A printed circuit board may include a top side, a bottom side, and a circumferential surface that connects the top side to the bottom side. The circumferential surface may have a toothing for forming a gear wheel. The toothing may be circumferentially closed and may be arranged over an entire surface area of the circumferential surface. The toothing may be configured as an involute toothing, an epicycloid toothing, a hypocycloid toothing, or a lantern gear toothing. The printed circuit board may be formed of fiber-reinforced plastic. Further, the printed circuit board may include a track, a surface structure, and/or a conductor track configured for inductive sampling, capacitive sampling, optical sampling, and/or acoustic sampling.

A conductive structure of a massage roller includes a working circuit board, a conductive base, a conductive plate, two first conductive parts and two second conductive parts. The working circuit board and the conductive plate are positioned at upper and lower ends of the conductive base respectively. The conductive base is provided with at least a pair of accommodating cavities, and conductors are placed in the accommodating cavities. The two first conductive parts are positioned on the bottom surface of the working circuit board, and the first conductive parts are connected with the working circuit board. The two second conductive parts are positioned on the top surface of the conductive plate, and the second conductive parts are connected with the conductive plate; and the top surfaces of the conductors abut against the two first conductive parts, and the bottom surfaces of the conductors abut against the two second conductive parts.

A light ranging system including a shaft having a longitudinal axis; a light ranging device configured to rotate about the longitudinal axis of the shaft, the light ranging device including a light source configured to transmit light pulses to objects in a surrounding environment, and detector circuitry configured to detect reflected portions of the light pulses that are reflected from the objects in the surrounding environment and to compute ranging data based on the reflected portion of the light pulses; a base subsystem that does not rotate about the shaft; and an optical communications subsystem configured to provide an optical communications channel between the base subsystem and the light ranging device, the optical communications subsystem including one or more turret optical communication components connected to the detector circuitry and one or more base optical communication components connected to the base subsystem.

An ultra capacitor module includes a first ultra capacitor having a first polar terminal provided with a screw thread A formed on an outer peripheral surface, a second ultra capacitor having a second polar terminal provided with a screw thread A formed on an outer peripheral surface, and a connecting member having a screw hole B formed corresponding to the screw thread A on an inner peripheral surface through which the first polar terminal is inserted from one side and the second polar terminal is inserted from the other side to connect the first and second ultra capacitors in series and having a gas emission hole formed from a center to an outer surface.

A motor stator includes a stator core, a winding wound around the stator core, and a circuit board connected with the winding. The circuit board forms a through hole. The through hole has an opening formed at an outer edge of the circuit board. A wire terminal of the winding slides into the through hole via the opening, and a distal end of the wire terminal is bent and soldered to a surface of the circuit board after passing through the through hole.

Various embodiments provide a light emitting diode (LED) module, an LED lighting device comprising an LED module, and methods for manufacturing an LED module and/or an LED lighting device. In one embodiment, the LED lighting device comprises a housing comprising a metal shell and defining a central opening; and an LED module having one or more LEDs mounted about a periphery of a first surface of the LED module. The LED module is oriented and retained within the central opening of the housing such that the first surface faces out of the central opening. Furthermore, the LED module is secured to the housing via the metal shell.

An axial field rotary energy device has a PCB stator panel assembly between rotors with an axis of rotation. Each rotor has a magnet. The PCB stator panel assembly includes PCB panels. Each PCB panel can have layers, and each layer can have conductive coils. The PCB stator panel assembly can have a thermally conductive layer that extends from an inner diameter portion to an outer diameter portion thereof.

A mounting device for mounting a multi-segmented flexible printed circuit board includes: a circular stage on which a display substrate provided with a plurality of sub-pads and a multi-segmented flexible printed circuit board attached to a side of the display substrate are configured to be placed; and a pressing unit arranged adjacent to the circular stage and configured to press and attach the multi-segmented flexible printed circuit board to the plurality of sub-pads of the display substrate.

An electronic system includes first and second circuit boards and a flexible circuit connector. The flexible circuit connector is configured to electrically connect the first and second circuit boards. The flexible circuit connector includes first and second connectors and a spiral portion. The first connector is configured to connect to the first circuit board. The second connector is configured to connect to the second circuit board. The spiral portion is connected between the first and second circuit boards and includes a circumferential portion that extends around the second connector.

A stack chip package may include a plurality of stacked semiconductor chips. Each of the semiconductor chips may have a first node, a second node, a third node and a fourth node corresponding to corners of the semiconductor chip. The plurality of semiconductor chips may be sequentially stacked such that, when a semiconductor chip is disposed directly on another semiconductor chip, the first node of the semiconductor chip is positioned over a side between the first node and the second node of the another semiconductor chip.