A power module and a power device having the power module are disclosed. The power device includes a main board. The power module is inserted in the main board and includes a PCB, a magnetic element, a primary winding circuit and at least one secondary winding circuit. The magnetic element is provided on the PCB and includes a core structure, a primary winding and at least one secondary winding. The core structure has a first side and a second side opposite to each other, and a third side and a fourth side opposite to each other. The primary winding circuit is provided on the PCB and positioned in the vicinity of the first or second side of the core structure. The secondary winding circuit is provided on the PCB and positioned in the vicinity of the third or fourth side of the core structure.

An electromagnetic component for a circuit board includes first and second magnetic core pieces and a bifilar coil extending between the first and second magnetic core pieces. The bifilar coil includes a first coil segment having first and second surface mount terminations, and a second coil segment having third and fourth surface mount terminations. The bifilar coil and core pieces facilitate a significant height reduction in the component while offering the same performance as existing power inductor components.

An electronic board, in particular for a power electronics circuit such as a converter, comprises: a planar substrate having a first side and a second side opposite the first side; at least two magnetic core elements, called the first elements, arranged on the first side of the substrate and each having at least two legs passing through the substrate; and at least two windings, arranged around at least one leg of each first magnetic core; wherein: it also comprises a second magnetic core element in the form of a plate, arranged on the second side of the substrate and in contact with respective ends of the legs of at least two first elements; the first elements, the windings and the second element forming at least two mutually decoupled magnetic circuits.

A module includes a wiring board, an insulating layer that is laminated on the bottom surface of the wiring board, a ring-shaped coil core that is embedded in the insulating layer, a coil electrode that is wound around the coil core, electronic components that are disposed in an inner region surrounded by the coil core in the insulating layer, and an electronic component that is mounted on or in the top surface of the wiring board. With this configuration, the areas of main surfaces of the wiring board and main surfaces of the insulating layer are not large, whereas if the electronic components were mounted on or in the top surface of the wiring board, the areas of the main surfaces of the wiring board and the main surfaces of the insulating layer would be large, and a reduction in the size of the module can be facilitated.

An inductor component includes first and second inductor wiring lines, a first vertical wiring line, a second vertical wiring line, and a third vertical wiring line, wherein the first vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the first inductor wiring line, respectively, and the third vertical wiring line and the second vertical wiring line are connected to the first end portion and the second end portion of the second inductor wiring line, respectively.

Disclosed is a motherboard comprising at least one printed circuit board (PCB), referred to as the motherboard PCB, at least one planar transformer, which is mounted on the motherboard PCB, and a plurality of electronic components, which are also mounted on the motherboard PCB. The planar transformer comprises at least one printed circuit board with windings and a connection interface, a magnetic core arranged on the printed circuit board so as to interact with the windings, and at least one electronic component mounted on the printed circuit board.

Apparatuses, systems and methods associated with a substrate assembly with an encapsulated magnetic feature for an inductor are disclosed herein. In embodiments, a substrate assembly may include a base substrate, a magnetic feature encapsulated within the base substrate, and a coil, wherein a portion of the coil extends through the magnetic feature. Other embodiments may be described and/or claimed.

A semiconductor package includes a VLSI semiconductor die and one or more output circuits connected to supply power to the die mounted to a package substrate. The output circuit(s), which include a transformer and rectification circuitry, provide current multiplication at an essentially fixed conversion ratio, K, in the semiconductor package, receiving AC power at a relatively high voltage and delivering DC power at a relatively low voltage to the die. The output circuits may be connected in series or parallel as needed. A driver circuit may be provided outside the semiconductor package for receiving power from a source and driving the transformer in the output circuit(s), preferably with sinusoidal currents. The driver circuit may drive a plurality of output circuits. The semiconductor package may require far fewer interface connections for supplying power to the die.

A planar transformer employing an insulating structure for performance improvement includes: a pair of ferrite cores (110) including an upper core (110-1) and a lower core (110-2); a printed circuit board (120), which is disposed between the pair of ferrite cores (110), one end of which has primary via holes (121) electrically connecting primary coil patterns, and the other end of which has secondary via holes (123) electrically connecting secondary coil patterns; an insulating block (130-1) for receiving one side of the pair of ferrite cores (110); and an insulating base (130-2) disposed in the pair of ferrite cores (110) and fittedly coupled to the insulating block (130-1), wherein the insulating block (130-1) and the insulating base (130-2) receive a given region of the printed circuit board (120) at one side at which the secondary via holes (123) is disposed.

An inductor sensor assembly for determining to position of object includes a layer of ferrite overlaying exciting and receiving coils formed on a substrate. A magnet attached to the target produces a virtual coupler in an area of ferrite overlaying the coils. An application for a shock absorber includes a sensor module mounted in a recess in a dust cover and a magnet mounted to a cylinder tube of the shock absorber.