Electrode carrier for electrophysiological measurements, including a flexible substrate, a plurality of contact pads attached to a substrate surface, wherein each contact pad includes conductive means for accommodating an electrode for electrophysiological measurement, first connecting means attached to the substrate for communicatively connecting the contact pads to a signal processing device. The first connecting means includes a plurality of conductive tracks on the substrate surface for electrically connecting the plurality of contact pads, wherein each conductive track corresponds to at least one contact pad. The substrate has at least two inextendible sections for accommodating the contact pads, wherein the sections interconnected by an extendible section. Each extendible section comprises at least one warpable member of flexible material. At least one of the warpable members accommodates at least one of the conductive tracks. The at least one warpable member includes a V-shaped portion of the substrate, and the extendible section includes four warpable members are arranged in an X-shaped fashion.

Disclosed is a shielding process for SIP packaging, including: providing a circuit board; cutting the covering layer to form half-cut trenches separating different SIP packaging modules from each other, and to form grooves in each single SIP packaging module; forming a metal overlay, the metal overlay on an outer surface of the SIP packaging module and at positions where the half-cut trenches are located constituting a conformal shielding, the metal overlay at positions where the grooves are located constituting a compartment shielding; and cutting the half-cut trenches to obtain a plurality of SIP packaging modules that are separate from each other.

A high-frequency module includes a circuit board including wiring patterns, a resin on an active element mounted on the circuit board and a side of the circuit board and sealing the active element, and connection conductors penetrating the resin from a surface of the resin and provided on a top surface of the active element. The active element includes a first connection electrode on a surface facing the circuit board, and a second connection electrode on a top surface opposite to the surface facing the circuit board. The first connection electrode is connected to a wiring pattern on the circuit board, and the second connection electrode is connected to the connection conductor and an outer electrode and is not connected to the wiring pattern.

A circuit board, including: a substrate; a first line layer, a first protective layer, a first conductive ink layer and a first conductive layer successively formed on the substrate; and a second line layer, a second protective layer, a second conductive ink layer and a second conductive layer successively formed on a second face opposite a first face. The first protective layer includes at least one first opening for exposing a first grounding line of the first line layer; and the orthographic projection of the first conductive ink layer on the substrate covers the orthographic projection of the first opening on the substrate. The second protective layer includes at least one second opening for exposing a second grounding line of the second line layer; and the orthographic projection of the second conductive ink layer on the substrate covers the orthographic projection of the second opening on the substrate.

A module includes a wiring board having a first main surface, a first component mounted on the first main surface and having a first height H1, a second component mounted on the first main surface and having a second height H2 lower than the first height H1, and a sealing resin arranged so as to cover the first component and the second component while covering the first main surface. Compared to a first connection terminal used for connection between the first component and the first main surface, a second connection terminal used for connection between the second component and the first main surface has a higher height. A surface of the first component on a side far from the first main surface and a surface of the second component on a side far from the first main surface are exposed from the sealing resin.

A flexible printed circuit and a manufacturing method thereof, an electronic device module and an electronic device are provided. The flexible printed circuit includes a main sub-circuit board and a bridge sub-circuit board; the main sub-circuit board includes a first substrate, and a first bridge end, a second bridge end, a first wiring portion, and a second wiring portion on the first substrate; the bridge sub-circuit board includes a second substrate, and a third bridge end, a fourth bridge end, and a third wiring portion on the second substrate, the third bridge end and the fourth bridge end are electrically connected by the third wiring portion, and the bridge sub-circuit board is configured to be mounted on the main sub-circuit board by electrically connecting the third bridge end and the fourth bridge end to the first bridge end and the second bridge end, respectively.

A circuit board, with inbuilt protection against incoming and outgoing electromagnetic interference (EMI), includes an insulating adhesive portion, a first signal line, and a second signal line. The first signal line and the second signal line are surrounded and separated by an electromagnetic shielding film against EMI. The insulating adhesive portion fills a gap between the first signal line and the electromagnetic shielding film and a gap between the second signal line and the electromagnetic shielding film. External interference with signals in the circuit board is reduced, mutual interference between the first signal line and the second signal line is reduced, and electromagnetic radiation of the circuit board is also reduced. A method for manufacturing the circuit board is also disclosed.

An electronic device module may include: a board; a ground electrode disposed on a first surface of the board; a sealing portion disposed on the first surface of the board; electronic devices mounted on the first surface of the board such that at least one of the electronic devices is embedded in the sealing portion; a first shielding wall connected to the ground electrode and disposed along a side surface of the sealing portion; and a shielding layer formed of a conductive material and disposed along a surface formed by the sealing portion and the first shielding wall.

An electronic device is disclosed. An electronic device according to an embodiment may include: a first Printed Circuit Board (PCB), a second PCB, a Radio Frequency (RF) transceiver disposed on the first PCB, a Flexible Printed Circuit Board (FPCB) coupled with the first PCB and the second PCB and electrically coupled with the RF transceiver, the FPCB including a transmission line of a wireless communication signal, an amplifier disposed on the second PCB and electrically coupled with the RF transceiver by the FPCB, a first antenna electrically coupled with the amplifier through the second PCB and configured to receive a wireless communication signal corresponding to a first frequency, and a second antenna electrically coupled with the amplifier through the second PCB and configured to receive a wireless communication signal corresponding to a second frequency. The first antenna and the second antenna may be disposed closer to the second PCB than the first PCB in the electronic device. The amplifier may amplify a wireless communication signal received from the first antenna and second antenna.

A radio frequency module includes: a module substrate; a first circuit component disposed on a first principal surface of the module substrate; and a second circuit component stacked on the first circuit component. Here, one of the first circuit component and the second circuit component includes a reception filter, the other of the first circuit component and the second circuit component includes a switch connected between an antenna connection terminal and the reception filter, and the second circuit component is connected to the first circuit component via a via electrode in the first circuit component or a side wiring on a side surface of the first circuit component.