Provided are flexible hybrid interconnect circuits and methods of forming thereof. A flexible hybrid interconnect circuit comprises multiple conductive layers, stacked and spaced apart along the thickness of the circuit. Each conductive layer comprises one or more conductive elements, one of which is operable as a high frequency (HF) signal line. Other conductive elements, in the same and other conductive layers, form an electromagnetic shield around the HF signal line. Some conductive elements in the same circuit are used for electrical power transmission. All conductive elements are supported by one or more inner dielectric layers and enclosed by outer dielectric layers. The overall stack is thin and flexible and may be conformally attached to a non-planar surface. Each conductive layer may be formed by patterning the same metallic sheet. Multiple pattern sheets are laminated together with inner and outer dielectric layers to form a flexible hybrid interconnect circuit.

A printed circuit board includes a plurality of layers including conductive layers separated by dielectric layers, the conductive layers including a signal layer; and via patterns formed in the plurality of layers, each of the via patterns comprising first and second signal vias extending from a first surface of the printed circuit board to the signal layer, the signal layer including first and second signal traces connected to the first and second signal vias, respectively, the signal layer further including a ground conductor located between the signal traces and adjacent signal-carrying elements.

A charger comprises a housing, a first multi-layer printed circuit board (PCB), a second multi-layer PCB, and a third multi-layer PCB. The first PCB comprises at least a portion of a primary side circuit. The second PCB comprises at least a portion of a secondary side circuit. The third PCB is perpendicular to the first PCB and the second PCB. An isolation coupling element is disposed on the third PCB. The isolation coupling element comprises a multi-layer PCB. The first PCB comprises a high voltage (HV) semiconductor package. A surface of a die paddle of the HV semiconductor package is exposed from a molding encapsulation of the HV semiconductor package.

An electronic module with reduced electromagnetic interference radiation includes a multilayer printed circuit board having an electrically conductive outer layer and at least one electrically conductive inner layer, an electronic component, a heat sink and a plurality of thermal plated-through holes. The electronic component is disposed on and electrically connected to the outer layer. The heat sink is thermally connected to the multilayer printed circuit board by an electrical insulation layer. Heat generated during operation of the electronic component can be dissipated to the heat sink through the plurality of thermal plated-through holes. The plurality of thermal plated-through holes do not have an electrical connection to the outer layer.

A system for a three-dimensional (3D) printed circuit board (PCB) to printed circuit board interface is provided. A first PCB includes first landing pads disposed on one or more edges of the first PCB. The first landing pads electrically couple to conductive pins or second landing pads disposed on a second PCB. The second landing pads may be disposed in a slot in the second PCB. The interface between the first landing pads and the second landing pads may provide various advantages over traditional PCB to PCB interfaces, such as, improved signal integrity, improved power integrity, increased contact density, decreased clock jitter, etc.

A connector has a main portion formed as a part of a multilayer wiring board and having a tongue shape. The multilayer wiring board is provided with a surface conductive layer and an inner conductive layer. The inner conductive layer is located apart from and inward of the surface conductive layer in an up-down direction. The main portion is provided with a grounding plate formed in the surface conductive layer and a plurality of contacts formed in the inner conductive layer. Each of the contacts is, at least in part, exposed and contactable in the up-down direction. Since the grounding plate and the contacts are formed in the conductive layers of the multilayer wiring board, the connector can possess desired electric characteristics in high accuracy.

According to one embodiment, an electronic apparatus includes, for example, a casing having an opening with a perimeter, and a circuit board including a first surface facing away from the casing and a second surface facing the casing, a first conductor which extends over the opening in the casing and at least a portion of which is located over the first surface, a second conductor at least portion of which extends over the second surface and is exposed to the interior of the casing at the opening in the casing, and a third conductor extending through the first surface and the second surface and electrically connected to the first conductor and the second conductor at a location outward of the perimeter of the opening.

Millimeter wave (mmWave) technology, apparatuses, and methods that relate to transceivers, receivers, and antenna structures for wireless communications are described. The various aspects include co-located millimeter wave (mmWave) and near-field communication (NFC) antennas, scalable phased array radio transceiver architecture (SPARTA), phased array distributed communication system with MIMO support and phase noise synchronization over a single coax cable, communicating RF signals over cable (RFoC) in a distributed phased array communication system, clock noise leakage reduction, IF-to-RF companion chip for backwards and forwards compatibility and modularity, on-package matching networks, 5G scalable receiver (Rx) architecture, among others.

An electronic device and associated methods are disclosed. In one example, the electronic device includes a first device and a second device coupled to a surface of a substrate, and a continuous flexible shield woven over the first device and under the second device to separate the first device from the second device. In selected examples, the continuous flexible shield may be formed from a laminate and one or more of the devices may be coupled through an opening or via in the continuous flexible shield.

An electrical component includes an insulating base, an insulating layer provided outside the insulating base, a shielding member provided between the insulating base and the insulating layer, and multiple conductive bodies accommodated in the insulating base.

The conductive bodies include at least one power supply body. Each of the at least one power supply body is provided with a shielding layer outside the power supply body and an insulator between the power supply body and the shielding layer. The shielding layer is accommodated in the shielding member. In the electrical component, by providing a shielding layer and an insulator provided between the power supply body and the shielding layer outside the power supply body, shielding of the shielding layer from the power supply body is implemented, so as to reduce an interference of the power supply body on a signal body, thereby improving transmission quality of high-frequency signals.