An optical integration device includes a first circuit layer comprising a first surface adjacent a first diffractive layer, the first diffractive layer arranged on a side of the first circuit layer along a first direction, and a first connecting pad electrically connected with the first circuit layer through a first conductive member. The optical integration device includes a side surface extending along the first direction. The side surface defines a first concavity extending through the first diffractive layer along the first direction. The first connecting pad includes a first mounting member connected with the side surface, and a first convex member extending from the first mounting member and received in the first concavity. The first conductive member includes a first conductive part arranged between the side surface and the first mounting member, and a second conductive part arranged between the first surface and the first convex member.

A display device includes a display substrate including a display area and a pad area, which is disposed on the periphery of the display area; and a display panel including at least one wire pad, which is disposed in the pad area of the display substrate, where the wire pad includes a main pad portion, which extends in a first direction, a first protruding pad portion, which protrudes from a first side, in a second direction intersecting the first direction, of the main pad portion, and a second protruding pad portion, which protrudes from a second side, in the second direction, of the main pad portion, and the first protruding pad portion is disposed closer than the second protruding pad portion to the display area.

A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 μm or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.

Provided is a display device that includes a substrate including a plurality of pixels; a display element layer including a light emitting element provided in each of the pixels; and a touch sensor on the display element layer. The touch sensor may include: a base layer on the display element layer; a first conductive pattern on the base layer; a first insulating layer provided over the first conductive pattern; a second conductive pattern on the first insulating layer; a second insulating layer provided over the second conductive pattern; an intermediate layer on the base layer; and a cover layer provided over the intermediate layer. The intermediate layer and the cover layer may include different materials.

A stretchable mounting board that includes a stretchable substrate having a main surface, a stretchable wiring disposed on the main surface of the stretchable substrate, a mounting electrode section electrically connected to the stretchable wiring, solder electrically connected to the mounting electrode section and including bismuth and tin, and an electronic component electrically connected to the mounting electrode section with the solder interposed therebetween. The mounting electrode section has a first electrode layer on a side thereof facing the stretchable wiring and which includes bismuth and tin, and a second electrode layer on a side thereof facing the solder and which includes bismuth and tin. A concentration of the bismuth in the first electrode layer is lower than a concentration of the bismuth in the second electrode layer, and the concentration of the bismuth in the second electrode layer is constant along a thickness direction thereof.

A manufacturing method of electronic components includes the steps of: providing an insulating layer including a first region and a second region; providing a first metal layer disposed in the first region of the insulating layer; providing a second metal layer disposed on the first metal layer; providing a metal line in the second region of the insulating layer, wherein the metal line is electrically connected to the first metal layer; and removing the metal line to form an electronic component, wherein the electronic component includes the insulating layer; and a first metal bump disposed on the insulating layer and including: the first metal layer disposed on the insulating layer; and the second metal layer disposed on the first metal layer.

Disclosed embodiments include a signal trace in an integrated-circuit device package substrate. Portions of the signal traces, suspend a landing pad in a recess, and a portion of the suspended signal trace is form-factor modulated that is different in cross-section area than other portions of the suspended signal trace.

In a board joint structure, a first board (board) and a component (mounting board) are joined together by a conductive joint material and an insulating joint material. The first board includes a first insulating substrate including a first main surface, a first electrode pad provided on the first main surface, a spacer, and the like. At least a portion of the insulating joint material and the spacer are located between the first board and the component, and the first electrode pad is joined to a second electrode pad of the component with the conductive joint material. A region of the first main surface other than a region where the first electrode pad is provided is joined to the component with the insulating joint material.

A display device includes a display substrate including a display area and a pad area, which is disposed on the periphery of the display area; and a display panel including at least one wire pad, which is disposed in the pad area of the display substrate, where the wire pad includes a main pad portion, which extends in a first direction, a first protruding pad portion, which protrudes from a first side, in a second direction intersecting the first direction, of the main pad portion, and a second protruding pad portion, which protrudes from a second side, in the second direction, of the main pad portion, and the first protruding pad portion is disposed closer than the second protruding pad portion to the display area.

A flexible printed circuit board with improved ground efficiency is disclosed, and a flexible display module and an electronic device comprising the same is disclosed, wherein the flexible printed circuit board comprises a flexible circuit film having a circuit layer disposed on one surface of a base film, and a ground pad portion disposed on another surface of the base film; and a conductive cover member configured to cover the other surface of the base film and electrically connected with the ground pad portion, wherein the conductive cover member includes a cutting portion overlapped with the ground pad portion.