An electronic device comprising: a substrate having a curved surface, a printed circuit board, and plural flexible wiring substrates, each of two of the plural flexible substrates has a terminal portion that is connected to the curved surface, the printed circuit board has a cutout between the two flexible wiring substrates.

A printed circuit board includes a core layer having a first surface and a second surface opposing the first surface; a first built-up structure disposed on the first surface of the core layer; a second built-up structure disposed on the second surface of the core layer; and a first penetration portion penetrating the first built-up structure and the core layer and penetrating a portion of the second built-up structure. The first penetration portion has a step portion on at least a portion of a wall of the first penetration portion in the region of the first penetration portion penetrating the second built-up structure, and a region including the first penetration portion on a plane is configured as a flexible region.

An electronic module is provided for a power tool having an electric motor. The module includes a printed circuit board (PCB) having a first surface and a second surface; first set of power switches mounted on the first surface of the PCB; second set of power switches mounted on the PCB and electrically coupled to the first power switches forming an inverter bridge circuit for driving the electric motor; a first heat sink surface-mounted on the first surface of the PCB and having a planar main body disposed over the first power switches; a module housing arranged to receive the PCB therein; and a second heat sink secured to the module housing in thermal communication with the first heat sink to transfer heat from the first power switches.

A system for heating substrates comprising LEDs arranged in a plurality of concentric circles is disclosed. The system comprises an array of light emitting diodes (LEDs) disposed in a two-dimensional grid, where there are a set of rows, and each row comprises a plurality of LEDs configured in parallel. This configuration is fault tolerant, allowing one or more LEDs to be inoperable, without affecting any of the other LEDs. Further, the LEDs are arranged in concentric circles, allowing uniform heating of the substrate. Additionally, in certain embodiments, the LEDs and signal traces are arranged so that a single layer circuit board may be used. A method of creating this array of LEDs is also disclosed.

An electronic module is provided for a power tool having an electric motor. The electronic module includes a printed circuit board (PCB) being substantially disc-shaped; power switches mounted on the PCB forming an inverter bridge circuit for driving the electric motor; a controller mounted on the PCB and configured to control a switching operation of the power switches; positional sensors mounted on the PCB substantially equidistantly from a center of the PCB within the control portion and in communication with the controller to provide positional signals related to a rotational position of the electric motor to the controller; and a module housing arranged to receive the PCB therein. The module housing includes a planar portion in parallel to the PCB and openings disposed in the planar portion angularly around a center of the module housing to receive the positional sensors therein.

A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited.

An LED lamp having a metal PCB bent polyhedrally and a method for manufacturing the LED lamp is provided, where a base constituting the metal PCB has a rectangular or geometric shape and is configured to have a plurality of base stepped grooves formed spaced apart from each other on the underside thereof in such a manner as to be bent upward or downward from the base to form reflection surfaces continuously, so that at the time when both ends of the base come into contact with the plane, the base has a geometric shape in which the base is located in space through the reflection surfaces continuously arranged.

A interconnection system includes a panel side kit and a wall-mount kit coupled with each other and secured together via magnetic forces. The wall-mount kit includes a printed circuit board enclosed within a bracket and defining a center region for power transmission and a pair of side regions for high speed transmission. In the side regions, on the coupling side a plurality of wireless transmission units are located while on the back side a plurality of ROSA OE modules are provided to transfer the optical signal from optical fibers to the electronic signal for wireless transmission wherein the optical fibers are linked to a control box via a plurality of TOSA EO modules. The panel side kit includes wireless receiving units that interact with the wireless transmission units, and a plurality of connectors with the body of the display.

A semiconductor package attached to a curved display panel includes a semiconductor chip, having a top surface and a bottom surface, disposed on a curved flexible film, wherein the curved flexible film is disposed on the curved display panel, a flexible cover layer attached to the top surface of the semiconductor chip, and an underfill material formed between the semiconductor chip and the curved flexible film, and wherein the top surface of the semiconductor chip is planar.

A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.