An electronic component module includes a first board comprising a component insertion portion, at least one heat-generating component mounted on a first surface of the first board and in which at least a portion of an active surface is exposed through the component insertion portion, a radiating component inserted into the component insertion portion and mounted on the active surface of the heat-generating component, a second board mounted on a second surface of the first board and configured to electrically connect the first board to an external source, and a connection conductor disposed on an inactive surface of the radiating component and configured to allow contact between the inactive surface of the radiating component and a main board.

A semiconductor device, including a first board, a second board having a plurality of through holes passing therethrough, and a plurality of external terminals that are respectively press-fitted into the plurality of through holes of the second board, one end portion of each external terminal passing through the corresponding through hole and being fixed to a front surface of the first board. The second board is a printed circuit board that further includes, in a top view thereof, a plurality of support regions, each having one of the plurality of through holes formed therein, and a plurality of buffer regions respectively surrounding the plurality of support regions, each buffer region having at least one buffer hole and at least one torsion portion formed therein, the at least one torsion portion being connected to the support region surrounded by each buffer region.

Systems and methods are provided for monitoring object placement on a surface. The system includes a pressure-sensitive conductive sheet. The pressure-sensitive conductive sheet includes a stretchable fabric, having a plurality of fibers, and a conductive material positioned on a plurality of adjoining fibers of the stretchable fabric. The system further includes a 3-dimensional structure positioned under the pressure-sensitive conductive sheet. The 3-dimensional structure includes one or more depressions onto which the stretchable fabric can be stretched and the conductive material is positioned over the one or more depressions.

A camera module is provided, including a lens driving mechanism, a lens unit, a circuit board, and an image sensor. The lens unit is disposed on the lens driving mechanism. The image sensor is disposed on the circuit board. The circuit board includes a metal member, an insulation layer, and a metal wire. The insulation layer is disposed between the metal member and the metal wire, and the metal wire is electrically connected to the image sensor. The lens driving module can drive the lens unit to move relative to the image sensor. The image sensor can catch the light through the lens unit.

Provided is an electronic device. The electronic device includes a cover allowing an external signal to pass therethrough, a circuit board provided on one side of the cover and having a first opening allowing the external signal to pass therethrough, and a sensing unit provided on one side of the circuit board and having a sensor part provided at a position corresponding to the first opening to receive the external signal. An electronic device according to the present invention may be associated with an artificial intelligence module, robot, augmented reality (AR) device, virtual reality (VR) device, and device related to 5G services.

A substrate connection member according to various embodiments of the present invention can comprise a printed circuit board which has a plurality of layers that are stacked and which comprises a front surface, a rear surface, and a side surface encompassing the front surface and the rear surface. The printed circuit board can comprise: an opening part which encompasses a partial region of the printed circuit board and which is penetratingly formed from the front surface to the rear surface; at least one bridge connected between the partial region and the printed circuit board by crossing at least a portion of the opening part; and at least one through-hole wire formed in the partial region from the front surface to the rear surface, wherein the inner surface of the opening part and the side surface of the bridge can be formed from a conductive member. Other various embodiments, in addition to the embodiments disclosed in the present invention, are possible.

A power electronics assembly may include a power component having a thermally and electrically conductive surface; a printed circuit board having a slot; and a bussing element having a protrusion that directly contacts the thermally and electrically conductive surface of the power component via the slot of the printed circuit board, the printed circuit board being disposed between the power component and the bussing element.

Provided is a terminal device, including a photosensitive element, a display panel provided with a light-transmitting region, and a circuit board disposed between the photosensitive element and the display panel and being provided with a light-transmitting hole. The light-transmitting region is a region where light is able to pass through the display panel. The light-transmitting hole is disposed between the photosensitive element and the light-transmitting region of the display panel in a direction perpendicular to a light-exiting surface of the display panel.

Cable release devices and methods are disclosed. The device includes a frame defining an aperture. The frame is sized to fit around a connector on a printed circuit board (PCB) within a computer system with the connector extending into the aperture. The device further includes a post extending from the frame. The device further includes a lever connected to the post. The lever includes a first end positioned such that the first end aligns with a latch of a cable when the cable is connected to the connector and when the frame is around the connector such that actuation of the lever causes the lever to depress the latch. The actuation causes the release of the cable from being retained by the connector.

An electrical interconnect including slotted lug with a receiving end for connecting to a flat electrical conductor and a fastening end for connecting to a surface mount terminal extending from the surface of a circuit, such as an integrated metal substrate (IMS) circuit board or a circuit card assembly. The interconnect provides a secure connection capable of transmitting a current of at least 100 Arms, to give a non-limiting example value. The interconnect further provides low contact resistance and ease of manufacturing.