Control panels with antimicrobial copper sheet overlays are disclosed. In some embodiments, the antimicrobial copper used in the copper sheet overlays can be selected from copper or copper alloys containing from about 60 to about 100 wt % copper. In other embodiments, the copper sheet overlays have one or more deflection spots to permit an operator to use the control panel to operate an electronic device. Some embodiments include methods to manufacture the control panels comprising antimicrobial copper sheet overlays. Further embodiments include methods for operating an electronic device using the control panels comprising antimicrobial copper sheet overlays.

A 3D Electromagnetic Interference (EMI) suppression structure and an electronic device having the same, wherein a coplanar waveguide structure, an isolation layer, and a resonance layer may be installed. Furthermore, under the coplanar waveguide structure, the 3D EMI structure may be installed to connect to a conductor part of the resonance layer through a conductive connection part of the isolation layer, thereby further improving the EMI suppression effect and producing an excellent EMI suppression effect.

A network of Intermediate Device Structure (IDS) members communicatively coupled, mounted to elevated structure/s within urban settings, each configured to operate by a processor/controller with resident code, and in real time receive sensed environmental inputs from each IDS' vicinity, remote data/instruction/s processing the inputs with resident code parameters generating outputs that are configured to mitigate/avert intermittent environmental events harmful/hazardous to humans. The IDS's include a launch and charging pad that hosts a UAV, which patrols an area within communication range of at least one of the IDSs so the UAV, perhaps with AI-engine assistance, can detect events in the area patrolled by the UAV.

An electronic device is disclosed, including: a housing including a first surface, a second surface parallel to the first surface, and a side surface surrounding a space formed between the first surface and the second surface, a first printed circuit board (PCB) disposed on the first surface of the housing, a second PCB disposed on the first surface of the housing and spaced apart from the first PCB, a flexible printed circuit board (FPCB) connecting the first PCB and the second PCB, a conductive sheet disposed on the second surface of the housing and spaced apart from the first PCB, the second PCB, and the FPCB, and an insulating member disposed on one surface of the FPCB and contacting the conductive sheet.

Copper foil to provide electrical conductivity includes a flexible conductive surface on which multiple roughness nodules are formed, arranged according to a predetermined pattern. One or more channels extend between a pair of rows of the roughness nodules, each channel provides a conduction path.

A wiring board includes a first insulation layer comprising first and second surfaces; a second insulation layer located at an outermost layer on the first surface; a third insulation layer located at an outermost layer on the second surface; a first mounting region located on an outermost surface on the first surface; a second mounting region located on the outermost surface on the first surface and surrounding the first mounting region; a plane conductor located on the third insulation layer; and a solder resist covering the third insulation layer and the plane conductor and having an opening that exposes part of the plane conductor. In plane perspective, in a frame-shaped region between outer peripheral edges of the first and second mounting regions, the plane conductor comprises clearances at point-symmetric positions taking a center of the opening as a point of symmetry.