A data storage device is disclosed comprising a base casting forming a housing, wherein components within the housing comprise a first disk, a first head, and a first printed circuit board (PCB) being curved to substantially follow an arc of a first part of a shroud that surrounds at least part of the first disk. The first PCB has mounted thereon a first integrated circuit comprising a first microprocessor configured to actuate the first head over the first disk in order to access the first disk.

[Object] To provide a component-mounting device capable of inhibiting the quality from lowering due to deformation of the circuit board and an electronic apparatus including the same.

[Solving Means] A component-mounting device according to an embodiment of the present invention includes a component-mounting board, a connector component, and a heat sink. The component-mounting board includes a first surface and a second surface opposite to the first surface. The connector component is provided on the first surface. The heat sink faces the second surface and includes a first supporting portion that is held in contact with the second surface within a region that faces the connector component with the component-mounting board interposed between the region and the connector component.

A structure includes a first transparent conductive layer, a second transparent conductive layer, and an insulation layer disposed between the first transparent conductive layer and the second transparent conductive layer. A light source having a first node and a second node may have its first node electrically coupled to the first transparent conductive layer and its second node electrically coupled to the second transparent conductive layer. A via running though one of the transparent conductive layers may facilitate electrical routing to the light source.

A method for producing a wired circuit board including an insulating layer and a conductive pattern, including (1), providing the insulating layer having an inclination face; (2), providing a metal thin film at least on the surface of the insulating layer; (3), providing a photoresist on the surface of the metal thin film; (4), disposing a photomask so that a first portion, where the conductive pattern is provided in the photoresist, is shielded from light, and the photoresist is exposed to light through the photomask; (5), removing the first portion to expose the metal thin film corresponding to the first portion; and (6), providing the conductive pattern on the surface of the metal thin film exposed from the photoresist. The inclination face has a second portion that allows the light reflected at the metal thin film to reach the first portion.

A rollable display device is disclosed. The rollable display device includes a rollable display panel, a roller configured to roll and unroll the rollable display pane, and a first printed circuit board electrically connected to the rollable display panel. The first printed circuit board comprises a curved surface having a curvature that matches a curvature of a curved surface of the roller. The first curved surface of the printed circuit board is in contact with the curved surface of the roller.

A method to plastically deform a flexible conductive element (1) wherein is provided a device (11) configured to expand the volume thereof, wherein the method comprises the steps of arranging the flexible conductive element (1) at least partially around said device (11); expanding the volume of the device (11) up to a predetermined value, whereby at least one portion (8) of the flexible conductive element (1) which is in contact with the device (11) during the expansion of the device (11) is plastically deformed.

An LED light apparatus includes a back cover, a surrounding wall, a light source and a surface ring. The back cover has a top side and a back cover inner side. The surrounding wall is connected to the back cover. The light source is fixed to an inner wall side of the surrounding wall. The surface ring has a surface ring inner side connected to the surrounding wall. The surface ring inner side, the inner wall side and the back cover inner side form a light movement space. The back cover inner side has a three-dimension curve surface for reflecting light to the light opening of the surface ring.

A composite part comprising an electronic device and method for making the same. A primer is deposited on a surface of the composite part. An electronic device comprising a group of conductive elements is deposited on the primer. An embodiment may include the group of conductive elements within a layer of material co-bonded to the composite part. Power may be supplied to a device connected to the composite part through current flowing through the group of conductive elements.

An LED light apparatus includes a back cover, a surrounding wall, a light source and a surface ring. The back cover has a top side and a back cover inner side. The surrounding wall is connected to the back cover. The light source is fixed to an inner wall side of the surrounding wall. The surface ring has a surface ring inner side connected to the surrounding wall. The surface ring inner side, the inner wall side and the back cover inner side form a light movement space. The back cover inner side has a three-dimension curve surface for reflecting light to the light opening of the surface ring.

A method for making conformal non-planar multi-layer circuitry is described. The method can include providing a substrate having a non-planar surface and depositing a first conformal dielectric layer on the substrate, the first conformal dielectric layer conforming to the non-planar surface of the substrate and having a non-planar surface. The method can also include applying a first conformal circuitry layer on the first conformal dielectric layer. The method can include depositing a second conformal dielectric layer on the first conformal circuitry layer, the second conformal dielectric layer conforming to a non-planar surface of the first conformal circuitry layer, and applying a second conformal circuitry layer on the second conformal dielectric layer. Successive layers can be sequentially deposited. Microvias may provide electrical connections between circuit layers.