A touch structure including an insulating substrate, an electromagnetic shielding structure layer, a sensing circuit structure layer, a first insulating layer, and a second insulating layer is provided. The electromagnetic shielding structure layer is disposed on the insulating substrate, and located between the insulating substrate and the sensing circuit structure layer. The sensing circuit structure layer is disposed on the insulating substrate, and includes a first sensing circuit layer and a second sensing circuit layer. The first insulating layer is disposed between the electromagnetic shielding structure layer and the first sensing circuit layer. The second insulating layer is disposed between the first sensing circuit layer and the second sensing circuit layer.

A multilayer wiring substrate according to the present invention includes a dielectric base body, a signal line in or on the dielectric base body, a ground conductor in the dielectric base body, and a graphite sheet in the dielectric base body. The dielectric base body is a laminate including dielectric sheets stacked on top of each other. The ground conductor and the signal line face each other in a stacking direction of the dielectric sheets. The ground conductor overlaps the signal line when viewed in plan in the stacking direction. The graphite sheet and the signal line face each other in the stacking direction without the signal line being located between the graphite sheet and the ground conductor. An upper surface of the graphite sheet is coplanar with an upper surface of the ground conductor or is located below the upper surface of the ground conductor.

A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements.

A LED lighting apparatus has a circuit board and a base. The base is a hollow structure. The base with lateral wall has a conducting element. The circuit board is in the base and has a LED power driving circuit and a LED source. The LED power driving circuit has a full-bridge rectification. A π-filter circuit and a non-isolated switch driving circuit connected in order. An output terminal of the non-isolated switch driving circuit is connected with the LED source. The full-bridge rectification, the π-filter circuit and the non-isolated switch driving circuit are common grounded to form a power ground. The power ground is electronically connected with the conducting element in order to reduce the interference of an electromagnetic energy generated by the high-frequency switch signal to other appliances.

A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

A flexible wiring circuit board includes a first insulating layer, a wire disposed at one side in a thickness direction of the first insulating layer, a second insulating layer disposed at one side in the thickness direction of the wire, a shield layer disposed at one side in the thickness direction of the second insulating layer, and a third insulating layer disposed at one side in the thickness direction of the shield layer. The shield layer includes an electrically conductive layer and two barrier layers sandwiching the electrically conductive layer therebetween in the thickness direction. The electrically conductive layer is selected from a metal belonging to a group 11, and the fourth period and the fifth period in the periodic table, and the barrier layer is selected from a metal belonging to groups 4 to 10, and the fourth to the sixth periods in the periodic table.

To obtain, in an on-board control device, a shield effect against noise radiated from an electronic component. The present invention includes: an electronic component 103; a metal housing 101 which covers at least a part of the electronic component 103; a metal portion 105 which is provided so that the electronic component 103 is disposed between the metal portion 105 and the metal housing 101; and a shield structure which shields radiation noise from the electronic component 103 by electrostatic capacitive coupling formed between the metal portion 105 and the metal housing 101.

A transmission line substrate includes a stacked body that includes insulating base materials, first and second signal lines, and first and second ground conductors. The second signal line is provided on a layer different from the layer of the first signal line and extends in parallel with the first signal line. The first ground conductor is provided on the same layer as the layer of the second signal line and overlapped with the first signal line when viewed in the Z-axis direction. The second ground conductor is provided on the same layer as the layer of the first signal line and overlapped with the second signal line when viewed in the Z-axis direction. A first transmission line includes the first signal line, the first ground conductor, and an insulating base material, and a second transmission line includes the second signal line, the second ground conductor, and the insulating base material.

A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements.

Technologies directed to vertical coupling structures for antenna feeds of phased array antennas are described. One circuit board includes a first layer with a first portion of a RF coupling structure, a second layer with a second portion of the RF coupling structure, and a first insulation layer located between the first layer and the second layer. The RF coupling structure is configured to electromagnetically couple a first conductive trace on the first layer and a second conductive trace on the second layer at RF frequencies. The circuit board also includes a third layer with a first antenna element and a second insulation layer located between the third layer and the first layer, the second insulation layer including a first via through which the first antenna element is coupled to the first conductive trace.