A protective film of a conductive adhesive, a circuit board and a method for assembling a display device are provided. The protective film of conductive adhesive includes: a basic material layer; and a photoinduced peelable adhesive and a protective layer which are arranged on a first surface of the basic material layer in sequence, and the photoinduced peelable adhesive has a low adhesive force in the exposure of light with a first wavelength. The protective film further includes a light-shielding film located on a second surface of the basic material layer opposite to the first surface.

A millimeter wave antenna and a process design of a millimeter wave antenna are provided. The millimeter wave antenna includes a substrate and an antenna attached to the substrate. The substrate includes a first region and a second region. A thickness of the first region is less than a thickness of the second region. The antenna is arranged on the first region. According to the present application, the millimeter wave antenna enables the substrate attached with the antenna to be as thin as possible, such that a medium structure of the first region of the substrate is changed, reducing an energy loss while a millimeter wave is being transmitted.

An electronic control unit comprises at least one controller and at least one memory device, wherein the controller comprises at least one electronic component mounted on a main circuit board. An embedded circuit board is formed in one piece with the main circuit board, and a predetermined separation line is provided for separating the embedded circuit board from the main circuit board.

A circuit carrier and a manufacturing method thereof are provided. The circuit carrier for coupling an electronic device includes a flexible structure and a circuit structure. The flexible structure includes a conductive pattern disposed on a surface of a first dielectric layer. The circuit structure includes a second dielectric layer overlying the surface of the first dielectric layer and a circuit layer disposed on the second dielectric layer and connected to the conductive pattern. The flexible structure is embedded in and electrically connected to the circuit structure, and a portion of the flexible structure extends out from an edge of the circuit structure to be plugged into the electronic device.

A device for removing a portion of cover is provided, which includes a lower platform and an upper platform oppositely disposed, a cover jig between the lower and upper platforms, a feed roller and a receiving roller oppositely disposed, and an adhesive film. The upper platform includes a plurality of protrusions, and each of the protrusions extends toward the lower platform. The cover jig includes a plurality of through holes, and each of the through holes is disposed opposite to each of the protrusions, so that each of the protrusions can be inserted through each of the through holes. One end of the adhesive film is connected to the feed roller, and the other end of the adhesive film is connected to the receiving roller, and a portion of the adhesive film between the two ends is located between the upper platform and the cover jig.

A circuit board includes a substrate, an input binding region and at least two output binding regions disposed on the substrate. Each of the output binding regions includes a plurality of binding portions, and the number of the binding portions included in different output binding regions is different. The substrate is configured to output a signal received by the input binding region to respective binding portions included in each of the output binding regions.

A semi-flex component carrier includes a stack with at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion, and a component embedded in the at least one rigid portion. The at least one electrically insulating layer structure of the stack has a mechanical buffer structure surrounding at least part of the component and has a lower value of the Young modulus than other electrically insulating material of the stack.

A semi-flex component carrier includes a stack having at least one electrically insulating layer structure and/or at least one electrically conductive layer structure. The stack defines at least one rigid portion and at least one semi-flexible portion. The at least one electrically insulating layer structure forms at least part of the semi-flexible portion and includes a material having an elongation of larger than 3% and a Young modulus of less than 5 GPa.

A package for securing a PCB to a heatsink includes mounts with over-torque protection features. The PCB is seated in an open end of the package. Each mount includes a threaded opening for securing the package to the heatsink such that the base layer of the PCB is thermally coupled to the heat sink. The over-torque protection features are connected between the threaded opening and a sidewall of the package. The over-torque protection features may be designed to structurally fail and/or deform in response to over-torqueing of the fasteners, thereby inhibiting flexure of the PCB.

A package for securing a PCB to a heatsink includes mounts with over-torque protection features. The PCB is seated in an open end of the package. Each mount includes a threaded opening for securing the package to the heatsink such that the base layer of the PCB is thermally coupled to the heat sink. The over-torque protection features are connected between the threaded opening and a sidewall of the package. The over-torque protection features may be designed to structurally fail and/or deform in response to over-torqueing of the fasteners, thereby inhibiting flexure of the PCB.