The present invention provides a photosensitive resin composition with which a dry resist film can be obtained, the dry resist film exhibiting excellent storage stability and migration resistance in thickness direction thereof. This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; and a thermosetting agent. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80 C. or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. In formula (1), R.sup.1, R.sup.2, X.sup.1, X.sup.2, and n are as defined in the description.

This photosensitive resin composition comprises: a photosensitive prepolymer having a carboxyl group and an ethylenically unsaturated group; a photopolymerization initiator; a thermosetting agent; and a pigment. The thermosetting agent is a polycarbodiimide compound represented by formula (1), in which a carbodiimide group is protected by an amino group that dissociates at temperatures of 80 or greater. The polycarbodiimide compound has a weight average molecular weight of 300-3000, and a carbodiimide equivalent weight of 150-600. When formed into a film having a dry film thickness of 10-40 m, the maximum value of the transmittance of the photosensitive resin composition is at least 7% for the transmission spectrum of at least some of the wavelength from 350-430 nm. (In formula (1), R.sup.1, R.sup.2, X.sup.1, X.sup.2, and n are as defined in the description.)

Noise derived from electromagnetic coupling due to size reduction of an element mounting substrate is reduced. In an embodiment of the present disclosure, an element mounting substrate includes an insulation layer, an input wiring line and an output wiring line disposed on the insulation layer, and a ground layer disposed on the insulation layer, located around the input wiring line and the output wiring line, and including an exposed region where the insulation layer is exposed. The exposed region of the ground layer overlaps a region where the input wiring line and the output wiring line are close to each other. A SAW element is mounted on the element mounting substrate. With this configuration, the noise derived from the electromagnetic coupling generated between the input wiring line and the output wiring line can be reduced, and measurement accuracy can be improved.

Provided are an organic light-emitting display device and a method of manufacturing the same. The organic light-emitting display device includes a panel including a display unit on which an image is formed and a pad unit including a plurality of terminals connected to the display unit and arranged in a plurality of rows on a substrate, and a flexible circuit board including metal wirings arranged in a plurality of layers so as to be respectively connected in correspondence to the plurality of rows of terminals in the pad unit and being coupled to the pad unit, in which the pad unit includes a one-row terminal zone in which only terminals in a single row from among the plurality of rows of terminals electrically connect the metal wirings to the display unit.

Provided are an electronic device including: a wiring board having a mounting surface; a ground electrode that defines a ground region on the mounting surface; an electronic component that is located on the mounting surface and is disposed in the ground region; a conductive component that is disposed adjacent to an outer edge of the ground electrode; an internal insulating protective layer that is disposed in the ground region and covers the electronic component; an external insulating protective layer that is disposed outside the ground region and covers the conductive component; and an electromagnetic wave shielding layer that is provided to extend over the internal insulating protective layer and the ground electrode and that covers the internal insulating protective layer and is electrically connected to the ground electrode, the electromagnetic wave shielding layer being a solidified product of an ink for forming an electromagnetic wave shielding layer, and a manufacturing method thereof.

Disclosed herein is a pattern safety device for preventing interference between patterns. In detail, a separately partitioned space is defined in an adhesion portion, which is formed on a plurality of patterns on the surface of a substrate so that a circuit element is placed on the adhesion portion, thus preventing interference between the patterns.

A printed wiring board includes a first conductor layer including a first conductor circuit and a second conductor circuit formed adjacent to the first circuit, a resin insulating layer formed on the first conductor layer such that the insulating layer is filling space between the first and second conductor circuits, and a second conductor layer formed on the insulating layer such that distance (T) between the first and second conductor layers is in the range of 4.5 m to 10.5 m. The resin insulating layer includes inorganic particles having average particle diameter (D1) such that ratio (D1/S) of the diameter (D1) to distance (S) of the space is less than 0.25 and that ratio (D1/T) of the diameter (D1) to the distance (T) is less than 0.25, where the distance (S) of the space between the first and second conductor circuits is in the range of 4.5 m to 10.5.

A wiring board according to the present disclosure includes a core insulating layer, a first laminated body located on an upper surface of the core insulating layer, and a second laminated body located on a lower surface of the core insulating layer. Each of the first laminated body and the second laminated body has a structure in which at least four electrical conductor layers and at least three build-up insulating layers are alternately located. The electrical conductor layers include two types, that are a first electrical conductor layer and a second electrical conductor layer. In the electrical conductor layers in the first laminated body, at least a first outermost layer and a first innermost layer are the first electrical conductor layers, and a first intermediate layer located farther from the core insulating layer than the first innermost layer includes at least two or more of the second electrical conductor layers.

A power supply device of an electronic apparatus includes: a power input portion configured to receive alternating current (AC) power; a rectifier-smoother configured to rectify and smooth the received AC power and output the AC power; a power converter configured to convert a level of a voltage output from the rectifier-smoother to supply operating power to the electronic apparatus; a board on which the power input portion, the rectifier-smoother, and the power converter are provided; and a waterproof coating layer formed in an area on the board corresponding to a position of the power converter to prevent infiltration of moisture from an outside.

A circuit board is disclosed that includes a plurality of circuit board layers located one on top of the other. The plurality of circuit board layers includes a topmost circuit board layer and a bottommost circuit board layer, wherein the topmost circuit board layer forms a top of the circuit board, wherein the bottommost circuit board layer forms a bottom of the circuit board, and wherein the plurality of circuit board layers together forms an end circuit-board edge that runs perpendicularly to the top and the bottom of the circuit board. The end circuit-board edge is provided with a coating made of an insulating material.