A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

An antenna module includes a resin multilayer substrate including a plurality of base materials that are flexible. The resin multilayer substrate includes a rigid portion at which a first number of stacked layers of the base materials is relatively large and a flexible portion at which a second number of stacked layers of the base materials is relatively small. A radiating element including a conductor pattern is provided at the rigid portion. A transmission line including a conductor pattern and electrically connected to the radiating element is provided at the flexible portion. A frame-shaped conductor that surrounds the radiating element when viewed in a direction in which the base materials are stacked is provided at either the rigid portion or the flexible portion, or both the rigid portion and the flexible portion.

A circuit board has a flexible board with a principal surface, and a ground conductor provided in the flexible board. The flexible board is cut in at least one portion. The flexible board is bent using the cut portion, so that the flexible board has a first portion and a second portion at a different height from the first portion, and the ground conductor has a gap made by the cutting. At least one ground terminal is provided on the ground conductor near at least one end of the gap to electrically connect the circuit board to a ground provided in an external circuit.

A multilayer board includes a layered body including insulating base material layers that are laminated, and first and second signal lines, a first ground conductor including a first opening, a second ground conductor, a third ground conductor, and an interlayer connecting conductor. The first signal line overlaps the first opening when seen in a layering direction. The second signal line is provided on a layer different from a layer including the first signal line and includes a portion extending side by side with the first signal line when seen in the Z-axis direction. The first, second, and third ground conductors are connected by the interlayer connecting conductor. The third ground conductor is disposed on a layer including the first signal line or a layer positioned between the first signal line and the second signal line.

A display device is basically provided that comprises a display, two circuit boards, and a cable. The cable connects the circuit boards together and includes a sheet-form wiring component having a first face and a second face on the opposite side from the first face, a first insulating part that is disposed on the first face, and a shield component that is disposed on the first insulating part and shields electromagnetic waves. The cable has a bent part that is bent to a second face side. The angle α formed by a direction towards one end of the wiring component from the bent part and a direction towards the other end of the wiring component from the bent part is 0°<α<180°.

The present disclosure relates to a printed circuit board and a module including the same. The printed circuit board includes an insulating body, a wiring pattern embedded in the insulating body, and a first conductor pattern disposed on the insulating body and overlapping at least a portion of the wiring pattern in a first direction. First conductive vias each penetrate a portion of the insulating body and are respectively disposed on opposite sides of the wiring pattern, in a second direction orthogonal to the first direction, to surround at least a portion of the wiring pattern. Each first conductive via has a first surface connected to the first conductor pattern, and a second surface, opposite to the first surface, connected to the insulating body.

A method for manufacturing an interconnect structure and an interconnect structure are provided. The method includes: forming an opening in a substrate; forming a low-k dielectric block in the opening; forming at least one via in the low-k dielectric block; and forming a conductor in the via. The interconnect structure includes a substrate, a dielectric block, and a conductor. The substrate has an opening therein. The dielectric block is present in the opening of the substrate. The dielectric block has at least one via therein. The dielectric block has a dielectric constant smaller than that of the substrate. The conductor is present in the via of the dielectric block.

An interconnect structure includes a substrate, a dielectric block, and a conductor. The dielectric block is in the substrate. A dielectric constant of the dielectric block is smaller than a dielectric constant of the substrate, and the dielectric block and the substrate have substantially the same thickness. The conductor includes a first portion extending from a top surface to a bottom surface of the dielectric block and a second portion extending along and contacting the top surface of the dielectric block.

The present disclosure provides a flexible circuit board and a display panel. The flexible circuit board is in a non-display region of a display panel and provided with a driving circuit for driving the display panel thereon. The flexible circuit board includes a first main body portion, a second main body portion, and a foldable portion, and the foldable portion is between the first main body portion and the second main body portion. The foldable portion is capable of being bent to fold the second main body portion such that the second main body portion overlaps the first main body portion.

On a circuit board configured to transmit a signal, a pulse transformer is provided on a path used for transmitting the signal of the circuit board. A shield member is provided on the circuit board to prevent noise, which is generated due to noise current flowing in a noise line pattern, from entering the pulse transformer. The shield member covers a part of a surface of at least one pulse transformer, the part intersecting concentric circles (which represent a magnetic field generated by the noise current) whose central axis extends along the direction in which the noise current flows.