electronic device having high flexibility as a whole including an element mounting portion and a connection terminal portion, and a production method of the electronic device are provided. The flexible substrate includes a flexible base, and a conductive wiring made of a conductive organic compound formed on the base, wherein part of the conductive wiring serves as a connection part with another electronic member. Further, an electronic device 100 includes flexible bases 11 and 21, conductive wirings 13 and 23 made of a conductive organic compound formed on the bases, and electronic elements 12 and 22 connected to the conductive wirings, wherein part of the conductive wiring serves as a connection part 30 with another substrate.

According to examples, a method of making a three-dimensional conductive printed part, including forming a layer of polymeric build material; selectively applying a fusing agent on a first selected area of the formed polymeric build material; selectively applying a conductive agent on a second selected area of the formed polymeric build material; and applying a solder receiving material to a portion of the first selected area and a portion of the second selected area; in which the solder receiving material is present on a surface of the conductive three-dimensional printed part is disclosed.