Various configurations of a grounding element or conductive element for a printed circuit board (PCB), as well as a process for manufacturing, are disclosed. For example, a PCB can include a solder grounding element connecting a copper track to a metal substrate, where the solder grounding element is applied via ultrasonic soldering during a manufacturing process. In another example, a PCB can include a spring pin grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include an auto splice grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include a press fit pin grounding element connecting a copper track to a metal substrate. In yet another example, a PCB can include a clip pin grounding element connecting a copper track to a metal substrate.

A circuit board includes an insulating layer, a capacitor which is provided in the insulating layer and includes a dielectric layer, a first conductor layer provided on a first surface of the dielectric layer and including a first opening part, and a second conductor layer provided on a second surface opposite to the first surface of the dielectric layer and including a second opening part at a position corresponding to the first opening part; a first conductor via provided in the insulating layer, penetrating the dielectric layer, the first opening part and the second opening part, and being smaller than the first opening part and the second opening part in plan view; a second conductor via provided in the insulating layer and making contact with the second conductor layer; and a third conductor layer provided on the insulating layer and electrically coupled to the first and the second conductor vias.

A conductor connection structure of a laminated wiring body includes a plurality of plate wiring members which are made of a conductive material and stacked to each other, an insulating layer which is arranged between the vertically-adjacent plate wiring members to insulate the vertically-adjacent plate wiring members, a connection portion which is provided in an upper surface of each of the plate wiring members on a way in an extending direction of the plate wiring members, and a leading-out portion which takes out the connection portion of a lower plate wiring member among the plurality of plate wiring member while avoiding an upper plate wiring member among the plurality of plate wiring member, the lower plate wiring member is arranged at a layer lower than the upper plate wiring member in the laminated wiring body.

An electrical circuit device includes a circuit board including a cavity extending from a top surface of the circuit board to an embedded conductor, an integrated circuit chip in the cavity, an electrical connection between the integrated circuit chip and the embedded conductor, a thermal slug disposed over a top surface of the integrated circuit chip, and a heat sink mounted to an outer surface of the thermal slug for transferring a thermal energy away from the circuit board, the heat sink extending above a top surface of the circuit board.

A method of mounting an integrated circuit chip to a circuit board includes placing the integrated circuit chip into a cavity extending from a surface of the circuit board to an embedded conductor, and electrically connecting the integrated circuit chip to the embedded conductor.

An electrical circuit device that includes a circuit board with an integrated circuit chip in a cavity that extends from a surface of the circuit board to an embedded conductor, and an electrical connection between the integrated circuit chip and the embedded conductor.

A power module including a rigid-flexible PCB that exits from a resin molding case, and includes a first PCB region having a stacked structure of piled up layers; a second PCB region having said stacked structure, further locally delimited at a first side by a top stiffening element and at a second opposite side by a bottom stiffening element; and a third PCB region having said stacked structure without the top and bottom stiffening elements. The top and bottom stiffening elements extend at a lateral surface of the molding case, where the PCB exits from the molding case, and are configured to locally increase the rigidity of the PCB with respect to regions of the PCB 20 where said top and bottom stiffening elements are absent. A power module and method of manufacturing the power module is also provided.