A method for manufacturing a semi-flex printed circuit board is provided, including: forming two convex metal dam structures and two concave laser cut grooves on a side surface of the core substrate; wherein inner sides of the two metal dam structures form a printing area at the side surface of the core substrate, and the positions of the two laser cut grooves correspond to the printing area; printing a strippable printing ink in the printing area on the core substrate; laminating a build-up board structure on the side surface of the core substrate; and forming two blind routing openings on another side surface of the core substrate, which correspond to the two laser cut grooves in position respectively; removing a cover-opening structure of the core substrate between the two blind routing openings, so as to form a cover-opening opening.

A semi-flex printed circuit board with cover-opening opening is disclosed. An inner side of the core substrate surrounds a cover-opening opening. The two metal dam structures are arranged on a side surface of the core substrate; and the two metal dam structures and the core substrate jointly surround the cover-opening opening. The core board is arranged on a side surface of the bonding sheet away from the core substrate. Two sides of a bottom of the core substrate surrounding the cover-opening opening are provided with two laser cutting sidewalls respectively. Sidewalls of the two metal dam structures surrounding the cover-opening opening are connected with the two laser cutting sidewalls respectively and each defined as a metal dam sidewall. An obtuse angle presents between the metal dam sidewall and the laser cutting sidewall.

Described are component carriers including a stepped cavity into which a stepped component assembly is embedded. The component carriers have (a) fully cured electrically insulating material originating from at least one electrically insulating layer structure of the component carrier and circumferentially surrounding the stepped component assembly and/or (b) an undercut in a transition region between a narrow recess and a wide recess of the stepped cavity. Further described are methods for manufacturing such component carriers.

To provide a protrusion drop structure and others in which when a load applied to an operating button in a back direction is smaller than a predetermined load, the bending of a printed circuit board is made sufficiently small so as not to give a feeling of strangeness when a user depresses the operating button, and when a load applied to the operating button in the back direction reaches the predetermined load, a projecting height of the operating button from a surface of a casing is reduced to less than or equal to a predetermined height. The protrusion drop structure of the present invention includes a casing; an operating button capable of being depressed, the operating button having one end that projects outside the casing and having other end disposed inside the casing; a printed circuit board supported inside the casing and having a rupturing portion that is ruptured at an area facing the other end of the operating button when a first depression load or more is applied from a one-end side to an other-end side of the operating button; and a board supporting member that is fixed to the casing and supports the printed circuit board from a back side of a surface of the rupturing portion facing the other end of the operating button, the fixation of the board supporting member to the casing being released when a second depression load or more is applied to the rupturing portion from a surface side facing the other end of the operating button to the back side.

A detonator module comprising: a housing with a first housing half and a second housing half, a detonator contained within the housing, a child board comprising a terminal header, wherein the child board is contained within the housing and the first housing half exposes the terminal header to an exterior of the housing, a switch mounted to an exterior surface of the housing, and a plurality of switch leads connecting the switch to the terminal header.

A light board for a light fixture includes a first portion and a second portion. The first portion includes at least one light emitting element, and the second portion includes at least one light emitting element. A first state is defined by the second portion being coupled to the first portion and a second state is defined by the second portion being detached from the first portion. In the first state, the light emitting elements of the first portion and the second portion are configured to provide an evenly distributed light output along at least the combined length of the first portion and the second portion. In the second state, the at least one light emitting element of the first portion is configured to provide an evenly distributed light output along at least the length of the first portion.

A method of this invention is for manufacturing a circuit board in which terminal fittings and electronic components are provided on a first surface of a main substrate that has the first surface and a second surface, a sub substrate that has a first surface and a second surface is arranged on the second surface side of the main substrate, and the sub substrate and the main substrate are connected by relay terminals. The main substrate and the sub substrate are formed in advance in a state of being connected in the same plane. During the method, the main and sub substrate are initially physical connected, at which time electrical components are attached to at least the main substrate. After physically separating the main and sub substrates, they are electrically connected.

Various embodiments provide a flexible printed circuit comprising a substrate layer portion and an electrically-conductive layer portion. The electrically-conductive layer portion may be superimposed over the substrate layer portion. The substrate layer portion may have an opening formed therein and part of the electrically-conductive layer portion may be positioned over the opening to form a partially detachable tab. The tab may be for use in initiating separation of one portion of the flexible printed circuit from another portion of the flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a flexible printed circuit. Various embodiments provide a corresponding method of fabrication of a plurality of electronic devices.

In accordance with certain embodiments, flexible light sheets are folded to define first and second portions of the light sheet divided by the fold, and the first and second portions of the light sheet may both feature light-emitting elements thereon.

A flexible electronic circuit includes a plurality of leaves having a proximal section, a distal section, and an intermediate section. The plurality of leaves are bonded to each other within the distal section and loose within the intermediate section. The intermediate section also includes conductive connector pads for a wiring harness. A plurality of test connector pads are disposed on the plurality of leaves within the proximal section. The leaves within the proximal section may also be bonded to each other, for example in a ribbon or stepped configuration, in order to facilitate connection to testing apparatus. Once the circuit is tested, the proximal section can be severed from the intermediate section prior to installation of the circuit into a medical device, such as an intracardiac echocardiography catheter.