An electrical conveyance assembly includes a substrate that may include an electrically insulating material. The electrical conveyance assembly may include a plurality of electrical conductors connected to the substrate via additive manufacturing. The substrate may include an internal lattice structure formed via additive manufacturing. The substrate may include an internal fluid channel.

The present disclosure provides a power supply module used in a smart terminal and a power supply module assembly structure, the power supply module includes a substrate having first and second surfaces opposite to each other; a power passive element, an active element and a plurality of first conductive parts disposed at the substrate; the power passive element being independently disposed on the first surface of the substrate as a whole; wherein a maximum height of the power passive element disposed on the first surface of the substrate is greater than a sum of a maximum height of an element disposed on the second surface of the substrate and an half of the thickness of the substrate.

Multilayer articles that include electrical circuits are prepared by the adhesive transfer of electrical circuit elements to the surface of an adhesive. A number of different methodologies are used, with all of the methodologies including the use of simple layers of circuit-forming material on a releasing substrate and structuring to generate circuit elements which can be transferred to an adhesive surface. In some methodologies, a structured releasing substrate is used to selectively transfer circuit-forming material, either from protrusions on the releasing substrate or from depressions on the releasing substrate. In other methodologies, an unstructured releasing substrate is used and either embossed to form a structured releasing substrate or contacted with a structured adhesive layer to selectively transfer circuit-forming material.

Disclosed is a wiring board including: an insulating substrate; a plurality of connection terminals arranged on the insulating substrate; and a plurality of non-conductive protruding parts respectively arranged on areas of the insulating substrate except areas on which the plurality of connection terminals are arranged. The non-conductive protruding parts has a height greater than that of the connection terminals.

Electrical connector assemblies mountable on a tire of a wheel of a vehicle are described. An electrical connector assembly may include one or more electrical conductors, a respective electrical conductor extending from an inside surface of the tire to an outside surface of the tire. Tire assemblies including at least partially embedded electrical connector assemblies and wheel assemblies including such tire assemblies are also described.

A substrate with an antenna according to the present disclosure includes a circuit board having one main surface and the other main surface, and an antenna element mounted on the one main surface of the circuit board. When viewed from a thickness direction, an area of the one main surface of the circuit board is larger than an area of the other main surface, and the antenna element is mounted on at least a part of a region that is on the one main surface of the circuit board and that protrudes from the other main surface.

A solar panel module has a flexible circuit board, a matrix of solar cells surface mounted thereto, a coverglass extending over the matrix of solar cells and the flexible circuit board bonded to a rigid support panel. The circuitry including electrical connection pads in an arrangement on the first side surface for electrical connection of the circuitry to each of the matrix of solar cells, flat bypass diodes may be disposed on the first side surface under the cells and connecting to the circuitry. Conductive adhesives adhering each of the solar cells to the flex circuit at the electrical connection pads that correlate to electrical connection points on underside of each solar cells. The first side having a plurality of standoffs for receiving each of the matrix of solar cells providing raised levels for the solar cells, the landing portions projecting outwardly from a base level surface.

A manufacturing method of a component embedded package carrier includes the following steps: providing the dielectric layer; a first copper foil layer and a second copper foil layer; forming a plurality of through holes; forming a conductive material layer on the first copper foil layer and the second copper foil layer; patterning the conductive material layer, the first copper foil layer and the second copper foil layer, thereby defining the conductive through hole structures, the first patterned conductive layer and the second patterned conductive layer and forming the core layer comprises; disposing at least one electronic component inside the opening of the core layer; laminating a first insulating layer and a first circuit layer located on the first insulating layer onto the first patterned conductive layer; laminating a second insulating layer and a second circuit layer located on the second insulating layer onto the second patterned conductive layer.

A substrate that is stretchable; wiring positioned on a first surface side of the substrate, the wiring having a meandering shape section including peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The substrate has a component region and a wiring region adjacent to the component region. The component region includes a component-fixing region overlapping an electronic component mounted on the wiring board when viewed along the normal direction of the first surface of the substrate and a component-surrounding region positioned around the component-fixing region. The stretching control mechanism is positioned in the component-surrounding region and at least includes a stretching control part that spreads to the border between the component-surrounding region and the component-fixing region.

A substrate that is stretchable and that at least has a wiring region; wiring at least positioned in the wiring region on a first surface side of the substrate, the wiring having a meandering shape section that includes peaks and valleys aligned along a first direction that is one of planar directions of the first surface of the substrate; and a stretching control mechanism that controls extension and contraction of the substrate. The stretching control mechanism at least includes stretching control parts that are positioned in the wiring region of the substrate and that are aligned along the first direction.