The invention relates to an electronic device having an electrically isolating support structure, an electrically conducting conductor path on a surface of the support structure, and an electrically conducting contact structure which extends from the surface into the support structure and is electrically connected to the conductor path at a connection point, thereby forming a common conductor track. The conductor path and the contact structure transition into each other in an enlargement-free manner at the connection point.

A differential trace pair system includes a board having a first, a second, a third, and a fourth board structure member. A differential trace pair in the board includes a first differential trace extending between the first and the third board structure members, and a second differential trace extending between the second and the fourth board structure members. The differential trace pair includes a serpentine region that includes a first portion and a second portion where the first and the second differential traces have a first width, are substantially parallel, and spaced apart by a first differential trace pair spacing, and a third portion in which the second differential trace includes a second width that is greater than the first width, the first and second differential traces are substantially parallel and spaced apart by a second differential trace pair spacing that is greater than the first differential trace pair spacing.

The present disclosure relates to a PCB and a method in the PCB for reducing common-mode current. The PCB comprises two differential lines and each of the differential lines is on one or more planes of the PCB. The two differential lines carry a differential mode current and the common mode current. The differential mode current and the common mode current may be at least one of a forward current and a backward current. Further, a predefined configuration is formed using each of the two differential lines to generate impedance at the predefined configuration. Here, the predefined configuration is placed close to each other to generate a dielectric capacitance. The flow of the forward current and the backward current in adjacent tracks of each of the two differential lines in the predefined configuration are in opposite direction.

An electronic device including a transverse circuit board to route electrical traces is provided. In some embodiments, the electronic device includes: a housing; a first printed circuit board (PCB) that is fixed relative to the device housing; an integrated circuit that is connected to the first PCB; a second PCB that is situated in a transverse position relative to the first PCB, a plurality of electrical traces; and a securing component that secures the second PCB in the transverse position relative to the first PCB. Each respective electrical trace from the plurality of electrical traces includes: (i) a first portion that extends across the first PCB, between the integrated circuit and the second PCB, (ii) a second portion that extends across the second PCB, between the first PCB and either the first PCB or a third PCB, and (iii) a third portion that extends across either the first PCB or the third PCB, between the second PCB and a location other than the integrated circuit.

An electronic device including a transverse circuit board to route electrical traces is provided. In some embodiments, the electronic device includes: a housing; a first printed circuit board (PCB) that is fixed relative to the device housing; an integrated circuit that is connected to the first PCB; a second PCB that is situated in a transverse position relative to the first PCB, a plurality of electrical traces; and a securing component that secures the second PCB in the transverse position relative to the first PCB. Each respective electrical trace from the plurality of electrical traces includes: (i) a first portion that extends across the first PCB, between the integrated circuit and the second PCB, (ii) a second portion that extends across the second PCB, between the first PCB and either the first PCB or a third PCB, and (iii) a third portion that extends across either the first PCB or the third PCB, between the second PCB and a location other than the integrated circuit.

A control unit has a substrate with an electrically conductive structure, an integrated circuit device, which is installed on the substrate in an electrically conductive manner, and a sacrificial structure on the substrate. The sacrificial structure is configured to be irreversibly destroyed if the integrated circuit device is removed from the substrate. The electrically conductive structure has at least one conducting track applied to the substrate. The sacrificial structure is formed by a segment of the conducting track. An electrically insulating connecting layer that connects the integrated circuit device, the substrate, and the segment of the conducting track is formed. The sacrificial structure can be destroyed by the connecting layer when the integrated circuit device is removed.

One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.

A paddle card construction disclosed for use in connecting electronic devices together. The paddle card takes the form of a circuit board that has a plurality of conductive contact pads arranged thereon in pairs. The contact pads of each pair are spaced apart from each other to provide a pair of points to which cable wire free ends may be terminated, such as by soldering. The spacing of the pads apart from each other in effect reduces to amount of capacitance in the cable wire termination area on the circuit board, thereby reducing the impedance and insertion loss in that area at high frequencies. The contact pads of each pair may be further interconnected together by a thin, conductive trace that extends lengthwise between the contact pads.

A wiring board of an electronic device includes: a board terminal connected to a semiconductor device (semiconductor component); a wire formed in a first wiring layer and electrically connected to the board terminal; a conductor pattern formed in a second wiring layer and electrically connected to the wire via a via wire; and another conductor pattern formed in a third wiring layer and supplied with a first fixed potential. The conductor pattern and the another conductor pattern face each other with an insulating layer interposed therebetween, and an area of a region where the conductor pattern and the another conductor pattern face each other is larger than an area of the wire.

A method for fabricating a printed circuit board comprising preparing a surface of an organic material substrate then depositing conductive traces and at least one conductive pad on the organic material substrate through an additive deposition process. The conductive traces and pads are then heat-treated to create electrically conductive pathways and at least one heat-treated conductive pad. A dielectric material is then deposited through the additive deposition process over a portion of the heat-treated conductive traces to create a dielectric material containing area and a non-dielectric material containing area. The dielectric material containing area is then heat-treated.