The invention relates to a circuit arrangement, comprising at least one wiring carrier plate (1), characterized by at least one separating element (2) formed in the wiring carrier plate (1), which separating element divides the wiring carrier plate (1) into sections separated by the separating element (2), wherein the transfer of vibrations from one section to another section is at least partially decoupled and/or damped by the separating element (2). The invention further relates to a converter having such a circuit arrangement, and to an aircraft having a converter. The converter can comprise capacitor stacks (3) arranged on the wiring carrier plate (1), and power semiconductors (6).

An electronic element mounting substrate includes a first substrate that has a first main surface, has a rectangular shape, and has a mounting portion for an electronic element on the first main surface, and a second substrate that is located on a second main surface opposite to the first main surface, is made of a carbon material, has a rectangular shape, has a third main surface facing the second main surface and a fourth main surface opposite to the third main surface, in which the third main surface or the fourth main surface has heat conduction in a longitudinal direction greater than heat conduction in a direction perpendicular to the longitudinal direction, and that has a recessed portion on the fourth main surface.

A semiconductor device, including a semiconductor module, a positioning member and a printed board. The semiconductor module includes a case that stores a semiconductor chip, a plurality of external terminals electrically connected to the semiconductor chip and extending upward from a front surface of the case, and a reference pin extending upward from the front surface of the case. The positioning member has a reference hole and a plurality of supporting holes penetrating therethrough. The printed board including a plurality of terminal holes that respectively correspond to the plurality of external terminals. The printed board is disposed on the front surface of the case via the positioning member. The plurality of external terminals of the semiconductor module are respectively attached to the plurality of terminal holes.

An interconnect for connecting a first electronic circuit to a second, external stretchable electronic circuit device comprises: conductive lines of the first electronic circuit arranged in a plane; connectors configured to define an overlap in the plane between each end of the conductive lines with a corresponding end of stretchable conductive lines providing an electrical connection between the conductive lines and the stretchable conductive lines over the entire overlap; and at least one anchoring structure for providing an anchoring of the first electronic circuit with the second, external stretchable electronic circuit device, wherein the at least one anchoring structure provides anchoring transverse to the plane in anchoring positions on opposite sides of the overlap.

An electric motor, at least having a stator and an annular rotor which are arranged next to one another along an axial direction; wherein the stator has a plurality of stator teeth which are arranged next to one another along a circumferential direction and which each extend along the axial direction. At least one coil has at least one turn is arranged on each stator tooth, wherein the at least one turn is electrically conductively connected to a printed circuit board. The printed circuit board is arranged on an end side of the stator and next to the stator along the axial direction. The printed circuit board comprises a plurality of electrical connecting lines via which the at least one turn of each coil is connected at least to other turns or to an electrical connection of the motor.

A busbar module includes: a plurality of busbars arranged along a first direction and connected to battery cells; and a plate-like circuit body having a plurality of detection lines to be connected to the busbars and having flexibility, in which the circuit body includes a main line portion in which the plurality of detection lines is routed and branch portions, branching from the main line portion and in which the detection lines to be connected to the busbars are routed, the branch portions each include a stretchable portion that is stretchable along the first direction, the stretchable portions each have slits or a cutout formed in a direction intersecting the first direction in a plan view of the circuit body, and a detection line of each of the stretchable portions is routed along the slits or the cutout.

Circuit apparatus are disclosed. An example circuit apparatus includes a body including a plurality of first traces formed on the body, and a plurality of openings formed through the body and located between respective ones of the first traces. The openings provide airflow to a fan module of an electronic device through the body of the circuit apparatus.

The embodiments of the present disclosure provide a chip on flex (COF), a touch assembly, and a display device. The chip on flex includes a flexible base provided with a first opening, the flexible base includes a bonding area provided with a plurality of metal bonding pads; on the flexible base, a spacing area with a preset range is provided between the first opening and the bonding area; wherein, the flexible base is provided with a reinforcement sheet thereon, the reinforcement sheet is located on a portion of the flexible base other than the first opening, the spacing area and the bonding area.

A circuit board with reduced dielectric losses enabling the movement of high frequency signals includes an inner circuit board and two outer circuit boards. The inner circuit board includes a first conductor layer and a first substrate layer. The first conductor layer includes a signal line and two ground lines on both sides of the signal line. The first substrate layer covers a side of the first conductor layer and defines first through holes which expose the signal line. Each outer circuit board includes a second substrate layer and a second conductor layer. The second substrate layer abuts the inner circuit board and defines second through holes which are not aligned with the first through holes, partially surrounding the signal line with air which has a very low dielectric constant. A method for manufacturing the high-frequency circuit board is also disclosed.

A vehicular camera includes a lens holder accommodating a lens and an imager printed circuit board (imager PCB). The lens holder includes a plurality of posts protruding from an attaching portion of the lens holder. The imager PCB includes an imager disposed at a first side of the imager PCB, and includes a plurality of apertures therethrough. The attaching portion of the lens holder is positioned at the imager PCB such that the posts protrude through the apertures of the imager PCB. The posts are movable within the apertures while the lens is adjusted relative to the imager to align the lens relative to the imager. With the lens aligned relative to the imager, the posts are heated to deform within the apertures, whereby the deformed posts harden upon cooling to secure the lens holder relative to the imager PCB.