Patent classifications
H05K2201/0761
COVERLAY AS PRINTED CIRCUIT BOARD (PCB) VOLTAGE INSULATOR UNDER CONNECTORS
A circuit board system includes a printed circuit board (PCB) having a first side and a second side opposite the first side. A plurality of plated through holes (PTHs) are defined through the PCB from the first side to the second side. A respective pad is defined at each end of each PTH of the plurality of PTHs. The PCB includes circuit traces electrically interconnecting among the plurality of PTHs for forming PCB circuitry. A coverlay is adhered to the first side of the PCB for insulating voltages among the plurality of PTHs.
Component Carrier, Component Carrier Arrangement and Method of Manufacturing the Component Carrier
A component carrier, a component carrier arrangement, and a method of manufacturing the component carrier are disclosed. The component carrier includes a stack having i) at least one electrically insulating layer structure and at least one electrically conductive layer structure on top of the electrically insulating layer structure; and ii) at least one lateral wall. The electrically insulating layer structure includes a first edge portion defining at least partially the lateral wall of the stack. The electrically conductive layer structure includes a second edge portion being offset with respect to the first edge portion towards the inner part of the stack, in particular by a distance in the range between 0.05 m and 15 m.
Printed Circuit Board Creep Corrosion Sensor and Sensing Method
A creep corrosion sensor and sensing method including and utilizing: a central pad electrode disposed on a first surface of a printed circuit board (PCB or PCBA); an outer ring electrode disposed concentrically around the central pad electrode on the first surface of the PCB; where the central pad electrode and the outer ring electrode define a creep corrosion area therebetween on the first surface of the PCB; and resistance monitoring means electrically coupled to the central pad electrode and the outer ring electrode and adapted to measure a resistance of the creep corrosion area as affected by creep corrosion present in the creep corrosion area. In an embodiment, a plurality of creep corrosion sensors having varying creep corrosion area gap widths are utilized in a creep corrosion sensor coupon assembly on the PCB to determine an estimated time-to-failure of a component or product utilizing the PCBA.