A corner transition module includes a module case, a LED PCB board, a curved face cover. The LED PCB board is set in the space defined between the module case and the curved face cover. The module case is mounted on a LED installing position. A plurality of LED installing holes is provided on the curved face cover to couple with the LEDs on the LED PCB board. The corner transition module solves the problem that two flat display screens being angularly connected in resulting in a display defects with a black line at the connecting corner. With the corner transition module, the non-planar screens are seamlessly connected to form a perfect full-screen display effect in high-performance graphics display without any black line.

A support back plate and a curved display device are disclosed. The support back plate including a first end and a second end in opposition to each other, wherein the support back plate is bent into a shape of an arc face; and a thickness in the middle region of the support back plate is greater than that at the first end and the second end. The above-mentioned support back plate is used in a curved display device to solve the problem of a usual curved display device with more thickness and weight.

The present disclosure provides a display module and a method for coating the same, which can prevent and/or reduce the occurrence of black seam between display modules that are arranged adjacent to each other. According to an example aspect of the present disclosure, a display module includes a printed circuit board; a plurality of luminous elements arranged at predetermined intervals on the printed circuit board; and a coating layer comprising a coating disposed between the respective luminous elements, disposed around side surfaces of the respective luminous elements positioned at an outermost, and formed to have a height that is substantially equal to a height of the side surfaces of the luminous elements, the coating being configured to block side light of the respective luminous elements.

A transmission line substrate includes a stacked body that includes insulating base materials, first and second signal lines, and first and second ground conductors. The second signal line is provided on a layer different from the layer of the first signal line and extends in parallel with the first signal line. The first ground conductor is provided on the same layer as the layer of the second signal line and overlapped with the first signal line when viewed in the Z-axis direction. The second ground conductor is provided on the same layer as the layer of the first signal line and overlapped with the second signal line when viewed in the Z-axis direction. A first transmission line includes the first signal line, the first ground conductor, and an insulating base material, and a second transmission line includes the second signal line, the second ground conductor, and the insulating base material.

The curved-type rigid board includes: a main sheet layer capable of maintaining a curved state with a certain curvature; a first adhesive layer formed on the main sheet layer; a sub sheet layer bonded onto the main sheet layer by the first adhesive layer while the sub sheet layer forms a line structure having diagonal lines, which do not match directions of horizontal and vertical lines of the mesh structure of the thermosetting resin of which the main sheet layer is made, in order for the main sheet layer to have rigidity to maintain the curved state; a second adhesive layer formed on the sub sheet layer; and a pattern forming layer bonded onto the sub sheet layer by the second adhesive layer.

A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

A method for fabricating a smart ring includes receiving a printed circuit board having a processor, a memory, a temperature sensor, a wireless transceiver and a perturbation sensor, receiving a power source with a first radius of curvature within a range of 7 mm to 15 mm, coupling the printed circuit board and the power source together to form a first assembly with the first radius of curvature, encapsulating the first assembly to form a second assembly with a second radius of curvature wherein the first radius is larger than the second radius, and wherein the second assembly includes a plurality of physical anchors, determining a first ring size from a plurality of ring sizes, and coupling a band to the second assembly via the plurality of physical anchors to form an enclosed circle-like shape in response to the first ring size, wherein the band is characterized by the second radius.

A semiconductor package attached to a curved display panel includes a semiconductor chip, having a top surface and a bottom surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel, a flexible cover layer attached to the top surface of the semiconductor chip, and an underfill material formed between the semiconductor chip and the curved flexible film, and wherein the top surface of the semiconductor chip is planar.

Interface arrangement comprising an electrical node type component for providing electrical or electromagnetic connection between an external system and a host structure of the interface arrangement. The interface arrangement comprising a first substrate film defining a cavity. A first material layer arranged to at least partly fill the cavity and to embed or at least partly cover at least one electrical element at least partly arranged into the cavity. The at least one electrical element comprises at least a converter element configured for adapting signals to be transferred between the external system and electronics of the host structure. A first connection element arranged at least partly into the cavity and configured for connecting to the external system. The first connection element is further at least functionally connected to the converter element. Related multilayer structures and methods of manufacture are presented.

Methods of transferring an electrically conductive material to a substrate are disclosed. The methods include: a) contacting at least a portion of the substrate with an electrically conductive material disposed on a carrier film; and b) applying heat and pressure to the substrate and carrier film for a period of time ranging from 1 to 40 seconds, at a temperature ranging from 200? F. to 450? F., and at a pressure ranging from 30 to 150 psi, such that the electrically conductive material adheres to the substrate. Methods of forming a layered structure are also disclosed.