A display panel and a display apparatus containing the display panel are disclosed. The display panel includes a substrate, a circuit structure, and a first bonding adhesive. The substrate has a first bonding area. The circuit structure has a second bonding area that opposingly faces the first bonding area. The first bonding adhesive is arranged between, and configured to contact the first bonding area and the second bonding area. At least one of the first bonding area or the second bonding area comprises at least one first indentation. The first bonding adhesive at least partially fills one or more of the at least one first indentation.

A display device includes: a lower substrate including a first area, and a second area surrounding the first area; a display layer including a plurality of display elements at the second area, and having a first hole corresponding to the first area; and an upper substrate covering the display layer. The upper substrate includes a lower surface facing the lower substrate, and the lower surface of the upper substrate has a first groove corresponding to the first area.

A semiconductor package that includes a circuit board having an opening therein. The circuit board includes a first portion, and a second portion disposed below the first portion. The first portion protrudes further in a horizontal direction towards the opening than the second portion. A transparent substrate is disposed on the circuit board. An image sensor chip is mounted on the circuit board. The image sensor chip includes an active array region facing the transparent substrate. A connection terminal directly contacts a lower surface of the first portion of the circuit board and an upper surface of the image sensor chip. A gap-fill member covers the connection terminal and covers a portion of an upper surface of the image sensor chip and at least a portion of a lateral side surface of the image sensor chip. The transparent substrate has a greater horizontal width than the circuit board.

A display apparatus includes a display panel, a printed circuit board defining an upper surface, a lower surface opposite the upper surface, and a through-hole, a plurality of light sources mounted on the upper surface of the printed circuit board and configured to emit light to the display panel, and a connector inserted into the through-hole on the upper surface of the printed circuit board. The connector includes a connector body inserted into the through-hole, and a plurality of connector terminals disposed in proximity to the upper surface of the printed circuit board. The connector terminals are configured to electrically connect the connector body to a portion of the printed circuit board, and may in certain embodiments connect a first portion of the printed circuit board on one side of the connector body to a second portion of the printed circuit board on an opposite of the connector body.

A structure includes a main substrate including a first surface and a second surface opposite to the first surface, a power supply module on the main substrate, a socket in the main substrate, and one or more power supply wirings and one or more signal wirings extending in a thickness direction of the main substrate and penetrating the socket. Each of the one or more power supply wirings includes a first end on the first surface side and a second end on a side opposite to the first end. Each of the one or more signal wirings includes a third end to be electrically connected to an electronic component and a fourth end on a side opposite to the third end. The fourth end is electrically connected to a conductor pattern on the first surface.

A camera module is provided. A camera module according to one aspect of the present invention comprises: a substrate comprising a window; an image sensor coupled to the lower surface of the substrate; and a filter coupled to the upper surface of the image sensor and arranged on the window.

An electrical connector including an insulating body, a plurality of terminals disposed in the insulating body, a first metallic shell enclosing the insulating body to form an interface for being plugged by another electrical connector, and a second metallic shell is provided. The first metallic shell has a first soldering leg close to the interface, and the second metallic shell encloses the first metallic shell, wherein the first soldering leg extends away from the insulating body, penetrates the second metallic shell and protrudes out of the second metallic shell.

An inlay for a component carrier includes a gas-permeable porous layer structure, an upper layer structure, arranged on the gas-permeable porous layer structure, the upper layer structure defining a cavity such that a portion of the gas-permeable porous layer structure is exposed and an upper metal layer structure arranged on the upper layer structure. A component carrier with the inlay and manufacturing methods of the inlay and the component carrier are described.

A circuit structure includes a first busbar, a wiring board located on the first busbar and having an open hole, a conductive raised part protruding into the open hole from the first busbar, and a first electronic component having a first connection terminal located on the wiring board. The first connection terminal is electrically connected to the raised part in the open hole.

Disclosed herein are microelectronic assemblies, as well as related apparatuses and methods. For example, in some embodiments, a microelectronic assembly may include a substrate having a surface including a first cavity; a first die at least partially nested in the first cavity and electrically coupled to the substrate; and a circuit board having a surface including a second cavity, wherein the surface of the substrate is electrically coupled to the surface of the circuit board, and wherein the first die extends at least partially into the second cavity in the circuit board.