A bus bar including a first end comprising a first material and a second end comprising a second material and a method of manufacture are provided. The first end is designed to be coupled to a terminal of a first battery cell of a battery module and includes a first collar disposed on the first end designed to receive and surround the terminal of the first battery cell of the battery module. The second end is designed to be coupled to a terminal of a second battery cell of the battery module and includes a second collar disposed on the second end designed to receive and surround the terminal of the second battery of the battery module. The first and second batteries of the battery module are adjacent to one another. Moreover, the bus bar includes a joint electrically and mechanically coupling the first end and the second end.

A substrate is described with a thermal dissipation structure sintered to thermal vias. In one example, a microelectronic module includes a recess between first and second substrate surfaces. One or more thermal vias extend between the first substrate surface and the interior recess surface, wherein each of the thermal vias has an interior end exposed at the interior recess surface. A sintered metal layer is in the recess and in physical contact with the interior end of the thermal vias and a thermal dissipation structure is in the recess over the sintered metal layer. The thermal dissipation structure is attached to the substrate within the recess by the sintered metal layer, and the thermal dissipation structure is thermally coupled to the thermal vias through the sintered metal layer.

A method comprises: providing a circuit board comprising a first surface, an opposing second surface, and a ground connection; defining a shielding zone and a non-shielding zone on the first surface, one or more shielding-zone electronic components being comprised within the shielding zone; providing a groove in the circuit board, the groove extending along at least part of the shielding zone and being in-between the shielding zone and the non-shielding zone; applying an insulating encapsulation layer to cover the shielding zone, whereby the one or more shielding-zone electronic components are encapsulated; applying an electrically conductive shielding layer on top of at least part of the encapsulation layer and to the ground connection so as to electrically couple the shielding layer to the ground connection, whereby the one or more shielding-zone electronic components are electromagnetically shielded. Further, disclosed is a circuit board, and a hearing device comprising a circuit board.

A bus bar including a first end comprising a first material and a second end comprising a second material and a method of manufacture are provided. The first end is designed to be coupled to a terminal of a first battery cell of a battery module and includes a first collar disposed on the first end designed to receive and surround the terminal of the first battery cell of the battery module. The second end is designed to be coupled to a terminal of a second battery cell of the battery module and includes a second collar disposed on the second end designed to receive and surround the terminal of the second battery of the battery module. The first and second batteries of the battery module are adjacent to one another. Moreover, the bus bar includes a joint electrically and mechanically coupling the first end and the second end.

Provided is an electromagnetic wave shielding film capable of reducing a space formed between the electromagnetic wave shielding film and an electronic component on a wiring substrate and to increase an electromagnetic wave shielding effect. An electromagnetic wave shielding film 1 includes a conductive layer 3 having stretchability and a property of hardly returning to an original state thereof when once stretched, and an adhesion layer 4 formed on one surface of the conductive layer 3 and having insulating properties. The conductive layer 3 is made of a conductive composition, including a resin having stretchability and a property of hardly returning to an original state thereof when once stretched and a conductive filler filled with the resin. The resin has a tensile permanent set of 2.5% or more and 90% or less.

A shielded printed wiring board with a ground member wherein even though a thermal load is applied, the connection stability between the electroconductive particles of a ground member and the shielding layer of a shielding film is hardly deteriorated is provided. A shielded printed wiring board with a ground member of the present invention is a shielded printed wiring board with a ground member, including: a substrate film formed by sequentially stacking a base film, a printed circuit including a ground circuit, and an insulating film; a shielding film including a shielding layer and a protective layer laminated on the shielding layer, the shielding film covering the substrate film such that the shielding layer is closer to the substrate film than the protective layer is; and a ground member arranged on the protective layer of the shielding film, the ground member including an external connection member having a first main surface and a second main surface opposite to the first main surface, and having electroconductivity, electroconductive particles disposed on the first main surface side, and an adhesive resin for fixing the electroconductive particles to the first main surface, wherein circularity of the cross sections of the electroconductive particles in the cross section of the ground member is 0.35 or more, and the electroconductive particles are penetrating the protective layer of the shielding film and connected to the shielding layer of the shielding film, and the external connection member of the ground member is electrically connectable to an external ground.

A connection member includes a first region, a second region, and a third region, where a number of conductive layers in the second region is greater than a number of conductive layers in the first region and is greater than a number of conductive layers in the third region, a first layer, which is an uppermost layer of the second region, extends to the third region, a second layer, which is a lowermost layer of the third region, extends to the second region, and a side portion of the second region at a boundary between the second region and the third region is covered by the first layer and the second layer.

A high-frequency circuit includes a first dielectric layer, a circuit layer, a second dielectric layer arranged in this order, the circuit layer includes a transmission line of a high-frequency signal and a ground pattern disposed around the transmission line. An electromagnetic wave shield is disposed in the first dielectric layer and the second dielectric layer around the transmission line. The electromagnetic wave shield includes a first ground electric conductor formed on an inner surface of at least one first hole formed to extend through the first dielectric layer without extending through the ground pattern, and a second ground electric conductor formed on an inner surface of at least one second hole formed to extend through the second dielectric layer without extending through the ground pattern. The first ground electric conductor and the second ground electric conductor are each electrically connected to the ground pattern.

A printed circuit board, includes: a first insulating layer on which a wiring line is disposed; a second insulating layer covering an upper portion of the wiring line; a first conductive shield wall spaced apart from two opposing sides of the wiring line in a width direction of the wiring line, and extending in a length direction of the wiring line; and a second conductive shield wall spaced apart from two opposing ends of the first conductive shield wall in the length direction, and extending the a width direction. At least one of the first conductive shield wall or the second conductive shield wall includes a plurality of via walls each extending in a thickness direction of the first insulating layer and the second insulating layer and having a gap is disposed therebetween.

An electronic device is provided. The electronic device includes a substrate, a first conductive layer, an insulating layer, and a second conductive layer. The first conductive layer is disposed on the substrate. The first conductive layer has a first connection wire and a second connection wire. In a cycle, the first connection wire transmits a positive polarity signal and the second connection wire transmits a negative polarity signal. The insulating layer is disposed on the first conductive layer. The second conductive layer is disposed on the insulating layer. The second conductive layer includes a plurality of portions covering the first connection wire and the second connection wire. In addition, the number of first connection wire covered by each of the plurality of portions is equal to the number of second connection wire covered by each of the plurality of portions.