A metal-ceramic bonded substrate is such that a heat dissipating face is formed in a spherical protruding form, because of which contact pressure with a thermally conductive grease when attaching a heat dissipating fin to the heat dissipating face is high, and high heat dissipation can be secured. Also, by an overflow portion communicating with a metal base portion formation portion being provided farther to an outer side than an external form of the metal-ceramic bonded substrate in an interior of a casting mold, an overflow portion residue is restricted by the casting mold when causing molten metal to solidify and cool, because of which warping deformation occurring because of a difference between linear expansion coefficients of a metal material and a ceramic material can be restricted, and a casting defect such as a running defect in a molten metal flowing process, cold shut, a ripple mark, can be restricted.

A light-emitting cooling fan has a fan frame having a frame body and a shaft seat, the frame body having an upper edge and a lower edge, the shaft seat being disposed in the frame body; a motor pivotally disposed on the shaft seat; a blade disposed on the motor; an upper light-guiding ring disposed in the frame body and at the upper edge of the frame body; a plurality of upper light-emitting units disposed in the frame body, spaced apart, and adapted to illuminate the upper light-guiding ring; a lower light-guiding ring disposed in the frame body and at the lower edge of the frame body; and a plurality of lower light-emitting units disposed in the frame body, spaced apart from the upper light-emitting units, and arranged to alternate with the upper light-emitting units, respectively, wherein the lower light-emitting units are higher than the upper light-emitting units, respectively.

One aspect relates to a method for producing an electronic module assembly. According to the method, a curable first mass extending between a substrate assembly and a module housing is cured while a circuit carrier of the substrate assembly has at least a first temperature. Between a side wall of the module housing and the substrate assembly, an adhesive connection is formed by curing a curable second mass. Subsequent to curing the first mass, the circuit carrier is cooled down to below a second temperature lower than the first temperature. Embodiments of the electronic module assembly are also described.

A method for manufacturing an assembly (10) is disclosed. The assembly (10) comprises a substrate (1) having a first surface (3) and a second surface (4). The substrate (1) is at least partially plastically deformable. The assembly (10) comprises a supporting surface (5) arranged to support at least a portion of the second surface (4). The substrate (1) is plastically deformed, thereby producing an elastic preload in at least a portion of the substrate (1). The substrate (1) is fixedly arranged in the assembly (10) such that the second surface (4) is placed against the supporting surface (5), wherein the elastic preload in the at least a portion of the substrate (1) produces a force between the at least a portion of the second surface (4) and the supporting surface (5), whereby the at least a portion of the second surface (4) becomes in abutment with the supporting surface (5) over the at least a portion of the second surface (4). A light source comprising the assembly (10) is also disclosed.

The present subject matter relates to the method of manufacturing circuit having lamination layer using LDS (Laser Direct Structuring) to ease the application on surface structure for applied product of various electronic circuit and particularly, in which can form circuit structure of single-layer to multiple-layer on the surface of injection-molded substrate in the shape of plane or curved surface, metal product, glasses, ceramic, rubber or other material.

An apparatus and method wherein the method comprises: a deformable substrate; a curved support structure configured to support at least a portion of a resistive sensor wherein the resistive sensor comprises a first electrode, a second electrode and a resistive sensor material provided between the electrodes; at least one support configured to space the curved support structure from the deformable substrate so that when the deformable substrate is deformed the curved support structure is not deformed in the same way; wherein the resistive sensor is positioned on the curved support structure so as to limit deformation of the resistive sensor when the deformable substrate is deformed.

Embodiments of light-emitting multilayer structures incorporating substrate films 3D-formed with recesses for light sources and plastics material molded thereupon are presented. Related methods of manufacture are set forth as well.

A constant-current controller that supplies a constant-current to a solenoid driver for use with an electromechanical device. The controller comprises a PCB containing a constant-current control circuit. The circuit comprises a GaNFET primary switch and a secondary switch. The PCB is integrated with and made a part of the solenoid driver. A standard electromechanical device may be converted to a constant-current controlled electromechanical device by exchanging the solenoid driver.

A method of forming a component module is disclosed. A base is provided, the base being electrically conductive. An insulative layer is also provided on the base, with a first area being substantially free of the insulative layer. First and second traces are provided on the insulative layer adjacent the first area, with these traces extending therefrom. A die is positioned on the first area and electrically connected to the first and second traces. Finally, a protective layer is provided over the die.

An electronic circuit is made by selectively depositing an electrically conductive material seed layer conformally upon a three-dimensional substrate via the plurality of apertures of a three-dimensional mask. The substrate is then plated with more of the same electrically conductive material, or a different electrically conductive material, on the seed layer. In the case of electroplating, a nonconductive support structure is incorporated into a conductive clamp for making electrical connection to the seed layer. An environmentally protective layer may be deposited upon the electrically conductive material to such an extent that the electronic circuit remains solderable. The three-dimensional mask may be fabricated by an additive manufacturing technique.