An example sensor interposer employing castellated through-vias formed in a PCB includes a planar substrate defining a plurality of castellated through-vias; a first electrical contact formed on the planar substrate and electrically coupled to a first castellated through-via; a second electrical contact formed on the planar substrate and electrically coupled to a second castellated through-via, the second castellated through-via electrically isolated from the first castellated through-via; and a guard trace formed on the planar substrate, the guard trace having a first portion formed on a first surface of the planar substrate and electrically coupling a third castellated through-via to a fourth castellated through-via, the guard trace having a second portion formed on a second surface of the planar substrate and electrically coupling the third castellated through-via to the fourth castellated through-via, the guard trace formed between the first and second electrical contacts to provide electrical isolation between the first and second electrical contacts.

A flexible printed circuit board that can reduce detachment when a flexible printed circuit board is attached to a display panel, and reduce a work cost, and simplify process, and reduce a tearing of the flexible printed circuit board due to a stress concentrated on a specific area of the flexible printed circuit board, and a display apparatus including the same. The flexible printed circuit board includes a base film having a notch at one side, on at least one side, and a plurality of rows of impact absorbing parts spaced apart from each other along the edge of the notch. The impact absorbing part provides a pattern layer one surface or both surfaces of the base film or a pattern hole of penetrating through the base film.

Electronic modules having complex contact structures may be formed by encapsulating panels containing pluralities of electronic modules delineated by cut lines and having conductive interconnects buried within the panel along the cut lines. Holes defining contact regions along the electronic module sidewall may be cut into the panel along the cut lines to expose the buried interconnects. The panel may be metallized, e.g. by a series or processes including plating, on selected surfaces including in the holes to form the contacts and other metal structures followed by cutting the panel along the cut lines to singulate the individual electronic models. The contacts may be located in a conductive grove providing a castellated module.

A wiring board includes, a base plate that has a first surface, a second surface opposite to the first surface, and a side surface coupled to the first surface and the second surface, a conductor provided on the side surface, and a protrusion provided over the side surface. The protrusion partitions the conductor into a first portion on the side surface that extends to the first surface and a second portion on the side surface that extends to the second surface. The protrusion has a solder wettability lower than the conductor and protrudes from the conductor.

Embodiments herein relate to a Printed Circuit Board, PCB, (1) and a terminal (2) for connecting the PCB (1) to an electrical component. The PCB (1) comprises a through-hole (11) for receiving the terminal (2). The through-hole (11) has a partially open side wall (12), wherein the side wall (12) is open along at least a part of a length (L) of the 5 through-hole (11) perpendicular to a radius (R) of the through-hole (11). This allows the terminal (2) to protrude through the open side wall (12) when received by the through-hole (11), such that a position of the terminal (2) is adjustable along the length of the open side wall (12). The terminal (2) comprises a base (21), adapted to be received by the through-hole (11) of the PCB (1) and to create a press fit with the side wall (12) of the through-hole 10 (11), and a pin (22) projecting from a surface (23) of the base (21). The pin (22) is adapted to protrude through the open side wall (12), when the base (21) is inserted into the through-hole (11) of the PCB (1). Furthermore, embodiments herein relate to a method for assembling a PCB module (120) comprising the terminal (2) and the PCB (1).

A rechargeable battery pack includes a cell assembly including at least one battery cell, a frame portion accommodating the cell assembly, a flexible printed circuit (FPC) electrically connected to the cell assembly and configured to sense at least one property of the battery cell, and a dual-in-line plug (DIP) connector electrically connected to the flexible printed circuit on a first side of the frame portion. The flexible printed circuit and the DIP connector are electrically connected to each other by an electrically conductive adhesive.

A method for manufacturing an electronics assembly, includes obtaining or producing an electronics module, which includes a first circuitry on a first surface at a first side of a circuit board, at least one electronics component on the circuit board in electrical connection with the first circuitry, and at least one first connection portion on the first surface and/or an adjacent side surface at a peripheral portion of the circuit board, wherein the at least one first connection portion is electrically connected to or comprised in the first circuitry. The method further includes arranging the electronics module on a second substrate including a second connection portion connected to a second circuitry on a surface of the second substrate and arranging electrically conductive joint material onto the first and second connection portions to extend between them for electrically connecting the electronics module to the second circuitry.

There is provided an optical module including an optical subassembly including an optical element, a printed circuit board, and a connection substrate. The connection substrate includes a first connection portion connected to a first signal line conductor strip disposed on a first surface and a first ground conductor layer disposed on a second surface. The first connection portion includes a first signal line pad portion, a first ground pad portion, both disposed on the first surface, a second signal line pad portion disposed, and a second ground pad portion, both disposed on the second surface. In the connection substrate, a distance between the first signal line pad portion and the first ground pad portion in a first region is narrower than that in a second region farther from an inner end portion on the gap portion side than the first region in plan view.

Methods of depositing a film selectively onto a first substrate surface relative to a second substrate surface. Methods include soaking a substrate surface comprising hydroxyl-terminations with a silylamine to form silyl ether-terminations and depositing a film onto a surface other than the silyl ether-terminated surface.

The present invention is notably directed to a printed circuit board, or PCB. This PCB has two main surfaces, each delimited by lateral edges, as well as lateral surfaces, each meeting each of the two main surfaces at one lateral edge. The present PCB further comprises a row of solder pads, which extends along a lateral edge of the PCB. Each solder pad is formed directly at the lateral edge and/or directly on a lateral surface (meeting one of the two main surfaces at said lateral edge). I.e., each pad interrupts a lateral edge and/or an adjoining lateral surface. One or more chips, e.g., memory chips, can be mounted on such a PCB to form an IC package. The above solder pad arrangement allows particularly dense arrangements of IC packages to be obtained. The present invention is further directed to related devices and methods of fabrication thereof.