An adhesion between a sealing resin layer and a shield film is improved by a mesh sheet disposed on an opposite surface of the sealing resin layer. A radio frequency module includes a wiring board, a component mounted on an upper surface of the wiring board, a sealing resin layer that covers the component, a mesh sheet disposed on an upper surface of the sealing resin layer, and a shield film provided to cover the upper surface and side surfaces of the sealing resin layer, and the mesh sheet. The mesh sheet and the sealing resin layer, as well as the mesh sheet and the shield film are firmly in adhesion with one another. Thus, the adhesion between the sealing resin layer and the shield film can be improved.

A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

Printed circuit boards (PCBs) may include embedded lateral connectors. The embedded lateral connectors may be configured to enable components to quickly couple to or plug into a PCB, thus saving time to form connections. The embedded lateral connectors may also reduce weight and/or size by avoiding need for bulky tradition collections with conventional components (e.g., solders, external pin connectors, etc.). The connectors may include male connectors, female connectors, and/or mounting connectors. The connectors may be configured to connect multiple PCBs together, such as using a stacked configuration, which may enable reducing a volume of space needed in a housing for the PCBs.

An electronic component includes a substrate and side wires. The substrate includes a first major surface, a second major surface, and a side surface. The side wires are on the side surface of the substrate and spaced apart from each other in a direction along an outer periphery of the substrate when viewed in plan in a thickness direction of the substrate. At least a portion of each of the side wires is provided indirectly on the side surface of the substrate. The electronic component further includes an electrically insulating layer interposed between the side surface of the substrate and the at least a portion of each of the side wires. Each of the side wires includes a bent portion bent when viewed in plan in the thickness direction of the substrate.

A display includes a circuit board structure including a first circuit board and a second circuit board. The first circuit board has a carrying region and an electrical connection region on which a first pad is disposed. The second circuit board has a first region and a second region, the first region is arranged on the electrical connection region and is electrically connected to the first pad, and the second region is electrically connected to the driving terminal. The rigidity of the second circuit board is less than that of the first circuit board. The display substrate is in the carrying region and includes a silicon substrate in which a driving circuit is partially embedded, and a second pad electrically connected to the driving circuit. The driving circuit includes a transistor having a semiconductor layer which is inside the silicon substrate. The second pad is electrically connected to the first pad.

A method for manufacturing a circuit board structure with a waveguide is provided. The method includes: providing a first substrate unit, a second substrate unit, a third substrate unit, and two adhesive layers, the first substrate unit including a first dielectric layer and a first conductive layer, the first conductive layer including a first shielding area and two first artificial magnetic conductor areas disposed on two sides of the first shielding area; the second substrate unit including a second dielectric layer and a second conductive layer, the second conductive layer including a second shielding area; the third substrate unit defining a first slot, and the adhesive layer defining a second slot; stacking the first substrate unit, one of the adhesive layers, the third substrate unit, another one of the adhesive layers, and the second substrate unit in that order; pressing the intermediate body.

A power module assembly structure includes an element layer, a flexible printed circuit board layer, and an external wire layer. The element layer includes one component. The flexible printed circuit board layer includes at least one insulating region and at least one conductive region. The external wire layer is disposed on a second side of the flexible printed circuit board layer. The first side and the second side of the flexible printed circuit board layer are two opposite sides, and the external wire layer includes at least one external wire. The at least one external wire is electrically connected to the at least one conductive region of the flexible printed circuit board layer. The heat generated by the one component is directly conducted to the outside of the power module package structure through the at least one conductive region and the at least one external wire.

A printed circuit board (PCB) structure and mounting assembly for joining two PCBs. A first PCB has a top and bottom surface faces and a peripheral end face separating the top and bottom surface. The first PCB has one or more conductive wire ends exposed at a surface of the peripheral end face; the exposed conductive wire ends forming multiple separate electrical contacts across the thickness and length of the PEF surface. A second PCB has a top surface face and one or more conductive pads exposed at the top surface at locations corresponding to locations of the multiple electrical contacts. A surface mount solder material is disposed on one or more exposed conductive pads for electrically connecting with corresponding the multiple electrical contacts. The disposed solder material stably joins the PEF surface of the first PCB to the top surface of the second PCB in a relative perpendicular orientation.

A high-frequency module includes a branching circuit element, a multilayer substrate, and a shield conductor. The branching circuit element includes transmission and receiving terminals and is disposed on a surface of the multilayer substrate. The shield conductor is disposed on the side of the surface of the multilayer substrate and covers the branching circuit element. The transmission and receiving terminals are disposed with respect to the shield conductor such that a signal in at least a portion of the frequency band of a first signal, which is transmitted from the transmission terminal, is cancelled by a second signal at the receiving terminal.

An electronics device, including: a printed circuit board having a first surface, a second surface opposite the first major surface, and a plurality of side surfaces disposed along a periphery of and between the first and second surfaces, each of the side surfaces being smaller in area than the first and second surfaces; and a plurality of electrical components coupled to the printed circuit board along the first surface thereof, at least some of the plurality of electrical components being electrically coupled together via the printed circuit board. The printed circuit board includes a plated aperture defined in the printed circuit board along a side surface thereof. The printed circuit board provides electrical connectivity to the plated aperture.