Systems, methods, and apparatus that employ a connector assembly having a substrate layer with an inner aperture and an outer periphery, and one or more signal traces disposed on the substrate that extend from an inner first location to an outer second location of the apparatus, for communicating data between electronic devices positioned within an interior volume of an enclosed vessel and complementary electronic devices positioned in an ambient environment external to the enclosed vessel. An inner connector is conductively connected the signal traces at the inner first location of each signal trace, and an outer connector is conductively connected to the one or more signal traces at the outer second location of each signal trace. A substantially flat exterior surface extends radially over at least a portion of a region between the respective first locations and the respective second locations.

Provided is an electromagnetic wave shielding film capable of easily exhibiting excellent conductivity between a ground member and a shielding layer when the ground member is disposed on the electromagnetic wave shielding film. In the electromagnetic wave shielding film 1, the conductive adhesive layer 11, the shielding layer 12, and the insulating layer 13 are laminated in this order, and a ratio [conductive adhesive layer/insulating layer] of Martens hardness of the conductive adhesive layer 11 in accordance with ISO14577-1 to Martens hardness of the insulating layer 13 in accordance with ISO14577-1 is 0.3 or more.

This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; a thermosetting agent; and a pigment. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80□ or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. When formed into a film having a dry film thickness of 10-40 μm, the maximum value of the transmittance of the photosensitive resin composition is at least 7% for the transmission spectrum of at least some of the wavelength from 350-430 nm. (In formula (1), R.sup.1, R.sup.2, X.sup.1, X.sup.2, and n are as defined in the description.)

A flexible printed circuit board (FPCB) of an electronic device including a flexible display having a shape deformed by a hinge structure is provided. The FPCB of an electronic device includes a plurality of bending portions and a plurality of non-bending portions. The plurality of bending portions is bent according to a deformation of a shape of the electronic device. The plurality of non-bending portions are positioned on a periphery of the plurality of bending portions. The plurality of bending portions and the plurality of non-bending portions are formed to have different thicknesses.

Provided are a flexible flat cable and a method of producing the same. The flexible flat cable includes a plate-shaped first insulation portion comprising an insulating material; a first ground, a second ground, and a third ground disposed at predetermined intervals on the first insulation portion; at least one first signal transmission line positioned between the first ground and the second ground and disposed on the first insulation portion; at least one second signal transmission line positioned between the second ground and the third ground and disposed on the first insulation portion; a first second insulation portion disposed on at least a portion of the first ground and at least a portion of the at least one first signal transmission line and the second ground; a second insulation portion disposed on at least a portion of the second ground and at least a portion of the at least one second signal transmission line, and the third ground; a conductive adhesive layer configured to enclose the first insulation portion, the first second insulation portion, and the second insulation portion; and a shielding portion comprising a shielding material adhered to an outside of the conductive adhesive layer. Therefore, by improving shielding efficiency of a plurality of signal transmission lines, while having good electromagnetic interference and crosstalk characteristics, a plurality of signals can be simultaneously transmitted.

In a high-frequency module provided with a shield member between components, improvement in the degree of freedom in design such as arrangement of components or the like is achieved while preventing damage to a wiring board. A high-frequency module (1a) includes a multilayer wiring board (2), a plurality of components (3a) and (3b) mounted on an upper surface (20a) of the multilayer wiring board (2), and a shield member (5) for shielding between the component (3a) and the component (3b), in which the shield member (5) is formed in a flat plate shape, with a plurality of metal pins (5a) each stacked in a thickness direction of the sealing resin layer (4) such that a length direction is made to be substantially parallel to the upper surface (20a) of the multilayer wiring board (2), and a resin molded portion (5b) for fixing the metal pins (5a).

A component package includes a printed circuit board; a first electronic component disposed in a first region on the printed circuit board; a second electronic component disposed in a second region on the printed circuit board; and a metal wall disposed on the printed circuit board and spatially partitioning the first region and the second region on a plane. The metal wall is directly connected to the printed circuit board.

The present invention relates to an assembly to be used in an inkjet printer, an inkjet printer and a method for printing. The assembly comprises (i) a first fixture configured to hold a first print head; and (ii) at least two processing lines A, B, C, D, wherein each processing line A, B, C, D includes a first printing section in which a functional layer is printed on a surface of an electronic device, a sintering section spaced apart from the first printing section and configured to sinter the functional layer, wherein the sintered functional layer exhibits a crystal lattice structure, and a transport mechanism (4) configured to move from the printing section to the sintering section. The first fixture is movable from one processing line A, B, C, D to another processing line A, B, C, D.

In some aspects, a flexible cable may comprise: a flexible strip with first and second parallel surfaces and first and second ends, said flexible strip being electrically insulating; a metal stripline within said flexible strip; first and second metallic grounding planes on said first and second surfaces, respectively; and a first circuit board mechanically attached to at least one of said first end of said flexible strip and said first and second metallic grounding planes at said first end, said first circuit board being mechanically stiff, said metal stripline being electrically connected to electrical circuitry on said first circuit board.

A module includes: a substrate including a first surface and including first and second sides; a component as a first component mounted on the first surface; a first sealing resin arranged to cover the first surface and the first component; and a first shield film. An inclined portion is formed in the substrate. The substrate includes a first lead electrode arranged to be exposed to the inclined portion along the first side, and a second lead electrode arranged to be exposed to the inclined portion along the second side, and each of these is connected to the first shield film. A height of the second lead electrode is different from a height of the first lead electrode.