Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

The present invention relates to a metallic nano structure including a plurality of metallic nano materials; and a junction locally disposed in a region where the metallic nano materials adjacent to each other among the plurality of metallic nano materials are in contact with each other in order to bond the adjacent metallic nano materials.

A printed wiring board for camera module includes: first and second mounting regions for first and second image pickup devices respectively provided on one and the other sides in a front surface of the printed wiring board, the first and second mounting regions respectively provided with first and second conductive patterns configured to be electrically connected to the first and second image pickup devices, respectively, and a component mounting region provided between the first mounting region and the second mounting region, the component mounting region provided with a third conductive pattern, the third conductive pattern configured to be electrically connected to a signal processing component, amounting density of the third conductive pattern in the component mounting region being higher than that of the first conductive pattern in the first mounting region or a mounting density of the second conductive pattern in the second mounting region, in a plan view.

Techniques and mechanisms for providing thermal insulation with a circuit board. In an embodiment, a circuit board comprises a metal core and an electrical insulator disposed thereon. A first portion and a second portion each comprise at least five percent of the metal core by volume, wherein a first surface of the first portion is at a first level along a height axis, and a second surface of the second portion is at a second level along the height axis. A difference between the first level and the second level is less than, and at least twenty percent of, an overall thickness of the metal core. In another embodiment, the metal core further comprises a trench portion disposed between the first portion and the second portion, wherein a thickness of the trench portion is less each of the respective thicknesses of the first portion and the second portion.

Examples of a thermal management unit and an electronic apparatus utilizing the thermal management unit are described. In one aspect, the thermal management unit includes a heat sink. The heat sink includes a base portion, a first protrusion structure and a second protrusion structure. The base portion has a first side and a second side opposite the first side. The first protrusion structure protrudes from the first side of the base portion, and includes multiple fins. The second protrusion structure protrudes from the second side of the base portion, and includes multiple ribs. The heat sink may be made of silicon.

A high current switch, in particular for a motor vehicle, having a first bus bar, a second bus bar in addition to a first semi-conductor switch that has a control connection and a first transmission connection as well as a second transmission connection. The first transmission connection is placed in direct contact with the first bus bar and the second transmission connection is placed in direct electric contact with the second bus bar.

Provided are a metal PCB, a headlight module having the metal PCB applied thereto, and a method for assembling the headlight module, wherein the metal PCB has a base made of a metal material and configured as a thin plate, or the base has a predetermined thickness and is bent in a desired direction through a bending groove formed on the rear surface thereof, and the base has a plurality of chip mounting portions integrated thereon such that one or more LED chips are mounted thereon, the chip mounting portions being spaced at a predetermined interval and having at least two parts of incision surfaces formed on one side of the base such that the chip mounting portions are inclined and installed to have a predetermined angle with regard to the base.

Techniques for providing plant growth lights with improved performance and cost are discussed herein. Some embodiments may provide for a light emitting diode (LED) flip chip chip-on-board (COB) module for optimizing plant growth, including: a circuit board; ultraviolet (UV) LED flip chips connected to the circuit board; a royal-blue phosphor or fluorescent layer covering a first portion of the UV LED flip chips; and a deep-red phosphor or fluorescent layer covering a second portion of the UV LED flip chips. The royal-blue phosphor or fluorescent layer absorbs UV light generated by the first portion of the UV LED flip chips and converts the UV light into broad-band light in royal-blue spectrums. The a deep-red phosphor or fluorescent layer absorbs UV light generated by the second portion of the UV LED flip chips and converts the UV light into broad-band light in deep-red spectrums.

A stretchable circuit board includes: a stretchable portion 50 that includes a stretchable base 53 haying stretchability and a stretchable wiring 55 formed on a first main surface 53a of the stretchable base 53 and having stretchability; and a non-stretchable portion 30 that includes a base substrate 34 having stretchability lower than that of the stretchable base 53 and a draw-out wiring 35 formed on a main surface 32b of the base substrate 34, in which the main surface 53a of the stretchable portion 53 and the main surface 32b of the base substrate 34 are joined with each other, and the stretchable wiring 55 and the draw-out wiring 35 are electrically connected with each other. In addition, the main surface 32b of the base substrate has a rough surface with projections and depressions.