An electronic device includes a substrate having a connector formed on a main face, and a module having a terminal detachably connected to the connector of the substrate. The module includes an extended part which projects below the terminal in an installation direction. The substrate includes a bypass part which bypasses the extended part when the module is connected to the substrate. The bypass part is a cutout or a recess formed in the substrate. The extended part accommodates a plurality of components aligned in the installation direction. The extended part is extended from the lower end of the module by a difference between a first size, corresponding to multiple times the size of each component, and a second size ranging from the upper end of the module to the end of the terminal.

A sealed electrical connection assembly joins an electrical component to a plug-in component. For liquid-tight sealing, the free, deformable ends of the conductor tracks of the electrical component and/or the contact elements of the plug-in component are provided with hydrophobic surfaces at least regionally, so that even after a plurality of plug contact operations have been performed, in the coupling position and, optionally, in the uncoupled position, the contact region is surrounded by hydrophobic surfaces.

Prepregs having a UV curable resin layer located adjacent to a thermally curable resin layer wherein the UV curable resin layer includes at least one UV cured resin portion and at least one UV uncured resin as well as methods for preparing flexible printed circuit boards using the prepregs.

A flexible printed circuit board (FPCB) is disclosed. The FPCB can be employed to connect an interface card having connectors with a two-stage configuration to a connection destination of a portable information equipment. The FPCB includes a bend line located between an upper-stage terminal group and a lower-stage terminal group. The FPCB can be bent along the bend line to allow the upper-stage terminal group and the lower-stage terminal group to be mutually superimposed over each other. In addition, the upper-stage terminal group of the FPCB is connected to the upper-stage-side connector terminal group of the interface card, and the lower-stage terminal group of the FPCB is connected to the lower-stage-side connector terminal group of the interface card.

There is provided a circuit board assembly constructed by stacking a first circuit board having a first contact portion and a second circuit board having a second contact portion to allow the first and second contact portions to contact each other, which is bendable along a first direction. The first circuit board has a first hole that is formed within a range in which a pair of first projection pieces are present in a second direction perpendicular to the first direction, at least part of the first hole being situated between the pair of first projection pieces in the first direction, and the second circuit board has a second hole that is formed within a range in which the pair of second projection pieces are present in the second direction, at least part of the second hole being situated between the pair of second projection pieces in the first direction.

The invention relates to a sensor module (1) for measuring at least one measurand, comprising: a housing (2) having a flow duct (23) with an air inlet (21) and an air outlet (22), the housing (2) enclosing an interior (20) of the housing (2); a circuit board (4) arranged in the interior (20); at least one sensor (3) which is arranged on the circuit board (4) and is designed to measure at least one measurand of an air flow (L) conducted past the sensor (3); a terminal (5) arranged on the circuit board (4) for making electrical contact with the sensor module (1); and a fan (6), which has a motor (60) and a rotor (61) which can be rotated about an axis of rotation (z) by means of the motor (60), the motor (60) being electrically conductively connected to the circuit board (4), and the fan (6) being designed to generate an air flow (L) in the flow duct (23) between the air inlet (21) and the air outlet (22) such that the air flow (L) flows past the sensor (3) and, in the region of the air inlet (21), flows in a flow direction (x) which runs at an angle (V) in the range of 45° to 90° to the axis of rotation (z).

A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a first wiring layer including a first electrically conductive trace layout, a second wiring layer including a second electrically conductive trace layout, and a base film interposed between the first and second wiring layers, where the first conductive trace layout includes at least one thermally conductive protective island overlaying a respective portion of the second trace layout to provide a protective thermal barrier to the base film. Hence, maximum temperatures across various layers of the FPC laminate can be reduced, damage to the FPC prevented, and manufacturing yields improved.

An electronic circuit includes a first printed wiring board, a second printed wiring board and a third printed wiring board. The second printed wiring board is mounted such that one edge of the second printed wiring board abuts on a part mounting surface of the first printed wiring board on which a part is mounted. The third printed wiring board is mounted such that one edge of the third printed wiring board abuts on the part mounting surface. The second and third printed wiring boards are connected to each other in a state where plate thickness directions thereof are oriented in different directions from each other about a normal line to the part mounting surface. Further, at least one of the second printed wiring board and the third printed wiring board is provided with an antenna pattern.

Disclosed is an electrode device for measuring an electric biosignal. The electrode device includes a flexible PCB (printed circuit board) having a flexible support layer and a trace layer on a first side. The trace layer includes at least two electrode pads for skin contacts and, for each electrode pad, a solder pad and a conducting trace forming a galvanic connection between the electrode and the solder pad. The flexible PCB further includes an opening defining a flexible, elongated cantilever in a central portion of the flexible PCB, having a base end connected to the central portion and a free end separated from the central portion. The solder pads are located at the free end. The electrode device further includes a connector component on the second side, soldered to the solder pads on the free end of the cantilever.

A flexible display device includes a flexible display panel and a chip on film (COF) bonded to the flexible display panel; wherein the flexible display panel is divided into a display region, a bonding region on a side of the display region, and a bending region between the display region and the bonding region; wherein the COF comprises a main body portion and two expansion bonding portions respectively disposed at two ends of one side of the main body portion; wherein an edge of the main body portion adjacent to the two expansion bonding portions are disposed with a plurality of connection pins; wherein the COF is bonded to the bonding region of the flexible display panel through the plurality of connection pins.