A coating for mitigating metal whiskers on a metal surface includes a polymeric coating material; and a metal ion complexing agent impregnated within the polymeric coating material, the metal ion complexing agent having a standard reduction potential) (E°) that is greater than a metal in the metal surface.

A transparent conductor including a transparent substrate, a first dielectric layer, a metal layer containing silver or a silver alloy as a primary component, a second dielectric layer composed of a semiconductor, and a third dielectric layer of which electrical conductivity is different from that of the second dielectric layer in the order presented, wherein the third dielectric layer-is composed of a conductor.

Semiconductor layers useable for minimizing or preventing the growth of metal whiskers, as well as devices and methods utilizing the same and kits for making the same, are described. The semiconductor layers may be nickel oxide layers. In some embodiments, an electronic device may include a substrate, a first metal layer on the substrate, a semiconductor layer comprising NiO on the first metal layer, and a second metal layer on the semiconductor layer. In some embodiments, an electronic device may include a substrate, a semiconductor layer comprising NiO directly on the substrate, and a metal layer directly on the semiconductor layer. A method for making an electronic device may include depositing a semiconductor layer comprising NiO on a substrate, and depositing a metal layer on the semiconductor layer, where the semiconductor layer substantially prevents the growth of whiskers on the metal layer.

A coating for mitigating metal whiskers on a metal surface includes a polymeric coating material; and a metal ion complexing agent impregnated within the polymeric coating material, the metal ion complexing agent having a standard reduction potential (E) that is greater than a metal in the metal surface.

A process of improving resistance to conductive anodic filament (CAF) formation is disclosed. The process includes dissolving a base resin material, a lubricant material, and a coupling agent in a solvent to form a functionalized sizing agent solution. The process also includes applying the functionalized sizing agent solution to individual glass fibers following a glass fiber formation process. The process further includes removing the solvent via a thermal process that partially converts the base resin material. The thermal process results in formation of coated glass fibers having a flowable resin coating that is compatible with a pre-impregnated (prepreg) matrix material utilized to form a prepreg material for manufacturing a printed circuit board. During one or more printed circuit board manufacturing operations, the flowable resin coating flows to fill voids between the individual glass fibers that represent CAF formation pathways.

A flexible wiring board (a first wiring board) includes: an insulating substrate which is flexible; a first terminal which is conductive and is disposed on the insulating substrate; a second terminal which is conductive and is disposed on the insulating substrate; and a no-connection (NC) terminal which is conductive and is disposed on the insulating substrate between the first terminal and the second terminal. The first terminal, the NC terminal, and the second terminal are arranged at a uniform pitch in an arranging direction that is predetermined, and a width of the NC terminal in the arranging direction is smaller than a width of the first terminal in the arranging direction and a width of the second terminal in the arranging direction.

A thermally conductive board comprises a metal substrate, a foil containing copper, a thermally conductive and insulating layer and a barrier layer. The thermally conductive and electrically insulating layer is disposed on the metal substrate. The barrier layer is laminated between the foil containing copper and the thermally conductive and electrically insulating layer. The barrier is in direct contact with the foil containing copper, and the interface between the barrier layer and the foil containing copper comprises a microrough surface. The barrier layer has a Redox potential between 0 and 1V. The microrough surface has a roughness Rz of 2-18 m.

An electrical apparatus that includes: an electronic substrate having a plurality of pads for connecting to an electronic component placed on the electronic substrate; a shield placed on a surface of the electronic substrate, the shield having a plurality of openings with the plurality of openings aligned over the plurality of pads and at least a portion of each of the plurality of openings being conductive; connection means to connect the conductive portions of each of the plurality of openings to a fault detect and error handling circuit; and the fault detect and error handling circuit to detect a short circuit between at least one of the conductive portions and the pad aligned with the opening containing the at least one of the conductive portions.

The semiconductor package includes a package substrate. The package substrate includes a base layer, a first group of conductive lines disposed on a first surface of the base layer, and a second group of conductive lines disposed on a second surface of the base layer and electrically connected to respective ones of the first group of conductive lines. The package substrate further includes a plating lead line connected to one of the first group of conductive lines.

A transparent conductor including a transparent substrate, a first dielectric layer, a metal layer containing silver or a silver alloy as a primary component, a second dielectric layer composed of a semiconductor, and a third dielectric layer of which electrical conductivity is different from that of the second dielectric layer in the order presented, wherein the third dielectric layer-is composed of a conductor.