A transformer includes a primary winding and a secondary winding, which are flat, and a magnetic core that has a middle leg that passes through the primary and secondary windings, a first core that is connected to one end along the length direction of the middle leg, and a second core that is connected to the other end along the length direction. A first wall surface on the side of the first core where the middle leg is positioned and a second wall surface on the side of the second core which faces the first wall surface are formed so as to be parallel, the primary winding is fixed to the first wall surface, the secondary winding is fixed to the second wall surface, and the distance between the primary winding and the secondary winding is kept constant.

A wiring board includes a pair of hard substrates provided for each of a plurality of semiconductor elements connected in parallel; a soft substrate provided so as to be at least partially sandwiched between all of the pairs of hard substrates; a first electrode configured to connect a control terminal of the semiconductor element and the hard substrate or the soft substrate; a second electrode configured to connect a reference potential terminal of the semiconductor element and the hard substrate or the soft substrate; a first wiring configured to connect in parallel the first electrodes of each of the plurality of semiconductor elements, at least part of the first wiring being provided on the soft substrate; and a second wiring configured to connect in parallel the second electrodes of each of the plurality of semiconductor elements, at least part of the second wiring being provided on the soft substrate.

A transformer includes a core portion having a magnetic property and having a through hole formed therein, and a first coil portion formed with a first circuit board on which circuit patterns are printed on one surface thereof, having a shape enclosing a part of the core portion while penetrating the through hole of the core portion, and formed to be bent so that both side end portions of the first circuit board are connected to each other.

An electric module with a planar transformer has a housing with an interior having an internal length and an internal height. The electric module additionally has a main printed circuit board with a first thickness, the main printed circuit board being equipped with at least one electronic component. The planar transformer is arranged on an additional printed circuit board with a second thickness, and the main printed circuit board has a recess which receives the additional printed circuit board. Additionally, the main printed circuit board and the additional printed circuit board are connected together via a connection.

The device may include a core. The device may include built-up layers arranged over the core. The device may also include a ground path disposed in a first built-up layer of the built-up layers. The device may also include a power path disposed in a second built-up layer of the built-up layers. The device may also include a multi-terminal capacitor on a top layer of the built-up layers. The multi-terminal capacitor may be coupled to the ground path and the power path through respective vias passing through the built-up layers. The respective vias may be arranged to alternate such that respective vias coupled to the power path neighbor a respective via coupled to the ground path.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure/s within urban settings, each configured to operate by a processor/controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data/instruction/s processing the inputs with resident code parameters generating outputs that are configured to mitigate/avert intermittent environmental events harmful/hazardous to humans.

An integrated magnetic component is disclosed in this application, which includes an integrated magnetic core and a PCB winding, and there are even-number layers of PCB windings. The integrated magnetic core includes M magnetic pillars that are symmetrically distributed, and every two of the M magnetic pillars form one group. On each layer of PCB winding, a current path is divided into M paths around the M magnetic pillars; after every two of the M current paths are combined, a current obtained through combination flows around one magnetic pillar in each group of magnetic pillars by N turns, and flows around the other magnetic pillar in each group of magnetic pillars by N turns.

System, methods, and other embodiments described herein relate to using a printed conductor and a rectifier in the same enclosure for transferring power. In one embodiment, an apparatus includes a conductor, printed on a substrate housed in an enclosure, that generates alternating current caused by a magnetic field emitted by a transmitter, wherein the conductor is a trace spanning layers. The apparatus also includes a rectifier, on a device housed in the enclosure, that receives the alternating current through a terminal connected with the conductor and converts the alternating current to a direct current for powering a load, wherein an insulator between the conductor and the rectifier isolates the magnetic field.

A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.

A circuit device formed from a functional substrate. The circuit device comprises a functional substrate component and printed electronic elements formed on the functional substrate component. The printed electronic elements formed on the functional substrate component interact with the substrate component to perform a function and to modify the functional substrate component. The circuit device typically needs a passive base material that takes no functional part in the device operation except mechanical support.