The border routing of conductive traces in devices, such as displays, touch sensor panels, and touch screens, to improve border area space usage, thereby reducing device size, and to reduce trace resistance, thereby improving device operation, is disclosed. The conductive traces can form a staggered stair-step configuration in the device border area, in which the average widths of the traces can be different from each other and each trace can have segments with different widths. The conductive traces can be coupled to an active area of the device to transmit signals to and from the active area in accordance with a device operation. The varying widths can help improve the border area space usage, reduce trace resistance, and reduce the differences in resistance between traces.

Systems and methods described herein relate to an adapter driver board for parallel operation of power modules. The systems and methods receive an electrical signal at an input interface of a high voltage adapter board. The systems and methods may deliver the electrical signals to first and second switches along corresponding first and second conductive traces. The first conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the first switch. The second conductive trace extends along the high voltage adapter board and is conductively coupled to the input interface and the second switch. The first and second conductive traces may have an inductance or other property that is substantially the same as each other.

A multilayer ceramic capacitor may include a ceramic body having first to third dielectric layers, first and third internal electrodes disposed to be partially exposed to an upper surface of the ceramic body, second and fourth internal electrodes disposed to be partially exposed to a lower surface of the ceramic body, internal resistance electrodes disposed on the third dielectric layers and partially exposed to the upper surface of the ceramic body, first and third external electrodes disposed on the ceramic body to be connected to the first and third internal electrodes, second and fourth external electrodes disposed to be connected to the second and fourth internal electrodes. The first and third external electrodes are electrically connected to each other by the internal resistance electrodes.

The border routing of conductive traces in devices, such as displays, touch sensor panels, and touch screens, to improve border area space usage, thereby reducing device size, and to reduce trace resistance, thereby improving device operation, is disclosed. The conductive traces can form a staggered stair-step configuration in the device border area, in which the average widths of the traces can be different from each other and each trace can have segments with different widths. The conductive traces can be coupled to an active area of the device to transmit signals to and from the active area in accordance with a device operation. The varying widths can help improve the border area space usage, reduce trace resistance, and reduce the differences in resistance between traces.

Disclosed is an electronic device having a display region and a peripheral region adjacent to the display region. The electronic device includes a first electrode disposed in the display region, a second electrode disposed in the display region, a circuit module disposed in the peripheral region, a first electrical trace, and a second electrical trace electrically insulated from the first electrical trace. The circuit module is electrically connected to the first electrode through the first electrical trace and provides a first driving voltage to the first electrical trace. The circuit module is electrically connected to the second electrode through the second electrical trace and provides a second driving voltage to the second electrical trace, and the first driving voltage is different from the second driving voltage. In a top view, the first electrical trace at least partially overlaps the second electrical trace.

A semiconductor device includes first semiconductor chips that each include a first control electrode and a first output electrode, second semiconductor chips each include a second control electrode and a second output electrode, first and second input circuit patterns on which the first and second input electrodes are disposed, respectively, first and second control circuit patterns electrically connected to the first and second control electrodes, respectively, first and second resistive elements, and a first inter-board wiring member. The first control electrodes and first resistive element are electrically connected via the first control circuit pattern, the second control electrodes and second resistive element are electrically connected via the second control circuit pattern, and at least one of the first output electrodes and at least one of the second output electrodes are electrically connected to each other via the first inter-board wiring member.