A coaxial thru-via conductor and a method of fabricating the coaxial thru-via conductor can provide enhanced operations for semiconductor devices mounted on a substrate.

A coaxial thru-via conductor and a method of fabricating the coaxial thru-via conductor can provide enhanced operations for semiconductor devices mounted on a substrate.

Disclosed are a hole connecting layer manufacturing method, a circuit board manufacturing method and a circuit board. The hole connecting layer manufacturing method comprises: adhering a first insulating dielectric layer, used for laminating and filling, to a daughter board; laminating and solidifying the first insulating dielectric layer on the daughter board; adhering a second insulating dielectric layer, used for laminating and filling, to the first insulating dielectric layer which has been laminated and solidified; manufacturing a first receiving hole on the first insulating dielectric layer and a second receiving hole on the second insulating dielectric layer, wherein the first receiving hole and the second receiving hole are provided vertically opposite to each other; filling both the first receiving hole and the second receiving hole with a conductive medium to complete manufacturing of the hole connecting layer.

A rewiring region 22 is provided in a region other than a pixel region 21 on a front face (pixel formation surface) FA of an imaging element 20. A mold part 30 is formed around the imaging element 20 other than on the front face FA. Rewiring layers 41b, 42b, and 43b that connect an external terminal and a pad 23 provided in the rewiring region 22 are formed via insulating layers 41a, 42a, and 43a on a side of the pixel formation surface of the imaging element 20 and the mold part 30. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device 10 is also on the side of the pixel formation surface, and reduction in size and height can be achieved.

A printed wiring board includes a base insulating layer, a conductor layer including first and second pads, a solder resist layer covering the conductor layer and having first opening exposing the first pad and second opening exposing the second pad, a first bump including base plating layer in the first opening and top plating layer on the first base layer, and a second bump including base plating layer in the second opening and top plating layer on the base layer. The second opening has smaller diameter than the first opening, and the second bump has smaller diameter than the first bump. The first base layer has flat upper surface or first recess having depth of 20 μm or less in upper central portion. The second base layer has flat upper surface, raised portion in upper central portion, or second recess shallower than the first recess in the upper central portion.

An embodiment includes generating a sense signal that represents a first vibration of a platform, and reducing a level of the first vibration by generating, in response to the sense signal, a second vibration in the platform. For example, a sensor generates a sense signal representing a first vibration induced (e.g., a shock-induced vibration) in the platform. And a vibration-cancel circuit reduces or eliminates a level of the first vibration in response to the sense signal. For example, the vibration-cancel circuit reduces a magnitude of a first vibration induced in a platform, or eliminates the first vibration altogether, by generating, in the platform, a second vibration having a magnitude approximately equal to the magnitude of the first vibration and having a phase approximately opposite to the phase of the first vibration. That is, the second vibration cancels the first vibration to reduce the net vibration that the platform experiences.

The present disclosure provides a multilayer wiring structure, including a plurality of dielectric layers, a plurality of conductive wiring layers interleaved with the plurality of dielectric layers, wherein the plurality of conductive wiring layers includes copper-phosphorous alloys (such as Cu.sub.3P).

A component carrier includes a stack having at least one electrically conductive layer structure and at least one electrically insulating layer structure; a barrier structure; and a component. The component has at least one pad embedded in the stack and/or in the barrier structure. At least a portion of one of the electrically conductive layer structure and the at least one pad includes copper in contact with the barrier structure.

Disclosed herein is an electronic component that includes a first conductive layer including a lower electrode and a first inductor pattern, a dielectric film that covers the lower electrode, an upper electrode laminated on the lower electrode through the dielectric film, an insulating layer that covers the first conductive layer, dielectric film, and upper electrode, and a second conductive layer formed on the insulating layer and including a second inductor pattern. The first and second inductor patterns are connected in parallel through via conductors penetrating the insulating layer.

A printed wiring board includes a conductor layer, an outermost resin insulating layer having a first surface and a second surface on the opposite side with respect to the first surface and laminated on the conductor layer such that the second surface faces the conductor layer, and metal posts formed in the outermost resin insulating layer such that the metal posts are penetrating through the outermost resin insulating layer and reaching the conductor layer. The metal posts include first metal posts and second metal posts such that each of the first metal posts has a first upper surface positioned above the first surface of the outermost resin insulating layer and having an entirely flat surface and that each of the second metal posts has a second upper surface positioned above the first surface of the outermost resin insulating layer and having a partly flat surface.