A device comprises a package substrate and a ball grid array (BGA). The package substrate encapsulates an integrated circuit (IC) die and comprises a signal launch configured to emit or receive a signal on a surface of the package substrate. The BGA is affixed to the surface and comprises a set of grounded solder balls arranged as a boundary around the signal launch. The device may further comprise a printed circuit board (PCB) substrate having a waveguide interface side opposite a secondary waveguide side and a through-hole cavity that extends from the waveguide interface side to the secondary waveguide side, perpendicular to a plane of the PCB substrate. The BGA couples the package substrate to the waveguide interface side such that the surface of the package substrate faces the through-hole cavity and the signal launch and through-hole cavity are substantially aligned.

A substrate for mounting an electronic component includes a base material including insulating resin, a first conductor layer formed on first surface of the material, a second conductor layer formed on second surface of the material, and a metal block inserted into a hole penetrating through the first conductor, material and second conductor such that the metal block is fitted in the hole. The material has a bent portion in contact with the metal block in the hole such that the bent portion is bending toward the second conductor, the metal block has surface on first conductor side such that the surface has an outer peripheral portion having a curved-surface shape, and the hole has a first fitting inlet on the first conductor layer side and a second fitting inlet on second conductor side and that the metal block is positioned in contact with the second fitting inlet.

According to one embodiment, there is provided a printed circuit board including a substrate having a trench between a first region and a second region. The first region is a region where a first package is to be mounted. The second region is a region where a second package is to be mounted. The trench has an opening portion in at least one of a first main surface and a second main surface of the substrate. The first main surface is a surface on which the first package is placed. The second main surface is positioned on reverse side of the first main surface of the substrate.

The invention describes a circuit assembly comprising a circuit board with a metal core, a pattern of conductive tracks, and a dielectric layer between the metal core and the conductive tracks; at least one circuit component mounted to the circuit board by means of solder interconnects, wherein a solder interconnect is formed between a contact pad of the circuit component and a conductive track; characterized in that the metal core comprises at least one cavity, wherein a cavity is arranged in the vicinity of a solder interconnect. The invention further describes a circuit board for such a circuit assembly, and a method of manufacturing such a circuit assembly.

A circuit having a printed circuit board and at least one multilayer ceramic capacitor (MLCC) is described, characterized in that the printed circuit board has at least one opening in the region of the projection of the MLCC on the printed circuit board. The opening is not filled with any material and in the event of the MLCC malfunctioning it essentially prevents heat from accumulating between the MLCC and the printed circuit board

A printed circuit board with embedded component includes a double-sided printed circuit board, an electronic component, a plurality of conductive paste blocks, an insulating layer and a wiring layer near the first wiring layer, an insulating layer and a wiring layer near the second wiring layer. The double-sided printed circuit board comprising a first wiring layer, a base, and a second wiring layer. The first wiring layer and the second wiring layer are arranged on opposite sides of the base. The second wiring layer includes a plurality of electrical contact pads. The base defines a number of conductive vias. Each electrical contact pad is aligned with and electrically connected to one corresponding conductive via. The conductive paste blocks are electrically connecting to the conductive vias. The electronic component is electrically connected to the conductive paste blocks. The two insulating layers cover the electronic component and the second wiring layer.

A motor stator includes a stator core, a winding wound around the stator core, and a circuit board connected with the winding. The circuit board forms a through hole. The through hole has an opening formed at an outer edge of the circuit board. A wire terminal of the winding slides into the through hole via the opening, and a distal end of the wire terminal is bent and soldered to a surface of the circuit board after passing through the through hole.

An electronic component mounting device includes an insulating substrate having a metal pattern formed thereon and a MELF electronic component. The MELF electronic component is fitted into a first receiving portion configured with the metal pattern and the insulating substrate exposed from a lacking portion of the metal pattern. The electronic component mounting device further includes a conductive member formed between the MELF electronic component and the metal pattern, and the conductive member is not formed between the MELF electronic component and the insulating substrate.

A suspension board with circuit includes a first terminal and a second terminal disposed at spaced intervals to each other, a piezoelectric element disposed between the first terminal and the second terminal so as to be electrically connected to the first terminal and the second terminal, a facing portion facing the piezoelectric element at the second terminal-side relative to the center between the first terminal and the second terminal, and a compensation portion compensating a degree of inclination of the piezoelectric element produced at the time of contact of the facing portion with the piezoelectric element at the first terminal-side relative to the center between the first terminal and the second terminal.

An exemplary bridging inter-connector establishes electrical connections between conductors on a PCB and aligned conductors on a first board mounted to the PCB. A flexible non-conductive sheet covers at least a portion of these conductors. Separated conductive strips on the sheet that are dimensioned to align with and engage at least a portion of both the aligned conductors. A thin film of a bonding agent is disposed on the separated conductive strips and located to engage at least a portion of both aligned conductors to form a conductive connection.