A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

The present invention relates to a substrate unit and a substrate assembly, and a camera module using the same. The present invention may comprise: a first substrate part having rigidity; a second substrate part stacked on one surface of the first substrate part and having flexibility; a third substrate part extending outwardly from the second substrate part and having flexibility; and a reinforcing part which is disposed at a portion where the edge portions of the first substrate part and the third substrate part meet, the reinforcing part having a recessed portion which is formed by recessing the first substrate part inwardly so as to inhibit interference between the first substrate part and the third substrate part. The present invention is capable of resolving the interference between a rigid PCB and a flexible PCB and the tearing thereof by providing a reinforcing part in a connection portion of the rigid PCB and the flexible PCB.

A sensor device includes a mounting member having fixation surfaces inside, and at least one electronic component directly or indirectly fixed to the fixation surfaces of the mounting member, and the mounting member constitutes a part of a casing for housing the electronic component. Further, the fixation surfaces are perpendicular to each other.

A display device according to an embodiment includes a first substrate including a connection line; a second substrate facing the first substrate; and a connection pad connected to a side of surface of the first substrate and a side surface of the second substrate, wherein the connection pad includes a first portion contacting the side of the first substrate and the side surface of the second substrate, and a second portion that is disposed in each of the first substrate and the second substrate and contacting the connection wiring.

Example implementations relate to an electronic port of a computing system, having a locking assembly to secure an electronic plug within the electronic port. The electronic port includes a receptacle, a bracket, a biasing member, and a fastener. The receptacle includes a plurality of retainers to releasably hold a connector of the electronic plug, when the electronic plug is detachably coupled to the electronic port. The bracket is disposed around the receptacle. The bracket has a plurality of locking elements and a pillar having a counter bore. The plurality of locking elements is aligned with the plurality of retainers. The fastener is projected into the pillar through an enclosure, where the fastener is fastened into the counter bore of the pillar to allow a vertical movement of the bracket along a first direction for engaging the plurality of locking elements with the plurality of retainers.

An implantable connector for connecting an electronics package and a neural interface is made by way of a compressible contacts (e.g., a spring) that physical contacts a corresponding exposed bond pad. The compressible contact is held in compression with the exposed bond pad using a mechanical coupler. The compressible contact is physically separated and electrically isolated from other contacts by way of a compressible gasket. The compressible gasket is also held in compression using the mechanical coupler.

High density pluggable electrical connector having a number of electrical contacts exceeding sixty and a contact density on a plugging interface of the connector of at least forty contacts per square centimeter, comprising a casing and a terminal unit mounted within the casing, the terminal unit comprising a housing with a module receiving cavity formed within the housing, and a plurality of terminal modules insertably received in the module receiving cavity in a stacked arrangement. Each terminal module comprises a plurality of contacts mounted in a dielectric terminal module housing, the terminal modules having a width W to height H ratio W/H greater than three.

A circuit board (3) is provided with a first rigid part (11) having a power system electronic component mounted thereon, a second rigid part (12) having a control system electronic component mounted thereon, and a thin flexible part (13) connecting the first and second rigid parts to each other. The flexible part (13) is provided with a plurality of conductive wires (27) conducted with the electronic components of the first and second rigid parts (11, 12). A non-conductive metal pattern (33) that is a dummy pattern is formed along an outer edge (13a) of the flexible part (13). By the non-conductive metal pattern (33), the disconnection of the conductive wires (27) due to cracking is suppressed.

A method and system are disclosed that allow easier coupling between high-density connectors. In one example implementation, the connectors on a computer board are mounted on flexible tabs extending from the computer board, the tabs having been formed by cutting slots on both sides of each of the tabs. A milled section within each tab makes the tab thinner, allowing it additional flexibility. In another example implementation, a pass-through connector is used as an intermediary between two mating connectors. The pass-through connector has internal pins with greater tolerance than the tolerance between the two mating connectors, allowing it easier alignment of pins for coupling. In yet another example implementation, mating connectors are coupled using a bundle of cables between the mating connectors that allows the coupling of multiple connectors, one at a time, reducing or eliminating the need to simultaneously couple multiple connectors.

Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.