The present invention relates to an LED strip, comprising a plurality of LEDs mounted on a LED mounting surface of a flat, flexible substrate, wherein said LED mounting surface is light reflective, wherein said flexible substrate is shaped to form at least one conical structure, and wherein a subset of said plurality of LEDs is located inside at least one of the at least one conical structure.

A method of producing an electrical through connection. A cut extending from a first surface to a second surface and separating the area into a first part and a second part is provided on an area of the flexible substrate. At least one of the first and second part is raised from a first plane of the first surface. A first wet conductive layer is printed on the first surface on and around the cut. The first wet layer is solidified into a first dried conductive layer. At least one of the first part and the second part is raised from a second plane of the second surface. A second wet conductive layer is printed on the second surface on and around the cut. The second wet conductive layer is solidified into a second dried conductive layer, which creates an electrical through connection with the first dried conductive layer.

A power supply device includes a first power module including a first printed circuit board in which a first protrusion part is formed along a first side surface of the first printed circuit board facing a first direction, a second power module including a second printed circuit board in which a first groove is formed along a second side surface of the printed circuit board facing the first side surface of the first printed circuit board in a second direction, and a third power module including a third printed circuit board electrically connecting the first printed circuit board and the second printed circuit board. The first protrusion part is inserted into the first groove to physically connect the first printed circuit board to the second printed circuit board.

A method of producing an electrical through connection. A cut extending from a first surface to a second surface and separating the area into a first part and a second part is provided on an area of the flexible substrate. At least one of the first and second part is raised from a first plane of the first surface. A first wet conductive layer is printed on the first surface on and around the cut. The first wet layer is solidified into a first dried conductive layer. At least one of the first part and the second part is raised from a second plane of the second surface. A second wet conductive layer is printed on the second surface on and around the cut. The second wet conductive layer is solidified into a second dried conductive layer, which creates an electrical through connection with the first dried conductive layer.

According to one embodiment, an electronic device includes a housing with a through-hole, a flexible printed circuit inserted through the through hole and including a first connection portion on an inner side of the housing with first connection pads and a second connection portion on an outer side of the housing with second connection pads, a first electrical component in the housing, and a first connector connected to the first electrical component and including connection terminals contacting the first connection pads. A first pad of the first connection pads is greater than other first connection pads.

A wiring body includes: a first insulator; a conductor disposed on a first surface of the first insulator and that includes a terminal; and a second insulator disposed on the first surface to cover the conductor. The second insulator includes: an opening from which the terminal is exposed; and an end face that delimits the opening and that includes a first face, a second face that is farther away from the first insulator than the first face, and an edge that connects the first face and the second face.

A control module of an appliance is provided. The control module includes a housing having a film integrally molded onto an outer surface of the housing. The film includes conductive ink embedded in the film. A header on the film is in electrical communication with the conductive ink embedded in the film. The control module also includes a printed circuit board mounted within the housing proximate an inner surface of the housing. The film is connected to the printed circuit board via the header. With this connection, the printed circuit board is in operative communication with the conductive ink embedded in the film.

A connection element for an electronic component assembly includes a support, a first contact pad, and a second contact pad. The first contact pad and the second contact pad are electrically connected. A first contact conductor has a first conductor surface electrically connected to the first contact pad at a first section, and is configured to form a welded connection in a second section of the first conductor surface, and/or on the second conductor surface. The invention also relates to an electronic component assembly which includes such a connection element, and which has at least one component welded to the contact conductor.

A hard disk drive flexible printed circuit (FPC) includes a plurality of fingers extending from a main portion, with each finger having a first wiring layer including a first electrically conductive trace layout, a second wiring layer including a second electrically conductive trace layout, and a base film interposed between the first and second wiring layers, where the first conductive trace layout includes at least one thermally conductive protective island overlaying a respective portion of the second trace layout to provide a protective thermal barrier to the base film. Hence, maximum temperatures across various layers of the FPC laminate can be reduced, damage to the FPC prevented, and manufacturing yields improved.

A fingerprint identification apparatus and an electrode device. The fingerprint identification apparatus could be configured to be disposed under a variety of different display screens, reducing a thickness of space for installation of the fingerprint identification apparatus under a screen. The fingerprint identification apparatus includes: a support plate; and at least one fingerprint sensor chip, the at least one fingerprint sensor chip being disposed at an upper surface of the support plate; where the support plate is configured to be mounted to an upper surface of a middle frame of the electronic device so that the at least one fingerprint sensor chip is located under the display screen of the electronic device; and the at least one fingerprint sensor chip is configured to receive a fingerprint detecting signal returned by reflection or scattering via a human finger on the display screen.